Diodes Incorporated

PI7C9X3G816GP - 8-Port 16-Lane PCIe 3.0 Switch | Diodes

N.º da peça: PI7C9X3G816GP ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
324-ball HFCBGA (19x19 mm) Package
Contato para preços
MOQ: 1 |
Preço atualizado: 2026-10-19
Preços por volume
Qtd. Preço unitário Total
1 $0 $0,00
10 $0 $0,00
100 $0 $0,00
500 $0 $0,00
1.000 $0 $0,00
ℹ️ Todos os preços estão em USD

PI7C9X3G816GP Visão geral

The Diodes Incorporated PI7C9X3G816GP is a PCI Express Gen 3 packet switch that supports 16 lanes of Gen3 SERDES in flexible 2-port, 3-port, 4-port, 5-port and 8-port configurations, housed in a 324-ball HFCBGA (19x19 mm) package.

A PCIe packet switch is an interface fabric device that sits in the PCI Express hierarchy between a root complex and multiple endpoints. It expands a single upstream PCI Express link into several downstream links, forwarding TLPs (Transaction Layer Packets) between ports based on address routing. Within the system hierarchy, a packet switch belongs to the PCI Express interconnect family: root complex to switch to endpoints, enabling fan-out expansion for storage controllers, network interface cards, and host adapters without saturating the host root port.

Key features of the PI7C9X3G816GP include PCI Express Gen3 (8 GT/s) SERDES with 16 lanes total, flexible lane-width allocation per port, and support for 2-port through 8-port partitioning. This flexibility allows a single PCB design to address multiple SKU tiers: a 2-port x8 design for storage, or an 8-port x2 fan-out for dense backplanes. The switch implements standard PCI Express packet-switch functions including non-posted and posted transaction forwarding.

Technically, the device integrates high-speed Gen3 SERDES blocks with receiver equalization and transmitter de-emphasis required for reliable 8 GT/s operation over backplane-length channels, while the switch fabric performs cut-through packet routing with address-based and ID-based forwarding per the PCI Express Base Specification.

Typical applications include NVMe SSD storage systems, server expansion backplanes, industrial host adapter cards, and networking line cards where a host PCIe Gen3 root port must serve multiple endpoints.

Design consideration: allocate one configuration strap set and verify lane-width partitioning early, since flexibly partitioned ports share the fixed 16-lane SERDES pool and the chosen partition determines ball usage.

This page synthesizes datasheet facts, drop-in family alternatives, application guidance, and design notes not consolidated in the manufacturer datasheet.

Alternativas drop-in para PI7C9X3G816GP — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PI7C9X3G816GPBHFCE

✅ Drop-In
📦 324-HFCBGA (19x19 mm)
identical die and package; BHFCE is the full ordering suffix of the same 8-port/16-lane Gen3 switch (0% electrical difference)

📋 Alternativa de referência (fora do catálogo)

PI7C9X3G816GP Classificações máximas e características elétricas

Product Type PCI Express Gen 3 Packet Switch
Total Lanes 16 lanes PCIe Gen3
Port Configurations 2-port, 3-port, 4-port, 5-port, 8-port
Data Rate per Lane 8 GT/s (PCIe Gen3)
Encapsulamento 324-ball HFCBGA (19x19 mm)
Tipo de montagem Surface Mount
Lane Width Allocation Variable per port (flexible)
Packet Routing Address-based / ID-based TLP forwarding
SERDES Features Gen3 SERDES with equalization
Datasheet Revision Revision 4, February 2024

Guia de Configuração de Pinos do PI7C9X3G816GP 324-ball hfcbga (19x19 mm)

Configuração de pinos para PI7C9X3G816GP (pacote 324-ball hfcbga (19x19 mm)). Este dispositivo de potência possui terminais de gate, drain e source. Para pacotes não polarizados, consulte o datasheet do fabricante para a orientação exata do pino 1 e detalhes do footprint. Aplicações comuns incluem projeto de fontes de alimentação, acionamento de motores e comutação de cargas.

Diagrama de pinagem do pacote 324-ball hfcbga (19x19 mm) para PI7C9X3G816GP

Nenhum dado detalhado de pinagem disponível para PI7C9X3G816GP.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

PI7C9X3G816GP é adequado para 6 aplicaçãos: NVMe SSD Storage Systems, Server Expansion Backplanes, Industrial Host Adapter Cards, Networking Line Cards, FPGA Co-Processor Expansion, Video and Image Acquisition Systems.

