P1013NSN2LFB - QorIQ P1 1-Core 1GHz PowerPC MPU | NXP | TEPBGA-689
部品番号: P1013NSN2LFB ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $78.4 | $78.40 |
| 10 | $70.55 | $705.50 |
| 100 | $62.1 | $6,210.00 |
| 500 | $56.85 | $28,425.00 |
| 1,000 | $53.2 | $53,200.00 |
P1013NSN2LFB 概要
A microprocessor (MPU) is an integrated circuit that contains one or more central processing units, cache memory, and on-chip peripherals in a single package. The QorIQ P1 family targets cost-sensitive networking, industrial HMI, and single-board computing applications where deterministic performance, multi-protocol I/O, and long-life-cycle support matter more than raw clock speed. Within NXP's product hierarchy, the P1 sits below the dual-core P1022 and above the lower-frequency P1010/P1011 variants.
Key features include three Gigabit Ethernet controllers with IEEE 1588 timestamping support, two PCIe Gen 1/2 lanes for ASIC/FPGA co-processing, a 32-bit DDR2/DDR3 memory controller with ECC for reliability-critical firmware, dedicated security acceleration (SEC 4.x with DES/3DES/AES/SHA/RSA), and integrated LCD controller for human-machine interface panels. The device supports boot from NAND/NOR flash, SPI EEPROM, and SD/MMC, simplifying secure firmware bring-up.
Architecturally, the P1013NSN2LFB combines the e500v2 integer/floating-point pipeline with a 256 KB L2 cache, an on-chip core complex bus, and a platform-side enhanced local bus plus serialized I/O. The memory controller drives DDR2/DDR3 at up to 800 MT/s with ECC scrubbing, and the SerDes block multiplexes PCIe, SGMII, and SATA interfaces.
Typical applications include industrial routers and gateways, factory-floor protocol converters, single-board computers for HMI, multi-protocol serial concentrators, and secure network-attached appliances. The wide peripheral mix makes the P1 well suited as a system-on-chip in cost-optimized embedded designs where a Linux or RTOS stack is acceptable.
Design consideration: routing the 689-ball TEPBGA II requires a 6+ layer PCB with matched-length SerDes traces; engineers should reference the NXP hardware design guide for DDR3 topology and the PCIe/SGMIB reference impedances. Industrial applications benefit from the 0 to 105 °C operating range without needing the -40 to +125 °C 'Extended' grade.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
ドロップイン代替品: P1013NSN2LFB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: P1013NSN2LFB （同一形状・フットプリント） — 相違点: L2 Cache, Memory Controller, USB, Package, Core Architecture.
クイック比較ツール — 並列比較する代替部品を選択:
P1013NXN2LFB
✅ ドロップイン✓ 在庫あり
$32.85 / 個
データシートを見る →P1013NSN2LFB
✅ ドロップイン✓ 在庫あり
$53.2 / 個
データシートを見る →P1011NXN2HFB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P1014NSN2LFB
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
P1022NSN2LHB
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
P1013NSN2LFB 最大定格＆電気的特性
| Core Architecture | PowerPC e500v2 (single core) |
| Core Count | 1 |
| データバス幅 | 32-bit |
| Maximum Core Frequency | 1067 MHz |
| 動作温度範囲 | 0 °C to +105 °C |
| パッケージ | 689-TEPBGA II (31x31 mm) |
| 実装タイプ | Surface Mount (BGA) |
| Memory Controller | DDR2/DDR3 with ECC, up to 800 MT/s |
| Ethernet MACs | 3 x 10/100/1000 Mb/s (1 RGMII + 2 SGMII) |
| PCIe Controllers | 2 x PCIe Gen 1/2 |
| USB | USB 2.0 (Host + Device) |
| Display Interface | Integrated LCD controller |
| Security Engine | SEC 4.x (DES/3DES/AES/SHA/RSA) |
| L2 Cache | 256 KB |
| Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| RoHS ステータス | Compliant |
| Silicon Revision | Rev 2.1 |
P1013NSN2LFB 689-tepbga ii (31x31 mm) ピン配置ガイド
P1013NSN2LFB (689-tepbga ii (31x31 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: P1013NSN2LFB.
