MSP430F5510CY - 25MHz 16-Bit MCU with 32KB Flash | TI
部品番号: MSP430F5510CY ✓ 生産中MSP430F5510CY 概要
A mixed-signal microcontroller is an integrated circuit that combines a programmable digital controller with analog measurement or comparison functions. In the product hierarchy, the MSP430F5510 belongs to the MSP430 mixed-signal microcontroller family, which is a type of 16-bit embedded processor and system-on-chip. Its combination of low-power-oriented control, serial interfaces, USB connectivity, and analog peripherals allows sensing and control tasks to be consolidated in compact embedded systems.
The principal verified specifications are a 25 MHz maximum clock, 32KB Flash organized as 32K x 8, 4KB SRAM, and a 10-bit ADC. The device also provides a comparator, DMA controller, UART, SPI, I2C, USB interface, and hardware multiplier. These resources support applications that require periodic analog sampling, event-driven data transfer, low-rate communication, or multiplication-intensive control without requiring a separate analog front end for every function.
The MSP430F5510 uses the MSP430 CPUXV2 architecture and belongs to the MSP430F5xx mixed-signal family. DMA can move data independently of the CPU, while the hardware multiplier accelerates multiplication tasks. The parallel availability of UART, SPI, and I2C permits a designer to connect sensors, displays, storage devices, and other embedded modules while retaining USB for a host-oriented interface. Exact ADC timing, USB details, clock configuration, and electrical limits should be confirmed in the manufacturer datasheet before final design release.
Typical uses include industrial sensor nodes, compact USB-connected data collectors, building and equipment controls, low-power monitoring equipment, and mixed-signal instruments. In an analog-monitoring design, the 10-bit ADC can acquire sensor signals while the comparator handles threshold events and DMA transfers results into SRAM. UART, SPI, or I2C can then connect the controller to local peripherals, while USB provides a higher-level connection when required.
The most important design consideration for the MSP430F5510CY is that CY is a die-sale device rather than a finished, pin-defined package. Its footprint, assembly process, bonding method, die orientation, and exposed features therefore require direct coordination with the assembly provider. Engineers must also verify clock, memory, USB, analog, and power requirements against the MSP430F5510 datasheet and validate the assembled board before production.
This page consolidates the verified manufacturer specifications, current distributor pricing reference, die-sale packaging information, application guidance, and the documented absence of a confirmed drop-in replacement. It also distinguishes verified facts from package-specific information that cannot be inferred from the bare-die ordering code.
ドロップイン代替品: MSP430F5510CY — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストMSP430F5510CY 最大定格＆電気的特性
| Product Type | Mixed-signal microcontroller |
| CPU Architecture | MSP430 CPUXV2 |
| 最大クロック周波数 | 25 MHz |
| CPU Word Size | 16 bit |
| Flash Memory | 32KB (32K x 8) |
| SRAM | 4KB |
| ADC Resolution | 10 bit |
| ADC Count | 1 |
| Comparator Count | 1 |
| Direct Memory Access | Available |
| UART Interface | Available |
| SPI Interface | Available |
| I2C Interface | Available |
| USB Interface | Available |
| Hardware Multiplier | Available |
| Device Form | Die sale |
| Package Code | DIE |
| 実装タイプ | No lead |
| Nominal Supply Voltage | 3 V |
MSP430F5510CY die ピン配置ガイド
MSP430F5510CY (die パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MSP430F5510CY.
詳細は データシート をご参照ください。
主な用途
MSP430F5510CY の用途: 6 件s: Industrial Sensor Node, USB Data Acquisition Module, Equipment Control Panel, Battery-Powered Monitoring Device, Building Automation Controller, Portable Diagnostic Instrument.
Industrial Sensor Node
The MSP430F5510CY fits an industrial sensor node that must acquire analog measurements while managing local communications. Its 10-bit ADC and comparator provide measurement and threshold functions, while the 25 MHz MSP430 CPUXV2 core supports the control logic. DMA can move captured data into the 4KB SRAM with reduced processor intervention, and UART, SPI, or I2C can connect sensors and local actuators. USB provides an optional host-facing path. Because MSP430F5510CY is a die, the design must establish a controlled bonding and assembly process before deployment.