🖥️

NVMe SSD Storage Systems

The PI7C9X3G816GP fits NVMe storage designs because its 16 Gen3 lanes partition naturally into one x8 upstream link to the host and two x4 downstream links, exactly matching the x4 lane width of M.2 and U.2 NVMe device interfaces. In a 2-port configuration each downstream port at 8 GT/s sustains roughly 3.9 GB/s per direction, enough to keep two enterprise SSDs from being host-limited. Placed between the host root port and the drives, the switch performs cut-through TLP forwarding with no software-visible change to enumeration. The trade-off is added latency of a few hundred nanoseconds per hop and the need for Gen3 SerDes equalization on backplane-length channels.

🖥️

Server Expansion Backplanes

In server and JBOD backplanes, the PI7C9X3G816GP provides fan-out from a slot-hosted host interface to multiple drive or riser slots. Its 8-port x2 configuration is particularly effective for SAS/NVMe backplanes carrying many modest-bandwidth devices, while the 5-port and 4-port partitions serve mixed x4 slot designs. The flexible lane-width allocation lets one backplane PCB address multiple capacity tiers by strapping the partition differently during production, avoiding multiple switch SKUs in inventory. Designers must budget for Gen3 receiver equalization over midplane channels of 300 mm or more and verify eye diagrams against the PCI Express Base Specification compliance points.

🏭

Industrial Host Adapter Cards

Industrial host adapters that must expose several endpoint functions from a single PCIe slot benefit from the PI7C9X3G816GP's flexible partitioning: a 4-port x4 layout turns one host x16 Gen3 slot into four independent x4 device links. The switch's address-based and ID-based TLP forwarding keeps endpoint enumeration transparent to the host OS, and Gen3 8 GT/s operation delivers up to about 7.8 GB/s aggregate upstream bandwidth. In factory environments with long cabling, verify the Gen3 link budget with pre-emphasis and equalization settings, and plan conduction cooling for the 324-ball HFCBGA since switch power scales with active SerDes lanes.

🌐

Networking Line Cards

Network line cards use the PI7C9X3G816GP to connect a switch-ASIC or NPU control/ data interface to multiple NIC endpoints, MACs, or FPGA accelerators. A 3-port configuration (x8 upstream, x4 plus x4 downstream) is a common fit for cards combining a management controller and a datapath device on one host link. The 16-lane Gen3 pool at 8 GT/s supplies the deterministic bandwidth needed for control-plane traffic, while packet-switch forwarding avoids host root-port contention. SerDes channels on dense line cards are frequently longer than 400 mm, so receiver equalization tuning and per-lane eye testing on first-article boards are essential for link training margin.

🔧

FPGA Co-Processor Expansion

Designs pairing a host CPU with multiple FPGA co-processors use the PI7C9X3G816GP to fan one x8 or x16 host link out to several FPGA endpoints. In a 2-port x8 plus x8 partition, each FPGA receives a dedicated 8 GT/s Gen3 link with roughly 7.8 GB/s per direction, supporting streaming accelerator workloads such as image processing and financial compute. The switch isolates link training between the host and each FPGA, so a hung endpoint does not take down the host root port, an operational reliability benefit versus daisy-chained topologies. Budget for the switch's forwarding latency in tightly synchronized multi-FPGA algorithms.

🎥

Video and Image Acquisition Systems

Multi-camera frame grabbers and medical imaging systems use the PI7C9X3G816GP to aggregate several video capture endpoints onto one host PCIe Gen3 link. A 5-port or 8-port configuration provides an independent x2 or x4 link per capture device, preventing bandwidth contention that a shared root port would cause. Gen3 8 GT/s per lane delivers the aggregate throughput required for uncompressed multi-stream 4K acquisition, while the switch's cut-through forwarding keeps end-to-end latency low for real-time preview paths. Designers should validate jitter and lane margin on all SerDes channels, since image sensors and capture FPGAs are often placed on separate boards connected through cable assemblies.