詳細は データシート をご参照ください。
主な用途
P1013NSN2LFB の用途: 6 件s: Industrial Router and Gateway, Human-Machine Interface (HMI) Panel, Protocol Converter / Serial Concentrator, Single-Board Computer (SBC) for Embedded Linux, Network-Attached Storage (NAS) / File Appliance, Secure Network Appliance (Firewall / VPN).
Industrial Router and Gateway
The P1013NSN2LFB fits industrial router/gateway designs because it integrates three Gigabit Ethernet MACs (one RGMII + two SGMII) and dual PCIe lanes directly on-die, eliminating external switch ASICs. At 1067 MHz the e500v2 core can route line-rate IPv4/IPv6 traffic up to ~1 Gbps while running an embedded Linux stack with iptables/Netfilter. Hardware SEC 4.x acceleration offloads IPsec and TLS, and the DDR3-with-ECC controller supports memory scrubbing for long-uptime deployments. Compared to discrete x86 designs, this single-chip solution drops BOM count, simplifies thermal design, and supports the 0 to +105 °C range needed for sealed enclosures.
おすすめ
Human-Machine Interface (HMI) Panel
The P1013NSN2LFB is well-suited for industrial HMI panels because the integrated LCD controller eliminates an external graphics bridge chip, and the e500v2 core runs QT/Embedded or Crank Storyboard at 1067 MHz with sufficient headroom for 800x480 WVGA panels. The 32-bit DDR3 controller feeds the LCD engine without external bus contention, and the triple GbE MACs support redundant uplink for plant-floor networks. Compared to ARM Cortex-A9 HMI SoCs, the P1013 provides stronger deterministic real-time response for PLC protocol stacks (EtherCAT, Modbus TCP). The 689-TEPBGA II package supports the 0 to +105 °C commercial industrial range.
おすすめ
Protocol Converter / Serial Concentrator
In factory-floor protocol converters, the P1013NSN2LFB drives up to eight UART channels through its enhanced local bus plus external bridges, while the e500v2 core runs EtherCAT, PROFINET, or Modbus stacks simultaneously. The hardware SEC 4.x engine secures CIP Security or OPC UA TLS handshakes at line rate. The 256 KB L2 cache keeps protocol state tables in low-latency memory, and the PCIe x1 lanes attach a secondary ASIC for sub-microsecond deterministic I/O. Compared to MCU-only designs, the P1013 handles full Linux preempt-RT with rich networking stacks.
おすすめ
Single-Board Computer (SBC) for Embedded Linux
The P1013NSN2LFB enables a compact single-board computer (SBC) form factor because it integrates CPU, DDR3 controller, three Ethernet MACs, two PCIe lanes, USB 2.0, and an LCD controller in a single 689-TEPBGA II package. With 1067 MHz and 256 KB L2 it boots mainline Linux 5.x/6.x with U-Boot and runs Yocto or Buildroot distros. Compared to discrete CPU + northbridge designs, this SoC approach reduces board layers to 6-layer with 1.0 mm BGA pitch. The 0 to +105 °C range supports fanless SBC enclosures in industrial cabinets.
おすすめ
Network-Attached Storage (NAS) / File Appliance
The P1013NSN2LFB fits entry-level NAS appliances because the hardware SEC 4.x engine accelerates AES-256-XTS for at-rest encryption, the DDR3-with-ECC controller supports RAID scrubbing, and the dual SGMII lanes attach directly to SATA bridges via SerDes for multi-drive bays. At 1067 MHz the e500v2 core sustains ~200 MB/s encrypted SMB/NFS throughput. Compared to ARM Cortex-A NAS SoCs, the P1013's Power Architecture offers stronger ECC support and a longer product-life commitment from NXP for embedded markets.
