P1014NSN5DFA - QorIQ P1014 e500v2 SoC 800MHz | NXP Semiconductors
部品番号: P1014NSN5DFA ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $58.2 | $582.00 |
| 100 | $53.9 | $5,390.00 |
| 250 | $49.75 | $12,437.50 |
| 500 | $45.3 | $22,650.00 |
P1014NSN5DFA 概要
A communications processor is a system-on-chip (SoC) that combines a CPU core, memory controller, and multiple high-speed IO peripherals on a single die; it is the next-generation evolution of the PowerQUICC series and is part of NXP's QorIQ P1 family. Within the system hierarchy, the P1014 sits between general-purpose microcontrollers and high-end networking SoCs, targeting cost- and power-sensitive applications such as SOHO routers and industrial gateways. The same family tree also includes the lower-speed P1010 variant (up to 533 MHz), letting designers scale performance within a pin-compatible footprint.
Key features include a 32-bit Power Architecture e500v2 core with dual-issue superscalar execution, a 32/16-bit DDR3 memory controller with ECC support, two Gigabit Ethernet MACs (one RGMII, one SGMII capable), two USB 2.0 controllers (host + device/host), two SATA 2.0 ports at 3 Gb/s, and one PCIe x4 Gen 2 controller. Integrated security includes basic secure-boot and Trust Architecture support typical of the P1 family.
The device integrates the SerDes, networking, and IO IP that historically required companion chipsets in PowerQUICC designs, reducing PCB area, BOM count, and design complexity. Power is supplied through multiple rails including 1.0V core and 1.5V/1.8V DDR, with power management controlled by on-chip PLLs.
Typical applications include SOHO/SMB routers, wireless LAN access points, industrial automation controllers, networked printers, IP cameras/NVR, and smart-grid gateway nodes. The industrial-grade temperature range and integrated networking make it especially well suited to harsh-environment edge appliances.
When designing with this part, ensure the DDR3 routing meets the controller's impedance and length-matching rules and that the SerDes reference clock is clean, because signal-integrity violations here degrade GbE and PCIe link margin. The 425-ball TEPBGA requires standard 0.8 mm-pitch PCB rules plus microvia or laser-drill capability.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same P1 family, and practical design notes that complement rather than duplicate the manufacturer datasheet.
ドロップイン代替品: P1014NSN5DFA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: P1014NSN5DFA （同一形状・フットプリント） — 相違点: Core Architecture, Ethernet, Memory Controller, PCIe, Package.
クイック比較ツール — 並列比較する代替部品を選択:
P1014NSE5DFA
✅ ドロップイン✓ 在庫あり
$27.8 / 個
データシートを見る →P1014NSN5DFB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P1014CXN5DFA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P1010NSN5DFA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P1013NSN5DFA
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
P1014NSN5DFA 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | QorIQ P1 |
| Core Architecture | Power Architecture e500v2 |
| Bit Width | 32-bit |
| Maximum Core Frequency | 800 MHz |
| Number of Cores | 1 |
| パッケージ | 425-TEPBGA I (19x19 mm) |
| Package Code | FBGA / TEPBGA I |
| Number of Terminals | 425 (ball grid array) |
| 動作温度 | 0C to +105C |
| Memory Controller | DDR3 (32/16-bit) with ECC |
| Ethernet | 2x GbE (RGMII / SGMII) |
| USB | 2x USB 2.0 (host + device/host) |
| SATA | 2x SATA 2.0 (3 Gb/s) |
| PCIe | 1x PCIe x4 Gen 2 |
| RoHS ステータス | RoHS Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
P1014NSN5DFA fbga / tepbga i ピン配置ガイド
P1014NSN5DFA (fbga / tepbga i パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: P1014NSN5DFA.
詳細は データシート をご参照ください。
主な用途
P1014NSN5DFA の用途: 6 件s: SOHO / SMB Routers, Wireless LAN Access Points, Industrial Automation Controllers, Networked Printers and MFPs, IP Cameras and NVR Systems, Smart Grid Gateway Nodes.
SOHO / SMB Routers
The P1014NSN5DFA is a strong fit for SOHO and SMB routers because its 800 MHz e500v2 core delivers sufficient CPU headroom for NAT, firewall, and QoS workloads while the dual GbE MACs provide the LAN and WAN interfaces. Integrated SATA and USB 2.0 allow the same SoC to act as the main processor for routers with attached storage or 4G USB modems. Compared with discrete CPU-plus-switch designs, the integrated peripherals shrink PCB area and BOM cost while keeping typical router power consumption under 5 W. The 0 to 105C operating range further supports fanless enclosures used in residential gateways.
おすすめ
Wireless LAN Access Points
For wireless LAN access points, the P1014NSN5DFA provides the IO and CPU resources needed to drive 802.11n/AC modules over its PCIe x4 Gen 2 link while running the AP management stack on the e500v2 core. The dual GbE MACs supply the wired uplink and the bridging interface, and the DDR3 controller with ECC is fast enough to handle aggregated wireless throughput without dropping frames. Designers benefit from the same QorIQ Linux SDK across the P1 family, allowing firmware portability from lower-cost P1010 APs to higher-performance P1014 APs. The industrial temperature range supports outdoor and enterprise-class AP deployments.
