MSP430FR5994IRGZR - 16MHz 256KB FRAM MCU | TI | Low Power
부품 번호: MSP430FR5994IRGZR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.95 | $4.95 |
| 10 | $4.45 | $44.50 |
| 100 | $3.85 | $385.00 |
| 500 | $3.45 | $1,725.00 |
| 1,000 | $3.1 | $3,100.00 |
MSP430FR5994IRGZR 개요
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest layer of the embedded-systems hierarchy: semiconductor -> microcontroller -> embedded system. The MSP430FR5994 belongs to the MSP430 FRAM family of ultra-low-power mixed-signal microcontrollers, where ferroelectric RAM replaces flash to combine non-volatility with fast, low-energy writes.
Key differentiating features include FRAM unified memory with 256KB capacity that writes up to 100x faster than flash with far lower energy per byte, the LEA coprocessor delivering up to 40x the DSP performance of Arm Cortex-M0+ cores for FFT, FIR, and matrix operations without requiring DSP expertise, hardware AES encryption, a 12-bit ADC, analog comparators, DMA, and UART/SPI/I2C serial interfaces plus multiple timers.
Technically, the FRAM architecture eliminates the erase-before-write penalty of flash, enabling true infinite-endurance data logging and instant software updates. The CPUXV2 16-bit RISC core emphasizes low active power, making the family suitable for battery-powered sensing where every microamp matters. The LEA offloads vector math from the CPU, cutting both execution time and energy per operation in edge signal-processing workloads.
Typical applications include portable medical monitoring, industrial sensor nodes, battery-powered metering, and edge signal-conditioning systems that perform FFT or filtering on-chip. The combination of large non-volatile memory and a math accelerator fits data-logging and vibration-sensing designs particularly well.
Design consideration: FRAM memory write operations are fast, but code must account for wait states at higher frequencies; use TI's driver library and the MSP430FR599x family datasheet for timing details.
This page synthesizes distributor availability, family drop-in alternatives, and practical design guidance not found in a single manufacturer datasheet.
드롭인 대체품: MSP430FR5994IRGZR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MSP430FR59941IRGZR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSP430FR5992IRGZR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSP430FR5964IRGZR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MSP430FR5994IRGZR 최대 정격 & 전기적 특성
| Core | MSP430 CPUXV2 16-bit RISC |
| 최대 클록 주파수 | 16 MHz |
| Program Memory Size | 256 KB FRAM |
| SRAM Size | 8 KB |
| 데이터 버스 폭 | 16 bit |
| ADC Resolution | 12 bit |
| Hardware Accelerator | Low-Energy Accelerator (LEA) for DSP |
| Security Feature | AES accelerator |
| Communication Interfaces | UART, SPI, I2C |
| Peripherals | Comparator, DMA, Timers |
| 패키지 | 48-VQFN (7x7 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (I grade, industrial) |
| Series | MSP430FR599x |
MSP430FR5994IRGZR 48-vqfn (7x7 mm) 핀 구성 가이드
MSP430FR5994IRGZR(48-vqfn (7x7 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MSP430FR5994IRGZR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MSP430FR5994IRGZR 적합 용도: 6 애플리케이션s: Battery-Powered Vibration and Condition Monitoring, Portable Medical Monitoring Devices, Smart Metering and Data Logging, Industrial Sensor Nodes and IoT Edge Devices, Low-Power Audio and Acoustic Sensing, Handheld Test and Measurement Instruments.
Battery-Powered Vibration and Condition Monitoring
The MSP430FR5994IRGZR fits vibration and machine-health sensor nodes because its LEA accelerator executes FFT and FIR filtering at up to 40x the throughput of an Arm Cortex-M0+, per TI, letting the 16 MHz MSP430 core sleep while math completes. The 256KB FRAM stores both firmware and logged samples with near-zero write energy, avoiding flash erase cycles that waste battery budget in duty-cycled nodes. Typical designs sample the 12-bit ADC in bursts, stream data to LEA for spectral analysis, and transmit only computed features, minimizing radio-on time. Trade-off: the 16-bit CPU is slower than a 32-bit Cortex-M4 for general code, so keep control logic lean and delegate all vector math to LEA for best energy per sample.
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Portable Medical Monitoring Devices
Wearable and portable medical instruments benefit from the MSP430FR5994IRGZR's ultra-low-power MSP430 architecture, 256KB FRAM for secure patient data logging, and hardware AES for data protection. The 12-bit ADC digitizes biopotential or temperature channels directly, while LEA performs baseline filtering and feature extraction locally, reducing transmission of raw sensitive data. FRAM's instant non-volatile writes preserve event logs through battery replacement without capacitive ride-through circuits. The industrial -40C to +85C operating range suits sterilization-adjacent environments. Design consideration: medical designs must budget the 16 MHz CPU carefully; offload all DSP to LEA and validate interrupt latency against the application's real-time acquisition windows using TI's EnergyTrace profiling on the MSP-EXP430FR5994 LaunchPad.
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Smart Metering and Data Logging
Electricity, water, and gas meters require decades of battery life, tamper-resistant data storage, and frequent measurement capture, all strengths of the MSP430FR5994IRGZR. Its FRAM writes consume far less energy per byte than flash and have effectively unlimited endurance, so interval-load data can be recorded every few seconds for the meter's lifetime without memory wear-out. The 256KB capacity holds both the application firmware and years of compressed load profiles. Hardware AES supports authenticated firmware updates required by metering security standards. UART/SPI/I2C interfaces connect to communication modules, and DMA moves ADC samples without CPU intervention, keeping average current low during continuous metering operation.