おすすめ
Secure Network Appliance (Firewall / VPN)
The P1013NSN2LFB is ideal for small-business firewall/VPN appliances because the integrated SEC 4.x engine offloads IPsec ESP, IKE, and TLS at multi-gigabit rates while the e500v2 core runs the control plane (iptables, routing daemon). Three GbE MACs support WAN/LAN/DMZ topology without external switches. DDR3-with-ECC ensures uninterrupted operation under heavy NAT table load, and dual PCIe lanes attach a crypto accelerator card for high-density deployments. The 0 to +105 °C range supports fanless fanless SOHO appliances. Compared to x86 Celeron firewalls, the P1013 cuts BOM by 40%.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: P1013NSN2LFB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | P1013NXN2LFB | P1011NXN2HFB | P1014NSN2LFB | P1022NSN2LHB |
|---|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) | PowerPC e500v2 (2 cores) |
| Maximum Core Frequency | 1067 MHz | 1067 MHz | 800 MHz (-25%) | 1200 MHz (+12%) | 1067 MHz |
| Operating Temperature | 0 to +105 °C | -40 to +125 °C | -40 to +125 °C | 0 to +105 °C | 0 to +105 °C |
| DDR3 Memory Controller | DDR2/DDR3 with ECC, 800 MT/s | Same | Same | Same | Same |
| Gigabit Ethernet MACs | 3 (1 RGMII + 2 SGMII) | 3 (same) | 3 (same) | 3 (same) | 3 (same) |
| PCIe Lanes | 2 x PCIe Gen 1/2 | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
主な差別化要因
- Single-core 1067 MHz with full triple GbE + dual PCIe integration （vs P1011NXN2HFB)
- Last Time Buy status vs active lifecycle of the N suffix （vs P1013NXN2LFB)
- 1.0 mm pitch TEPBGA II vs competing SoCs at 0.8 mm （vs Generic ARM Cortex-A9 SoC)
設計ノート
The 689-ball TEPBGA II at 1.0 mm pitch requires a 6-layer PCB minimum (8-layer recommended) with stacked via-in-pad for the inner-row balls. Use 50 Ω controlled impedance for the SGMII lanes and 85 Ω differential for PCIe; reference NXP application note AN4321 for the SerDes routing reference stackup. Place decoupling capacitors within 100 mils of each power ball, with 1 µF X7R for core and 0.1 µF X7R for I/O rails.
Estimated: At 1067 MHz with Tj max 125 °C and typical 4.5 W core power, the 689-TEPBGA II with θJA of 11 C/W (4-layer JEDEC board, 0 m airflow) rises 50 °C above ambient. In sealed enclosures with no airflow, derate ambient to 75 °C or attach a 4 cm² copper heat spreader bonded via thermal pad. Use the silicon revision 2.1 thermal diode for closed-loop cooling via the SEC thermal monitor block.
SerDes lane placement requires 100 Ω differential reference design with maximum 200 mil skew between P and N traces. Keep SGMII and PCIe away from the DDR3 byte-lane crossings by at least 4x the dielectric thickness (≥12 mil). Use AC-coupled capacitors (0.1 µF 0402) at every SerDes TX output, placed within 250 mil of the BGA ball. Validate with NXP's SerDes Signal Integrity Checklist before tape-out.
Three common pitfalls: (1) omitting the 32 kHz RTC crystal on the RTC_XTAL pins - this prevents wake-from-sleep firmware timers; (2) mixing 1.5 V core and 1.8 V DDR power rails in random order at power-up - the SEC accelerator needs the 1.5 V core rail first per the power sequencing diagram; (3) using the wrong boot configuration word for NAND vs NOR vs SPI - this causes silent boot failures that are difficult to debug without JTAG.
コンプライアンス情報
RoHS and REACH compliance per NXP product page; Pb-free SAC405 ball finish supports JEDEC J-STD-020 reflow. AEC-Q100 is not applicable to communications processors; halogen-free status not declared by NXP for this part number.
