MSP430FR5994IRGZR - 16MHz 256KB FRAM MCU | TI | Low Power
部品番号: MSP430FR5994IRGZR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.95 | $4.95 |
| 10 | $4.45 | $44.50 |
| 100 | $3.85 | $385.00 |
| 500 | $3.45 | $1,725.00 |
| 1,000 | $3.1 | $3,100.00 |
MSP430FR5994IRGZR 概要
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest layer of the embedded-systems hierarchy: semiconductor -> microcontroller -> embedded system. The MSP430FR5994 belongs to the MSP430 FRAM family of ultra-low-power mixed-signal microcontrollers, where ferroelectric RAM replaces flash to combine non-volatility with fast, low-energy writes.
Key differentiating features include FRAM unified memory with 256KB capacity that writes up to 100x faster than flash with far lower energy per byte, the LEA coprocessor delivering up to 40x the DSP performance of Arm Cortex-M0+ cores for FFT, FIR, and matrix operations without requiring DSP expertise, hardware AES encryption, a 12-bit ADC, analog comparators, DMA, and UART/SPI/I2C serial interfaces plus multiple timers.
Technically, the FRAM architecture eliminates the erase-before-write penalty of flash, enabling true infinite-endurance data logging and instant software updates. The CPUXV2 16-bit RISC core emphasizes low active power, making the family suitable for battery-powered sensing where every microamp matters. The LEA offloads vector math from the CPU, cutting both execution time and energy per operation in edge signal-processing workloads.
Typical applications include portable medical monitoring, industrial sensor nodes, battery-powered metering, and edge signal-conditioning systems that perform FFT or filtering on-chip. The combination of large non-volatile memory and a math accelerator fits data-logging and vibration-sensing designs particularly well.
Design consideration: FRAM memory write operations are fast, but code must account for wait states at higher frequencies; use TI's driver library and the MSP430FR599x family datasheet for timing details.
This page synthesizes distributor availability, family drop-in alternatives, and practical design guidance not found in a single manufacturer datasheet.
ドロップイン代替品: MSP430FR5994IRGZR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
MSP430FR59941IRGZR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MSP430FR5992IRGZR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MSP430FR5964IRGZR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MSP430FR5994IRGZR 最大定格＆電気的特性
| Core | MSP430 CPUXV2 16-bit RISC |
| 最大クロック周波数 | 16 MHz |
| Program Memory Size | 256 KB FRAM |
| SRAM Size | 8 KB |
| データバス幅 | 16 bit |
| ADC Resolution | 12 bit |
| Hardware Accelerator | Low-Energy Accelerator (LEA) for DSP |
| Security Feature | AES accelerator |
| Communication Interfaces | UART, SPI, I2C |
| Peripherals | Comparator, DMA, Timers |
| パッケージ | 48-VQFN (7x7 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (I grade, industrial) |
| Series | MSP430FR599x |
MSP430FR5994IRGZR 48-vqfn (7x7 mm) ピン配置ガイド
MSP430FR5994IRGZR (48-vqfn (7x7 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MSP430FR5994IRGZR.
詳細は データシート をご参照ください。
主な用途
MSP430FR5994IRGZR の用途: 6 件s: Battery-Powered Vibration and Condition Monitoring, Portable Medical Monitoring Devices, Smart Metering and Data Logging, Industrial Sensor Nodes and IoT Edge Devices, Low-Power Audio and Acoustic Sensing, Handheld Test and Measurement Instruments.
Battery-Powered Vibration and Condition Monitoring
The MSP430FR5994IRGZR fits vibration and machine-health sensor nodes because its LEA accelerator executes FFT and FIR filtering at up to 40x the throughput of an Arm Cortex-M0+, per TI, letting the 16 MHz MSP430 core sleep while math completes. The 256KB FRAM stores both firmware and logged samples with near-zero write energy, avoiding flash erase cycles that waste battery budget in duty-cycled nodes. Typical designs sample the 12-bit ADC in bursts, stream data to LEA for spectral analysis, and transmit only computed features, minimizing radio-on time. Trade-off: the 16-bit CPU is slower than a 32-bit Cortex-M4 for general code, so keep control logic lean and delegate all vector math to LEA for best energy per sample.
おすすめ
Portable Medical Monitoring Devices
Wearable and portable medical instruments benefit from the MSP430FR5994IRGZR's ultra-low-power MSP430 architecture, 256KB FRAM for secure patient data logging, and hardware AES for data protection. The 12-bit ADC digitizes biopotential or temperature channels directly, while LEA performs baseline filtering and feature extraction locally, reducing transmission of raw sensitive data. FRAM's instant non-volatile writes preserve event logs through battery replacement without capacitive ride-through circuits. The industrial -40C to +85C operating range suits sterilization-adjacent environments. Design consideration: medical designs must budget the 16 MHz CPU carefully; offload all DSP to LEA and validate interrupt latency against the application's real-time acquisition windows using TI's EnergyTrace profiling on the MSP-EXP430FR5994 LaunchPad.
おすすめ
Smart Metering and Data Logging
Electricity, water, and gas meters require decades of battery life, tamper-resistant data storage, and frequent measurement capture, all strengths of the MSP430FR5994IRGZR. Its FRAM writes consume far less energy per byte than flash and have effectively unlimited endurance, so interval-load data can be recorded every few seconds for the meter's lifetime without memory wear-out. The 256KB capacity holds both the application firmware and years of compressed load profiles. Hardware AES supports authenticated firmware updates required by metering security standards. UART/SPI/I2C interfaces connect to communication modules, and DMA moves ADC samples without CPU intervention, keeping average current low during continuous metering operation.