Resumo dos produtos recomendados

PI7C9X3G816GPBHFCE Same switch, full ordering part number Usado em: NVMe SSD Storage Systems, Server Expansion Backplanes, Industrial Host Adapter Cards, Networking Line Cards, FPGA Co-Processor Expansion, Video and Image Acquisition Systems
What is the PI7C9X3G816GP?
The PI7C9X3G816GP is a Diodes Incorporated PCI Express Gen 3 packet switch supporting 16 lanes of Gen3 SERDES in flexible 2-port, 3-port, 4-port, 5-port and 8-port configurations. According to the Diodes product page, the architecture allocates variable lane widths for each port, allowing one silicon design to serve storage, networking, and backplane expansion products. It is packaged in a 324-ball HFCBGA measuring 19x19 mm.
What port configurations does PI7C9X3G816GP support?
The PI7C9X3G816GP supports 2-port, 3-port, 4-port, 5-port and 8-port configurations across its 16 Gen3 lanes. Per the Diodes datasheet, the architecture allocates variable lane widths to each port, so a designer can implement, for example, x8 plus two x4 ports or eight x2 downstream ports. The partition is set by configuration straps, so the same PCB can serve multiple product SKUs without redesign.
Where can I download the PI7C9X3G816GP datasheet PDF?
The official PI7C9X3G816GP datasheet PDF is available from Diodes Incorporated at diodes.com/datasheet/download/PI7C9X3G816GP.pdf, and mirrors exist on Mouser Electronics. The full datasheet documents the 8-port, 16-lane PCI Express Gen 3 Switch; per Alldatasheet it is a 319-page document, and the latest revision captured here is Revision 4 dated February 2024. Always prefer the Diodes official download link for the current revision.
What package does the PI7C9X3G816GP use?
The PI7C9X3G816GP is offered in a 324-ball fine-pitch HFCBGA package measuring 19x19 mm. According to the DigiKey product listing for PI7C9X3G816GPBHFCE, the part is described as a Packet Switch with 8-port/16-lane interface in 324-HFCBGA (19x19). This ball-grid-array package requires a PCB with controlled-impedance Gen3 SerDes routing and ball-escape fanout.
Is the PI7C9X3G816GP suitable for NVMe storage systems?
Yes, the PI7C9X3G816GP is well suited for NVMe and enterprise storage because PCIe Gen3 packet switches are the standard fan-out element between a host root port and multiple NVMe SSD endpoints. With 16 Gen3 lanes at 8 GT/s, a typical configuration provides one x8 upstream link and two x4 downstream links serving two M.2 or U.2 drives, or an 8-port x2 fan-out for dense backplanes. Its flexible lane-width allocation per port directly matches the x4 lane width of standard NVMe device interfaces.
What is the price of PI7C9X3G816GP?
Pricing for the PI7C9X3G816GP is quoted on request as of 2026-10-19; this page does not publish verified unit pricing because no distributor price data was captured in the verified web data for this MPN. High-pin-count BGA packet switches of this class are typically priced via volume quotes through distributors such as DigiKey or Mouser. Contact XAIPART with your quantity for a current quotation referencing the ordering part number PI7C9X3G816GPBHFCE.
Where to buy PI7C9X3G816GP online?
The PI7C9X3G816GP can be purchased through XAIPART (request a quote) or through authorized distributors; DigiKey lists the ordering part number PI7C9X3G816GPBHFCE in the 324-HFCBGA (19x19) package with buy-now and ship-today availability as of the October 2024 catalog snapshot. Mouser also carries the datasheet and stock. Because this is a specialized high-layer-count BGA device, verify stock and lead time at order time, as PCIe switch inventory fluctuates with server demand cycles.
What is the lead time for PI7C9X3G816GP?
Lead time for the PI7C9X3G816GP is not stated in the verified data captured as of 2026-10-19. Distributor listings such as DigiKey show the BHFCE ordering variant with ship-today availability at times, but lead times for PCIe Gen3 packet switches typically range from stock to 16+ weeks depending on demand. Confirm current lead time with XAIPART or the distributor before committing to a production schedule, and consider buffer stock for long-lifecycle industrial designs.
What is the difference between PI7C9X3G816GP and PI7C9X3G816GPBHFCE?
The PI7C9X3G816GPBHFCE is the full ordering part number for the same silicon: the base die PI7C9X3G816GP in the 324-ball HFCBGA (19x19 mm) package with specified grade suffix letters. According to the DigiKey listing, PI7C9X3G816GPBHFCE is described as a Packet Switch, 8-Port/16-Lane Interface, 324-HFCBGA (19x19) from Diodes Incorporated. Electrically and mechanically they are the same device; the suffix encodes package and quality-grade ordering information.
Is there a cross-brand drop-in replacement for PI7C9X3G816GP?
No verified cross-brand pin-compatible replacement was found in the cross-reference searches performed. A TI E2E forum response from a Texas Instruments engineer states that TI does not have a PCIe Gen3 packet switch similar to the Diodes part, and Broadcom PEX Gen3 switches use different ball maps and packages. As of 2026-10-19, the only true drop-in alternatives are Diodes' own family variants sharing the same 324-ball HFCBGA footprint; any Broadcom-based redesign requires PCB and firmware changes.
What is the best drop-in replacement for PI7C9X3G816GP?
The best drop-in replacement is the PI7C9X3G816GPBHFCE, which is the identical die in the identical 324-ball HFCBGA (19x19 mm) package, differing only in ordering suffix. Because PCIe packet switches have few pin-compatible cross-brand equivalents (Broadcom PEX switches do not share the ball map), second-source options require board redesign rather than drop-in replacement. For supply-chain resilience, qualify the Diodes part from two distribution channels rather than counting on a competitor pin-match.
When should I choose PI7C9X3G816GP over a Broadcom PEX switch?
Choose the PI7C9X3G816GP when you need a 16-lane Gen3 switch with flexible 2/3/4/5/8-port partitioning at competitive cost, and your design does not require Gen4 speeds or Broadcom ecosystem software. Broadcom PEX switches offer larger lane counts (up to 96+ lanes) and Gen4/Gen5 speeds, but at higher cost and power. For a storage appliance needing one x8 upstream and two x4 downstream Gen3 links, the Diodes part covers the requirement with a smaller design footprint.
Is PI7C9X3G816GP the same as Broadcom PEX8xxx switches?
No, the PI7C9X3G816GP is not the same as Broadcom PEX8xxx switches. They compete functionally as PCIe packet switches but differ in manufacturer (Diodes Incorporated versus Broadcom), package and ball map (324-ball HFCBGA 19x19 mm versus Broadcom-specific BGA footprints), so they are not pin-compatible or drop-in interchangeable. A migration between them requires PCB layout changes, re-verification of power sequencing, and firmware/driver requalification. Treat them as functional alternatives, not drop-in replacements.
What are the key specifications of PI7C9X3G816GP engineers should know?
Key facts: it is a PCI Express Gen 3 packet switch with 16 lanes of Gen3 SERDES at 8 GT/s; it supports 2-port, 3-port, 4-port, 5-port and 8-port configurations with variable lane width per port; it comes in a 324-ball HFCBGA measuring 19x19 mm; and the controlling datasheet is Revision 4, February 2024, from Diodes Incorporated. Supply voltage, power dissipation, and temperature range figures should be taken from that datasheet directly.
What PCB layout considerations apply to the PI7C9X3G816GP?
Design the PCB for Gen3 signal integrity: controlled-impedance 85-ohm differential pairs for every SerDes lane, length matching within approximately 5 mils intra-pair, and AC-coupling capacitors placed near the receiver per the Diodes datasheet layout guidance. The 324-ball HFCBGA 19x19 mm package needs via-in-pad or dog-bone fanout, a solid ground reference plane under all high-speed traces, and adequate power-plane decoupling at the core and SerDes supply balls. Avoid splitting reference planes under Gen3 escape routing.

