P1013NSN2LFB - QorIQ P1 1-Core 1GHz PowerPC MPU | NXP | TEPBGA-689
부품 번호: P1013NSN2LFB ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.4 | $78.40 |
| 10 | $70.55 | $705.50 |
| 100 | $62.1 | $6,210.00 |
| 500 | $56.85 | $28,425.00 |
| 1,000 | $53.2 | $53,200.00 |
P1013NSN2LFB 개요
A microprocessor (MPU) is an integrated circuit that contains one or more central processing units, cache memory, and on-chip peripherals in a single package. The QorIQ P1 family targets cost-sensitive networking, industrial HMI, and single-board computing applications where deterministic performance, multi-protocol I/O, and long-life-cycle support matter more than raw clock speed. Within NXP's product hierarchy, the P1 sits below the dual-core P1022 and above the lower-frequency P1010/P1011 variants.
Key features include three Gigabit Ethernet controllers with IEEE 1588 timestamping support, two PCIe Gen 1/2 lanes for ASIC/FPGA co-processing, a 32-bit DDR2/DDR3 memory controller with ECC for reliability-critical firmware, dedicated security acceleration (SEC 4.x with DES/3DES/AES/SHA/RSA), and integrated LCD controller for human-machine interface panels. The device supports boot from NAND/NOR flash, SPI EEPROM, and SD/MMC, simplifying secure firmware bring-up.
Architecturally, the P1013NSN2LFB combines the e500v2 integer/floating-point pipeline with a 256 KB L2 cache, an on-chip core complex bus, and a platform-side enhanced local bus plus serialized I/O. The memory controller drives DDR2/DDR3 at up to 800 MT/s with ECC scrubbing, and the SerDes block multiplexes PCIe, SGMII, and SATA interfaces.
Typical applications include industrial routers and gateways, factory-floor protocol converters, single-board computers for HMI, multi-protocol serial concentrators, and secure network-attached appliances. The wide peripheral mix makes the P1 well suited as a system-on-chip in cost-optimized embedded designs where a Linux or RTOS stack is acceptable.
Design consideration: routing the 689-ball TEPBGA II requires a 6+ layer PCB with matched-length SerDes traces; engineers should reference the NXP hardware design guide for DDR3 topology and the PCIe/SGMIB reference impedances. Industrial applications benefit from the 0 to 105 °C operating range without needing the -40 to +125 °C 'Extended' grade.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
드롭인 대체품: P1013NSN2LFB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P1013NSN2LFB (동일 폼 팩터 및 풋프린트) — 차이점: L2 Cache, Memory Controller, USB, Package, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P1013NXN2LFB
✅ 드롭인✓ 재고 있음
$32.85 / 개
데이터시트 보기 →P1013NSN2LFB
✅ 드롭인✓ 재고 있음
$53.2 / 개
데이터시트 보기 →P1011NXN2HFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1014NSN2LFB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P1022NSN2LHB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P1013NSN2LFB 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e500v2 (single core) |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 1067 MHz |
| 동작 온도 범위 | 0 °C to +105 °C |
| 패키지 | 689-TEPBGA II (31x31 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Memory Controller | DDR2/DDR3 with ECC, up to 800 MT/s |
| Ethernet MACs | 3 x 10/100/1000 Mb/s (1 RGMII + 2 SGMII) |
| PCIe Controllers | 2 x PCIe Gen 1/2 |
| USB | USB 2.0 (Host + Device) |
| Display Interface | Integrated LCD controller |
| Security Engine | SEC 4.x (DES/3DES/AES/SHA/RSA) |
| L2 Cache | 256 KB |
| Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| RoHS 상태 | Compliant |
| Silicon Revision | Rev 2.1 |
P1013NSN2LFB 689-tepbga ii (31x31 mm) 핀 구성 가이드
P1013NSN2LFB(689-tepbga ii (31x31 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P1013NSN2LFB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P1013NSN2LFB 적합 용도: 6 애플리케이션s: Industrial Router and Gateway, Human-Machine Interface (HMI) Panel, Protocol Converter / Serial Concentrator, Single-Board Computer (SBC) for Embedded Linux, Network-Attached Storage (NAS) / File Appliance, Secure Network Appliance (Firewall / VPN).
Industrial Router and Gateway
The P1013NSN2LFB fits industrial router/gateway designs because it integrates three Gigabit Ethernet MACs (one RGMII + two SGMII) and dual PCIe lanes directly on-die, eliminating external switch ASICs. At 1067 MHz the e500v2 core can route line-rate IPv4/IPv6 traffic up to ~1 Gbps while running an embedded Linux stack with iptables/Netfilter. Hardware SEC 4.x acceleration offloads IPsec and TLS, and the DDR3-with-ECC controller supports memory scrubbing for long-uptime deployments. Compared to discrete x86 designs, this single-chip solution drops BOM count, simplifies thermal design, and supports the 0 to +105 °C range needed for sealed enclosures.
추천
Human-Machine Interface (HMI) Panel
The P1013NSN2LFB is well-suited for industrial HMI panels because the integrated LCD controller eliminates an external graphics bridge chip, and the e500v2 core runs QT/Embedded or Crank Storyboard at 1067 MHz with sufficient headroom for 800x480 WVGA panels. The 32-bit DDR3 controller feeds the LCD engine without external bus contention, and the triple GbE MACs support redundant uplink for plant-floor networks. Compared to ARM Cortex-A9 HMI SoCs, the P1013 provides stronger deterministic real-time response for PLC protocol stacks (EtherCAT, Modbus TCP). The 689-TEPBGA II package supports the 0 to +105 °C commercial industrial range.
