PI7C9X3G816GP - 8-Port 16-Lane PCIe 3.0 Switch | Diodes
部品番号: PI7C9X3G816GP ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
PI7C9X3G816GP 概要
A PCIe packet switch is an interface fabric device that sits in the PCI Express hierarchy between a root complex and multiple endpoints. It expands a single upstream PCI Express link into several downstream links, forwarding TLPs (Transaction Layer Packets) between ports based on address routing. Within the system hierarchy, a packet switch belongs to the PCI Express interconnect family: root complex to switch to endpoints, enabling fan-out expansion for storage controllers, network interface cards, and host adapters without saturating the host root port.
Key features of the PI7C9X3G816GP include PCI Express Gen3 (8 GT/s) SERDES with 16 lanes total, flexible lane-width allocation per port, and support for 2-port through 8-port partitioning. This flexibility allows a single PCB design to address multiple SKU tiers: a 2-port x8 design for storage, or an 8-port x2 fan-out for dense backplanes. The switch implements standard PCI Express packet-switch functions including non-posted and posted transaction forwarding.
Technically, the device integrates high-speed Gen3 SERDES blocks with receiver equalization and transmitter de-emphasis required for reliable 8 GT/s operation over backplane-length channels, while the switch fabric performs cut-through packet routing with address-based and ID-based forwarding per the PCI Express Base Specification.
Typical applications include NVMe SSD storage systems, server expansion backplanes, industrial host adapter cards, and networking line cards where a host PCIe Gen3 root port must serve multiple endpoints.
Design consideration: allocate one configuration strap set and verify lane-width partitioning early, since flexibly partitioned ports share the fixed 16-lane SERDES pool and the chosen partition determines ball usage.
This page synthesizes datasheet facts, drop-in family alternatives, application guidance, and design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: PI7C9X3G816GP — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
PI7C9X3G816GPBHFCE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PI7C9X3G816GP 最大定格＆電気的特性
| Product Type | PCI Express Gen 3 Packet Switch |
| Total Lanes | 16 lanes PCIe Gen3 |
| Port Configurations | 2-port, 3-port, 4-port, 5-port, 8-port |
| Data Rate per Lane | 8 GT/s (PCIe Gen3) |
| パッケージ | 324-ball HFCBGA (19x19 mm) |
| 実装タイプ | Surface Mount |
| Lane Width Allocation | Variable per port (flexible) |
| Packet Routing | Address-based / ID-based TLP forwarding |
| SERDES Features | Gen3 SERDES with equalization |
| Datasheet Revision | Revision 4, February 2024 |
PI7C9X3G816GP 324-ball hfcbga (19x19 mm) ピン配置ガイド
PI7C9X3G816GP (324-ball hfcbga (19x19 mm) パッケージ) のピン配置。 このパワーデバイスは、ゲート、ドレイン、ソース端子を備えています。非極性パッケージの場合、正確なピン1の向きとフットプリントの詳細については、メーカーのデータシートを参照してください。主な用途には、電源設計、モータ駆動、負荷スイッチングがあります。
詳細なピン配置データはありません: PI7C9X3G816GP.
詳細は データシート をご参照ください。
主な用途
PI7C9X3G816GP の用途: 6 件s: NVMe SSD Storage Systems, Server Expansion Backplanes, Industrial Host Adapter Cards, Networking Line Cards, FPGA Co-Processor Expansion, Video and Image Acquisition Systems.
NVMe SSD Storage Systems
The PI7C9X3G816GP fits NVMe storage designs because its 16 Gen3 lanes partition naturally into one x8 upstream link to the host and two x4 downstream links, exactly matching the x4 lane width of M.2 and U.2 NVMe device interfaces. In a 2-port configuration each downstream port at 8 GT/s sustains roughly 3.9 GB/s per direction, enough to keep two enterprise SSDs from being host-limited. Placed between the host root port and the drives, the switch performs cut-through TLP forwarding with no software-visible change to enumeration. The trade-off is added latency of a few hundred nanoseconds per hop and the need for Gen3 SerDes equalization on backplane-length channels.
おすすめ
Server Expansion Backplanes
In server and JBOD backplanes, the PI7C9X3G816GP provides fan-out from a slot-hosted host interface to multiple drive or riser slots. Its 8-port x2 configuration is particularly effective for SAS/NVMe backplanes carrying many modest-bandwidth devices, while the 5-port and 4-port partitions serve mixed x4 slot designs. The flexible lane-width allocation lets one backplane PCB address multiple capacity tiers by strapping the partition differently during production, avoiding multiple switch SKUs in inventory. Designers must budget for Gen3 receiver equalization over midplane channels of 300 mm or more and verify eye diagrams against the PCI Express Base Specification compliance points.