USB Data Acquisition Module
The MSP430F5510CY is appropriate for a compact USB-connected data acquisition module that combines sensing and control in one device. The integrated 10-bit ADC can sample analog inputs, DMA can transfer sampled data efficiently, and the hardware multiplier supports signal-processing or calibration calculations. With 32KB of Flash and 4KB of SRAM, the device provides dedicated firmware and working-memory space without an external microcontroller. The integration reduces board area, although production users must validate bare-die assembly, USB electrical behavior, and environmental reliability.
Equipment Control Panel
An equipment control panel can use the MSP430F5510CY to combine button or sensor inputs, status indication, and communications in one controller. The comparator can detect threshold or digital events, UART and I2C can connect human-interface or sensor modules, and SPI can support higher-bandwidth peripherals. The 25 MHz clock provides headroom for deterministic control tasks, while DMA reduces repetitive data-movement overhead. For a compact panel assembled at volume, the die format can avoid package bulk, but pad definitions and bonding reliability must be proven before launch.
Battery-Powered Monitoring Device
The MSP430F5510CY suits a battery-powered environmental monitor when analog measurement and low-power control are required. The comparator can support threshold-based wake-up decisions, the 10-bit ADC can read analog sensors, and the hardware multiplier can accelerate calibration or filtering calculations. The 4KB SRAM supports local buffering, while UART, SPI, I2C, and USB provide migration paths for different communications requirements. The 3 V nominal supply aligns the device with many portable systems, although battery life must be evaluated using the manufacturer’s sleep and active-current data.
Building Automation Controller
The MSP430F5510CY can serve as a local building-automation controller for monitoring inputs and coordinating field equipment. Its comparator and 10-bit ADC support mixed digital and analog sensing, while DMA and the 25 MHz processor allow periodic acquisition without making the CPU the sole data-mover. UART, SPI, and I2C permit connection to sensors, communications transceivers, and actuators, while USB can simplify local configuration or diagnostics. The die package may reduce board area in high-volume assemblies, but qualification must include thermal cycling and assembly-yield testing.
Portable Diagnostic Instrument
A portable diagnostic instrument can use the MSP430F5510CY to combine sensor acquisition, threshold detection, local processing, and a host connection. The 10-bit ADC handles analog measurements, the comparator identifies limit events, and the hardware multiplier supports calibration or signal calculations. Its 32KB Flash accommodates embedded firmware, while 4KB SRAM provides a working buffer for active measurements. USB can provide a direct connection to a computer, and SPI or I2C can support displays and memory. Bare-die assembly requirements make footprint planning and test coverage especially important.
エンジニアリング参考データ: MSP430F5510CY — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Package | Die sale (DIE) |
| Brand | Texas Instruments |
| Maximum Clock Frequency | 25 MHz |
| CPU Word Size | 16 bit |
| Flash Memory | 32KB (32K x 8) |
| SRAM | 4KB |
| ADC Resolution | 10 bit |
| Communications | UART, SPI, I2C, and USB |
| Device Form | Bare die |
| Verified Price | $2.1232 as of 2026-10-28 |
設計ノート
Do not assign the pinout of a packaged MSP430F5510 to MSP430F5510CY. The verified ordering information identifies CY as a die sale, and no public CY pinout or bonding pattern was supplied. Define the die orientation, pad map, assembly process, and test points with the bonding or assembly partner before schematic capture and PCB layout are released.
Use the manufacturer datasheet to determine supply limits, decoupling, startup behavior, and current consumption for every operating mode. The verified distributor data gives a nominal supply voltage of 3 V, but it does not establish the complete operating range or USB transceiver requirements. A conservative power design should reserve suitable input and output decoupling and separately validate the rails needed by the USB interface.
Plan the analog and digital return paths around the ADC and comparator inputs before committing the bare-die bonding layout. Keep sensitive analog traces short and away from USB and switching-node paths, provide a stable reference and supply plane, and follow the datasheet layout guidance for external components. Because assembly geometry is customer-specific, involve the assembly provider during layout rather than after artwork release.
コンプライアンス情報
The supplied verified data does not explicitly state the MSP430F5510CY RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.
