MSP430G2553IRHB32R - 16MHz, 16KB Mixed-Signal MCU | TI
部品番号: MSP430G2553IRHB32R ✓ 生産中MSP430G2553IRHB32R 概要
An ultra-low-power microcontroller is a semiconductor controller designed to minimize energy consumption while executing control, measurement, and communications tasks. The MSP430 family belongs to the mixed-signal MCU hierarchy, combining a 16-bit RISC core with analog and digital peripherals. MSP430 devices use multiple low-power operating modes, making them especially useful in battery-powered instrumentation, portable sensing, and embedded industrial products.
The MSP430G2553 operates at up to 16 MHz and provides 16 KB of Flash for program storage plus 512 bytes of SRAM for working memory. Its integrated 10-bit ADC and comparator support analog front ends, while the universal serial communication interface provides UART, SPI, and I2C connectivity. Up to 24 I/O pins can support capacitive-touch functions according to the manufacturer product information.
Power efficiency is central to the device architecture. Verified manufacturer information lists active-mode consumption of 230 μA at 1 MHz and 2.2 V, standby current of 0.5 μA, and off-mode current with RAM retention of 0.1 μA. Five power-saving modes allow firmware to match current consumption to workload, although exact standby time and wake-up behavior should be checked in the datasheet for the selected clock configuration.
Typical uses include compact environmental sensors, industrial condition-monitoring nodes, low-power data loggers, capacitive-touch controls, wearable measurement devices, and embedded communications modules. The combination of 16 MHz processing speed, serial-interface flexibility, and small memory makes the MCU suitable for coordinating sensors and communicating results through UART, SPI, or I2C.
Designers should account for the limited 512-byte SRAM when planning buffers and must place input and output decoupling close to the supply pins. The exposed-pad VQFN package also requires a properly designed thermal and ground layout. Firmware should use the device's low-power modes and avoid blocking delays when battery life is important.
This product data combines manufacturer specifications, distributor availability information, and explicit cross-reference findings. It also distinguishes verified technical parameters from values that still require confirmation, providing a practical basis for schematic design, PCB layout, firmware planning, sourcing, and component selection.
ドロップイン代替品: MSP430G2553IRHB32R — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストMSP430G2553IRHB32R 最大定格＆電気的特性
| Architecture | 16-bit RISC mixed-signal MCU |
| Maximum Clock Speed | 16 MHz |
| Program Memory | 16 KB Flash (16K x 8) |
| RAM | 512 bytes |
| ADC Resolution | 10 bits |
| Analog Comparator | Integrated |
| Serial Interfaces | UART, SPI, and I2C |
| Timers | 16-bit integrated timers |
| I/O Pins | Up to 24 pins |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Active-Mode Current | 230 μA at 1 MHz and 2.2 V |
| Standby Current | 0.5 μA |
| Off-Mode Current | 0.1 μA with RAM retention |
| Power-Saving Modes | 5 modes |
| 動作温度 | -40°C to +85°C |
| パッケージ | 32-pin VQFN (RHB), 5 mm x 5 mm |
| 実装タイプ | Surface Mount |
| Oscillator | Internal oscillator |
| ライフサイクル状態 | Active |
MSP430G2553IRHB32R 32-pin vqfn (rhb), 5 mm x 5 mm ピン配置ガイド
MSP430G2553IRHB32R (32-pin vqfn (rhb), 5 mm x 5 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MSP430G2553IRHB32R.
詳細は データシート をご参照ください。
主な用途
MSP430G2553IRHB32R の用途: 6 件s: Portable Environmental Sensor, Industrial Condition-Monitoring Node, Capacitive-Touch Control Panel, Battery-Powered Data Logger, Serial Communications Controller, Low-Power Embedded Control Module.
Portable Environmental Sensor
The MSP430G2553IRHB32R fits compact environmental sensors that combine analog measurement with low-power serial reporting. Its 10-bit ADC and integrated comparator can sample or supervise sensor signals, while UART, SPI, or I2C connectivity supports a host or local data logger. The 16 MHz CPU and 16 KB Flash provide control logic without requiring a separate processor. For battery operation, firmware can use the verified standby and RAM-retention modes to reduce consumption between measurements. The principal design constraint is the 512-byte SRAM, which favors compact buffering and carefully sized data structures.
Industrial Condition-Monitoring Node
The MSP430G2553IRHB32R is suitable for industrial condition-monitoring equipment operating across its specified -40°C to +85°C range. The integrated comparator can provide a fast threshold or fault-detection path, while the 10-bit ADC supports slower analog measurements. A 16-bit control core at up to 16 MHz can coordinate sampling, filtering, and communications within a small embedded controller. Its 16 KB Flash and 512 bytes of SRAM are adequate for focused firmware, although larger local histories should be stored externally through SPI or I2C rather than consuming scarce internal RAM.