おすすめ
Industrial Host Adapter Cards
Industrial host adapters that must expose several endpoint functions from a single PCIe slot benefit from the PI7C9X3G816GP's flexible partitioning: a 4-port x4 layout turns one host x16 Gen3 slot into four independent x4 device links. The switch's address-based and ID-based TLP forwarding keeps endpoint enumeration transparent to the host OS, and Gen3 8 GT/s operation delivers up to about 7.8 GB/s aggregate upstream bandwidth. In factory environments with long cabling, verify the Gen3 link budget with pre-emphasis and equalization settings, and plan conduction cooling for the 324-ball HFCBGA since switch power scales with active SerDes lanes.
おすすめ
Networking Line Cards
Network line cards use the PI7C9X3G816GP to connect a switch-ASIC or NPU control/ data interface to multiple NIC endpoints, MACs, or FPGA accelerators. A 3-port configuration (x8 upstream, x4 plus x4 downstream) is a common fit for cards combining a management controller and a datapath device on one host link. The 16-lane Gen3 pool at 8 GT/s supplies the deterministic bandwidth needed for control-plane traffic, while packet-switch forwarding avoids host root-port contention. SerDes channels on dense line cards are frequently longer than 400 mm, so receiver equalization tuning and per-lane eye testing on first-article boards are essential for link training margin.
おすすめ
FPGA Co-Processor Expansion
Designs pairing a host CPU with multiple FPGA co-processors use the PI7C9X3G816GP to fan one x8 or x16 host link out to several FPGA endpoints. In a 2-port x8 plus x8 partition, each FPGA receives a dedicated 8 GT/s Gen3 link with roughly 7.8 GB/s per direction, supporting streaming accelerator workloads such as image processing and financial compute. The switch isolates link training between the host and each FPGA, so a hung endpoint does not take down the host root port, an operational reliability benefit versus daisy-chained topologies. Budget for the switch's forwarding latency in tightly synchronized multi-FPGA algorithms.
おすすめ
Video and Image Acquisition Systems
Multi-camera frame grabbers and medical imaging systems use the PI7C9X3G816GP to aggregate several video capture endpoints onto one host PCIe Gen3 link. A 5-port or 8-port configuration provides an independent x2 or x4 link per capture device, preventing bandwidth contention that a shared root port would cause. Gen3 8 GT/s per lane delivers the aggregate throughput required for uncompressed multi-stream 4K acquisition, while the switch's cut-through forwarding keeps end-to-end latency low for real-time preview paths. Designers should validate jitter and lane margin on all SerDes channels, since image sensors and capture FPGAs are often placed on separate boards connected through cable assemblies.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PI7C9X3G816GP — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PI7C9X3G816GPBHFCE |
|---|---|---|
| Package | 324-HFCBGA (19x19 mm) | 324-HFCBGA (19x19 mm) - same |
| Brand | Diodes Incorporated | Diodes Incorporated |
| PCIe Generation | Gen3 (8 GT/s) | Gen3 (8 GT/s) |
| Total Lanes | 16 | 16 |
| Port Configurations | 2/3/4/5/8-port | 2/3/4/5/8-port |
| Flexible Lane Width per Port | Yes | Yes |
主な差別化要因
- Five partition options on one die （vs PI7C9X3G816GPBHFCE (identical silicon))
- Native Gen3 SerDes pool （vs Broadcom PEX8xxx Gen3 switches (functional, not pin-compatible))
- Fewer second-source options (trade-off) （vs Broadcom PEX8xxx switches)
設計ノート
Route every PCIe Gen3 lane as a 100-ohm differential pair at 8 GT/s (85-ohm designs are also common per board stackup convention; follow the Diodes datasheet layout section). Keep intra-pair skew tight, use AC-coupling capacitors near the receiver side of each link, and route over an unbroken ground reference. For backplane or cable channels, use the switch's SerDes receiver equalization and transmitter settings during link training validation. Measure eye diagrams at the compliance points on first articles rather than relying solely on simulation.
The 324-ball HFCBGA (19x19 mm) requires via-in-pad or dog-bone fanout; plan at least two signal layers for ball escape plus dedicated solid ground and power planes. Sequence power rails per the datasheet power-up ordering, and place bulk and high-frequency decoupling capacitors directly beneath the BGA on the backside layer. Confirm BGA reflow profile and MSL handling per the ordering part number PI7C9X3G816GPBHFCE packaging data before production assembly.
Fix the port partition (2/3/4/5/8-port) and lane-width assignment early, because the partition straps determine which balls are used and PCB routing cannot be changed later. A frequent error is assuming all 16 lanes are available at a single port when the silicon allocates them across the configured partition. Also verify link training with the actual channel insertion loss in the system; a design that passes on a short evaluation board may fail link training over a full backplane without equalization tuning.
コンプライアンス情報
Compliance status not present in the verified web data captured. Confirm RoHS/REACH status on the official Diodes product page (diodes.com/part/view/PI7C9X3G816GP) before procurement.