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Industrial Sensor Nodes and IoT Edge Devices
Factory IoT nodes need local signal conditioning before data reaches the cloud, and the MSP430FR5994IRGZR serves this edge role with its LEA DSP accelerator performing FFT, correlation, and matrix operations on-chip. TI states LEA delivers up to 40x Cortex-M0+ DSP performance, enabling feature extraction such as spectral signatures without hosting raw data offsite. UART, SPI, and I2C link the MCU to radio modules, industrial sensors, and actuators, while DMA buffers streams during radio duty cycling. The 48-VQFN 7x7 mm package fits compact node PCBs. The 256KB FRAM supports field firmware updates and stored calibration tables that survive power interruptions instantly, a practical advantage over flash-based nodes during Brown-out events.
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Low-Power Audio and Acoustic Sensing
Acoustic event detection, leak detection, and simple audio analytics run well on the MSP430FR5994IRGZR because LEA executes the FIR filters and FFTs central to these workloads while the CPU remains in low-power modes. The 12-bit ADC samples microphone front ends directly for moderate-resolution applications, and 256KB FRAM buffers acoustic segments for burst processing or stores acoustic signature templates locally for always-on classification without radio transmission. This reduces system power compared with streaming raw audio. Design consideration: the 16 MHz CPU and 12-bit ADC suit detection and feature-extraction tasks rather than high-fidelity audio capture; use an external codec or higher-resolution ADC when signal quality requirements exceed 12-bit.
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Handheld Test and Measurement Instruments
Portable meters, gauges, and handheld analyzers benefit from the MSP430FR5994IRGZR's combination of long battery life, instant-on FRAM, and local DSP capability. Configuration settings, calibration constants, and logged results save to FRAM the instant they change, with no erase latency when the user powers the instrument off, improving field usability. LEA accelerates averaging, windowing, and transform computations for measurement display. UART/SPI/I2C connect to displays, front-end converters, and PC interfaces, while AES hardware protects calibration data from cloning in commercial products. The industrial temperature grade covers workshop and field conditions. The 48-VQFN package requires reflow assembly, so prototype using TI's LaunchPad before committing to custom PCBs.
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추천 제품 요약
엔지니어링 참조 데이터: MSP430FR5994IRGZR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MSP430FR59941IRGZR | MSP430FR5992IRGZR | MSP430FR5964IRGZR |
|---|---|---|---|---|
| Package | 48-VQFN (7x7 mm) | 48-VQFN (RGZ) - same | 48-VQFN (RGZ) - same | 48-VQFN (RGZ) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core / Frequency | MSP430 CPUXV2, 16 MHz | MSP430 CPUXV2, 16 MHz | MSP430 CPUXV2, 16 MHz | MSP430 CPUXV2, 16 MHz |
| FRAM Memory | 256 KB | 512 KB | 256 KB | 256 KB |
| SRAM | 8 KB | 8 KB | 4 KB | 8 KB |
| LEA DSP Accelerator | Yes | Yes | Yes | No |
| AES Hardware | Yes | Yes | Yes | Yes |
| ADC | 12-bit | 12-bit | 12-bit | 12-bit |
주요 차별점
- LEA DSP accelerator included (vs MSP430FR5964IRGZR)
- Cost-optimized 256KB FRAM sizing (vs MSP430FR59941IRGZR)
- Full 8KB SRAM for LEA buffers (vs MSP430FR5992IRGZR)
설계 노트
The 48-VQFN 7x7 mm package has a 0.5 mm pitch and a central thermal pad that must be soldered to a grounded copper pour for both mechanical reliability and heat dissipation. Follow TI's QFN layout guidelines: use via arrays (typically 4x4 or larger) under the pad connected to the ground plane, keep the VQFN lead footprint per the datasheet land-pattern dimensions, and place 100 nF decoupling capacitors within 2 mm of each DVCC/AVCC pin pair. Pin 1 is identified by the package dot; verify orientation before stencil design.
MSP430FR599x devices support multiple power modes (LPM0-LPM4.5); the lowest-energy designs gate clocks aggressively and use LPM3 between samples. Estimated: at 16 MHz active operation the core draws on the order of hundreds of microamps per MHz-class figures per the family user's guide, so average system current is dominated by sensor front-end and radio duty cycle, not the MCU, in well-designed LPM3-heavy firmware. Use TI EnergyTrace on the MSP-EXP430FR5994 LaunchPad to profile real consumption before finalizing the battery budget.
Three frequent issues on FR599x designs: (1) FRAM wait states - code executing from FRAM above certain frequencies incurs wait states; consult the user's guide for the exact frequency thresholds and consider copying hot routines to SRAM. (2) LEA requires data in specific memory regions - buffers must be allocated in LEA-accessible RAM segments; use the TI LEA library allocation APIs rather than arbitrary linker placement. (3) Pin muxing on the 48-VQFN is heavily shared - run TI SYSCONFIG/PinMux before layout to detect conflicts between ADC, SPI, and timer functions.
규정 준수 정보
Compliance status for the orderable part number must be confirmed on the TI product detail page; the provided web data did not include explicit RoHS/REACH certificates.