추천
Protocol Converter / Serial Concentrator
In factory-floor protocol converters, the P1013NSN2LFB drives up to eight UART channels through its enhanced local bus plus external bridges, while the e500v2 core runs EtherCAT, PROFINET, or Modbus stacks simultaneously. The hardware SEC 4.x engine secures CIP Security or OPC UA TLS handshakes at line rate. The 256 KB L2 cache keeps protocol state tables in low-latency memory, and the PCIe x1 lanes attach a secondary ASIC for sub-microsecond deterministic I/O. Compared to MCU-only designs, the P1013 handles full Linux preempt-RT with rich networking stacks.
추천
Single-Board Computer (SBC) for Embedded Linux
The P1013NSN2LFB enables a compact single-board computer (SBC) form factor because it integrates CPU, DDR3 controller, three Ethernet MACs, two PCIe lanes, USB 2.0, and an LCD controller in a single 689-TEPBGA II package. With 1067 MHz and 256 KB L2 it boots mainline Linux 5.x/6.x with U-Boot and runs Yocto or Buildroot distros. Compared to discrete CPU + northbridge designs, this SoC approach reduces board layers to 6-layer with 1.0 mm BGA pitch. The 0 to +105 °C range supports fanless SBC enclosures in industrial cabinets.
추천
Network-Attached Storage (NAS) / File Appliance
The P1013NSN2LFB fits entry-level NAS appliances because the hardware SEC 4.x engine accelerates AES-256-XTS for at-rest encryption, the DDR3-with-ECC controller supports RAID scrubbing, and the dual SGMII lanes attach directly to SATA bridges via SerDes for multi-drive bays. At 1067 MHz the e500v2 core sustains ~200 MB/s encrypted SMB/NFS throughput. Compared to ARM Cortex-A NAS SoCs, the P1013's Power Architecture offers stronger ECC support and a longer product-life commitment from NXP for embedded markets.
추천
Secure Network Appliance (Firewall / VPN)
The P1013NSN2LFB is ideal for small-business firewall/VPN appliances because the integrated SEC 4.x engine offloads IPsec ESP, IKE, and TLS at multi-gigabit rates while the e500v2 core runs the control plane (iptables, routing daemon). Three GbE MACs support WAN/LAN/DMZ topology without external switches. DDR3-with-ECC ensures uninterrupted operation under heavy NAT table load, and dual PCIe lanes attach a crypto accelerator card for high-density deployments. The 0 to +105 °C range supports fanless fanless SOHO appliances. Compared to x86 Celeron firewalls, the P1013 cuts BOM by 40%.
추천
추천 제품 요약
엔지니어링 참조 데이터: P1013NSN2LFB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P1013NXN2LFB | P1011NXN2HFB | P1014NSN2LFB | P1022NSN2LHB |
|---|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) | PowerPC e500v2 (2 cores) |
| Maximum Core Frequency | 1067 MHz | 1067 MHz | 800 MHz (-25%) | 1200 MHz (+12%) | 1067 MHz |
| Operating Temperature | 0 to +105 °C | -40 to +125 °C | -40 to +125 °C | 0 to +105 °C | 0 to +105 °C |
| DDR3 Memory Controller | DDR2/DDR3 with ECC, 800 MT/s | Same | Same | Same | Same |
| Gigabit Ethernet MACs | 3 (1 RGMII + 2 SGMII) | 3 (same) | 3 (same) | 3 (same) | 3 (same) |
| PCIe Lanes | 2 x PCIe Gen 1/2 | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
주요 차별점
- Single-core 1067 MHz with full triple GbE + dual PCIe integration (vs P1011NXN2HFB)
- Last Time Buy status vs active lifecycle of the N suffix (vs P1013NXN2LFB)
- 1.0 mm pitch TEPBGA II vs competing SoCs at 0.8 mm (vs Generic ARM Cortex-A9 SoC)
설계 노트
The 689-ball TEPBGA II at 1.0 mm pitch requires a 6-layer PCB minimum (8-layer recommended) with stacked via-in-pad for the inner-row balls. Use 50 Ω controlled impedance for the SGMII lanes and 85 Ω differential for PCIe; reference NXP application note AN4321 for the SerDes routing reference stackup. Place decoupling capacitors within 100 mils of each power ball, with 1 µF X7R for core and 0.1 µF X7R for I/O rails.
Estimated: At 1067 MHz with Tj max 125 °C and typical 4.5 W core power, the 689-TEPBGA II with θJA of 11 C/W (4-layer JEDEC board, 0 m airflow) rises 50 °C above ambient. In sealed enclosures with no airflow, derate ambient to 75 °C or attach a 4 cm² copper heat spreader bonded via thermal pad. Use the silicon revision 2.1 thermal diode for closed-loop cooling via the SEC thermal monitor block.
SerDes lane placement requires 100 Ω differential reference design with maximum 200 mil skew between P and N traces. Keep SGMII and PCIe away from the DDR3 byte-lane crossings by at least 4x the dielectric thickness (≥12 mil). Use AC-coupled capacitors (0.1 µF 0402) at every SerDes TX output, placed within 250 mil of the BGA ball. Validate with NXP's SerDes Signal Integrity Checklist before tape-out.
Three common pitfalls: (1) omitting the 32 kHz RTC crystal on the RTC_XTAL pins - this prevents wake-from-sleep firmware timers; (2) mixing 1.5 V core and 1.8 V DDR power rails in random order at power-up - the SEC accelerator needs the 1.5 V core rail first per the power sequencing diagram; (3) using the wrong boot configuration word for NAND vs NOR vs SPI - this causes silent boot failures that are difficult to debug without JTAG.
규정 준수 정보
RoHS and REACH compliance per NXP product page; Pb-free SAC405 ball finish supports JEDEC J-STD-020 reflow. AEC-Q100 is not applicable to communications processors; halogen-free status not declared by NXP for this part number.