Capacitive-Touch Control Panel
The MSP430G2553IRHB32R can serve as the controller for a compact capacitive-touch interface because the verified manufacturer information identifies up to 24 I/O pins with capacitive-touch capability. Its mixed-signal peripherals allow touch measurement and system monitoring to share one device. The 16 MHz processing rate supports responsive debouncing and user-interface logic, while UART, SPI, and I2C permit connection to a display or system controller. Designers should use the manufacturer pin and touch-scanning guidance, maintain short sensitive traces, and account for only 512 bytes of SRAM when scheduling scans and communications.
Battery-Powered Data Logger
The MSP430G2553IRHB32R is appropriate for a low-duty-cycle data logger that periodically wakes, records measurements, and returns to standby. Its verified active-mode current is 230 μA at 1 MHz and 2.2 V, standby current is 0.5 μA, and off-mode current with RAM retention is 0.1 μA. These figures make duty-cycle control central to battery-life optimization. With only 512 bytes of SRAM, the firmware should process and transmit samples incrementally, while the 16 KB Flash provides room for firmware and compact configuration data rather than extensive sample histories.
Serial Communications Controller
The MSP430G2553IRHB32R works well as a dedicated communications controller because its universal serial communication interface supports UART, SPI, and I2C. At up to 16 MHz, the MCU can frame packets, manage a low-power sensor bus, and respond to host commands while maintaining a compact footprint. The 512-byte SRAM may be sufficient for protocol state and short message buffers, but larger frame buffers require careful allocation. Board-level design should keep serial traces away from noisy analog paths, provide continuous ground references, and validate signal levels against each connected peripheral.
Low-Power Embedded Control Module
The MSP430G2553IRHB32R fits low-power embedded control modules that need local decisions without a higher-power processor. Its 16-bit RISC core, 16 KB Flash, 512-byte SRAM, timers, comparator, and analog converter provide a compact combination of control and measurement functions. Five power-saving modes allow the module to balance response time against consumption, while multiple serial interfaces support downstream sensors or actuators. The 32-pin VQFN reduces board area, but its exposed pad and compact pin pitch require careful land-pattern, thermal, and assembly planning based on the official package drawing.
エンジニアリング参考データ: MSP430G2553IRHB32R — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MSP430F5212IRGZR | MSP430F1122IRHBR | MSP430F2101TRGET |
|---|---|---|---|---|
| Package | 32-pin VQFN (RHB), 5 mm x 5 mm | RZG package; not verified as the same footprint | RHB package; pin compatibility not verified | TGET package; not verified as the same footprint |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
主な差別化要因
- Mixed-signal integration in a compact package （vs MSP430F1122IRHBR)
- Defined industrial-temperature ordering option （vs MSP430F2101TRGET)
- Three communication protocol choices from one MCU （vs MSP430F5212IRGZR)
設計ノート
Design the firmware around the five low-power modes rather than treating the 230 μA active-mode figure as a continuous-load requirement. According to the manufacturer documentation, standby current is 0.5 μA and off-mode current with RAM retention is 0.1 μA. Measure the complete sleep-and-wake cycle because oscillator startup, ADC warm-up, and peripheral settling can dominate a short measurement interval. Confirm the exact clock and divider configuration against the Texas Instruments datasheet before finalizing battery-life calculations.
Place all decoupling capacitors immediately beside the corresponding supply and ground pins, with the shortest possible current-loop path. Follow the official RHB land pattern and exposed-pad requirements rather than creating a generic QFN-32 footprint from dimension memory. The exposed pad should be connected according to the datasheet land-pattern guidance and provide both electrical and thermal paths. Validate assembly clearances, stencil aperture recommendations, and the manufacturer reflow profile before releasing the PCB.
Do not assume that every MSP430-family device is a drop-in replacement for the MSP430G2553. The supplied cross-reference excerpts identify several same-family candidates, but they do not verify identical pin multiplexing, memory sizes, analog channels, or package construction. Use the Texas Instruments device-comparison tables and complete pin descriptions for each candidate. A PCB change or firmware port is required when peripheral assignment, package pinout, voltage range, or memory architecture differs.
コンプライアンス情報
The verified product information establishes an industrial -40°C to +85°C ordering option and active lifecycle status, but the supplied excerpts do not explicitly state RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification status.