おすすめ
Industrial Sensor Nodes and IoT Edge Devices
Factory IoT nodes need local signal conditioning before data reaches the cloud, and the MSP430FR5994IRGZR serves this edge role with its LEA DSP accelerator performing FFT, correlation, and matrix operations on-chip. TI states LEA delivers up to 40x Cortex-M0+ DSP performance, enabling feature extraction such as spectral signatures without hosting raw data offsite. UART, SPI, and I2C link the MCU to radio modules, industrial sensors, and actuators, while DMA buffers streams during radio duty cycling. The 48-VQFN 7x7 mm package fits compact node PCBs. The 256KB FRAM supports field firmware updates and stored calibration tables that survive power interruptions instantly, a practical advantage over flash-based nodes during Brown-out events.
おすすめ
Low-Power Audio and Acoustic Sensing
Acoustic event detection, leak detection, and simple audio analytics run well on the MSP430FR5994IRGZR because LEA executes the FIR filters and FFTs central to these workloads while the CPU remains in low-power modes. The 12-bit ADC samples microphone front ends directly for moderate-resolution applications, and 256KB FRAM buffers acoustic segments for burst processing or stores acoustic signature templates locally for always-on classification without radio transmission. This reduces system power compared with streaming raw audio. Design consideration: the 16 MHz CPU and 12-bit ADC suit detection and feature-extraction tasks rather than high-fidelity audio capture; use an external codec or higher-resolution ADC when signal quality requirements exceed 12-bit.
おすすめ
Handheld Test and Measurement Instruments
Portable meters, gauges, and handheld analyzers benefit from the MSP430FR5994IRGZR's combination of long battery life, instant-on FRAM, and local DSP capability. Configuration settings, calibration constants, and logged results save to FRAM the instant they change, with no erase latency when the user powers the instrument off, improving field usability. LEA accelerates averaging, windowing, and transform computations for measurement display. UART/SPI/I2C connect to displays, front-end converters, and PC interfaces, while AES hardware protects calibration data from cloning in commercial products. The industrial temperature grade covers workshop and field conditions. The 48-VQFN package requires reflow assembly, so prototype using TI's LaunchPad before committing to custom PCBs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MSP430FR5994IRGZR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MSP430FR59941IRGZR | MSP430FR5992IRGZR | MSP430FR5964IRGZR |
|---|---|---|---|---|
| Package | 48-VQFN (7x7 mm) | 48-VQFN (RGZ) - same | 48-VQFN (RGZ) - same | 48-VQFN (RGZ) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core / Frequency | MSP430 CPUXV2, 16 MHz | MSP430 CPUXV2, 16 MHz | MSP430 CPUXV2, 16 MHz | MSP430 CPUXV2, 16 MHz |
| FRAM Memory | 256 KB | 512 KB | 256 KB | 256 KB |
| SRAM | 8 KB | 8 KB | 4 KB | 8 KB |
| LEA DSP Accelerator | Yes | Yes | Yes | No |
| AES Hardware | Yes | Yes | Yes | Yes |
| ADC | 12-bit | 12-bit | 12-bit | 12-bit |
主な差別化要因
- LEA DSP accelerator included （vs MSP430FR5964IRGZR)
- Cost-optimized 256KB FRAM sizing （vs MSP430FR59941IRGZR)
- Full 8KB SRAM for LEA buffers （vs MSP430FR5992IRGZR)
設計ノート
The 48-VQFN 7x7 mm package has a 0.5 mm pitch and a central thermal pad that must be soldered to a grounded copper pour for both mechanical reliability and heat dissipation. Follow TI's QFN layout guidelines: use via arrays (typically 4x4 or larger) under the pad connected to the ground plane, keep the VQFN lead footprint per the datasheet land-pattern dimensions, and place 100 nF decoupling capacitors within 2 mm of each DVCC/AVCC pin pair. Pin 1 is identified by the package dot; verify orientation before stencil design.
MSP430FR599x devices support multiple power modes (LPM0-LPM4.5); the lowest-energy designs gate clocks aggressively and use LPM3 between samples. Estimated: at 16 MHz active operation the core draws on the order of hundreds of microamps per MHz-class figures per the family user's guide, so average system current is dominated by sensor front-end and radio duty cycle, not the MCU, in well-designed LPM3-heavy firmware. Use TI EnergyTrace on the MSP-EXP430FR5994 LaunchPad to profile real consumption before finalizing the battery budget.
Three frequent issues on FR599x designs: (1) FRAM wait states - code executing from FRAM above certain frequencies incurs wait states; consult the user's guide for the exact frequency thresholds and consider copying hot routines to SRAM. (2) LEA requires data in specific memory regions - buffers must be allocated in LEA-accessible RAM segments; use the TI LEA library allocation APIs rather than arbitrary linker placement. (3) Pin muxing on the 48-VQFN is heavily shared - run TI SYSCONFIG/PinMux before layout to detect conflicts between ADC, SPI, and timer functions.
コンプライアンス情報
Compliance status for the orderable part number must be confirmed on the TI product detail page; the provided web data did not include explicit RoHS/REACH certificates.