おすすめ
Industrial Automation Controllers
In industrial automation, the P1014NSN5DFA serves as the main processor for programmable logic controllers, gateway nodes, and protocol converters that must operate reliably from 0C to 105C. The GbE, USB, SATA, and PCIe interfaces cover the connectivity needed for EtherCAT/IP/Profinet gateways, while the DDR3 controller and 800 MHz CPU handle real-time protocol stacks and edge analytics. The integrated peripherals replace a multi-chip PowerQUICC + companion-controller design, lowering both bill of materials and long-term MTBF risk. NXP's long-term product support on QorIQ P1 makes the part an attractive baseline for equipment with 10+ year field lifecycles.
おすすめ
Networked Printers and MFPs
Networked printers and multifunction peripherals benefit from the P1014NSN5DFA's GbE, USB, and SATA interfaces combined with its 800 MHz processing power for rendering and scan pipelines. The SoC can drive the engine controller over PCIe while serving multiple network clients through the dual GbE MACs and storing jobs on an attached SATA disk. Replacing legacy PowerQUICC designs with the P1014 cuts board area and power consumption, while preserving the same QorIQ toolchain used in the previous generation. The 0 to 105C operating range is well suited to the elevated internal temperatures of large MFPs.
おすすめ
IP Cameras and NVR Systems
IP cameras and network video recorders leverage the P1014NSN5DFA's GbE uplink, SATA storage, and 800 MHz CPU to ingest multiple video streams while running motion-detection or analytics locally. The dual GbE MACs allow a separate link for camera-side IP and storage-side IP, and the SATA interface supports multi-terabyte recording disks. Compared with separate CPU + IO controller designs, the integrated SoC cuts BOM cost and power, an advantage when the camera enclosure must be small and fanless. The same QorIQ Linux BSP is reusable across camera and NVR products for faster development.
おすすめ
Smart Grid Gateway Nodes
Smart grid gateways and substation routers rely on the P1014NSN5DFA's GbE, USB, and PCIe interfaces to bridge AMI meters, serial devices, and IP networks, while the 800 MHz CPU handles aggregation and protocol conversion. The 0 to 105C industrial temperature range is mandatory for substation environments, and NXP's long-term QorIQ P1 supply program supports the multi-decade lifecycles typical of utility equipment. Integrated security features (when paired with the NSE variant) help the gateway meet IEC 62351 substation cybersecurity requirements.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: P1014NSN5DFA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | P1014NSE5DFA | P1014NSN5DFB | P1014CXN5DFA | P1010NSN5DFA | P1013NSN5DFA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) |
| Maximum Core Frequency | 800 MHz | 800 MHz | 667 MHz | 800 MHz | 533 MHz | 600 MHz |
| Core Architecture | e500v2 (Power Architecture) | e500v2 | e500v2 | e500v2 | e500v2 | e500v2 |
| Encryption / Secure Boot | No (standard variant) | Yes | No | No (custom OTP) | No | No |
| GbE MACs | 2 (RGMII / SGMII) | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
主な差別化要因
- Single part combines 800 MHz e500v2 core with GbE, USB, SATA, and PCIe Gen 2 （vs P1010NSN5DFA)
- Industrial-grade 0C to +105C operating temperature with integrated DDR3 controller （vs P1013NSN5DFA)
- Pin-compatible encryption-enabled upgrade path （vs P1014NSE5DFA)
設計ノート
The 425-ball TEPBGA I uses a 0.8 mm ball pitch on a 19x19 mm body, so the PCB must be fabricated with microvia or laser-drill technology and BGA-grade surface finish (ENIG or ENEPIG recommended). Apply a 4-6 layer stack-up with continuous ground and power planes directly under the SoC, and escape the inner-row balls through the microvia layer. Maintain a 50 ohm-controlled-impedance stack-up for DDR3 and SerDes routing per NXP's QorIQ P1 hardware design guide.
The integrated GbE, PCIe, and SATA SerDes links are sensitive to reference-clock jitter and PCB losses. Use a clean, low-jitter differential reference clock source, keep the clock trace short and impedance-controlled, and route the SerDes pairs with matched length and differential impedance per the QorIQ hardware manual. For SATA at 3 Gb/s, ensure the total channel loss budget fits within the SATA II specification.
Although the P1014NSN5DFA's industrial 105C rating is generous, sustained GbE plus PCIe traffic can produce 5-8 W of dissipation in a compact fanless enclosure. Provide a continuous copper pour stitched with thermal vias under the central BGA region, and consider attaching the part to an internal chassis heat spreader with a thermal interface material if the design is fully sealed. Validate with a thermal probe at the worst-case ambient of 70C.
コンプライアンス情報
RoHS and lead-free per NXP product page and DigiKey material declaration. Industrial-grade temperature 0C to +105C; not AEC-Q100 qualified (industrial rather than automotive).