Dados de referência de engenharia para PI7C9X3G816GP — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the PI7C9X3G816GP when your system needs up to 16 lanes of PCIe Gen3 fan-out with flexible 2/3/4/5/8-port partitioning - typical cases are NVMe storage adapters, backplanes, and line cards sized for Gen3 bandwidth without Gen4 cost. It is the right choice when PCB area and channel count favor a compact 324-ball 19x19 mm package. Choose Broadcom PEX8xxx switches instead if you need more than 16 lanes, Gen4/Gen5 speeds, or Broadcom management tooling - but plan for a PCB redesign since the packages are not pin-compatible; a TI engineer has confirmed TI has no equivalent Gen3 packet switch. Within the Diodes family, order PI7C9X3G816GPBHFCE, the full ordering number of the same silicon and package. There is no verified cross-brand drop-in replacement as of 2026-10-19.

Comparação com alternativas

Parâmetro Este produto PI7C9X3G816GPBHFCE
Package 324-HFCBGA (19x19 mm) 324-HFCBGA (19x19 mm) - same
Brand Diodes Incorporated Diodes Incorporated
PCIe Generation Gen3 (8 GT/s) Gen3 (8 GT/s)
Total Lanes 16 16
Port Configurations 2/3/4/5/8-port 2/3/4/5/8-port
Flexible Lane Width per Port Yes Yes

Principais diferenciais

  • Five partition options on one die (vs PI7C9X3G816GPBHFCE (identical silicon))
  • Native Gen3 SerDes pool (vs Broadcom PEX8xxx Gen3 switches (functional, not pin-compatible))
  • Fewer second-source options (trade-off) (vs Broadcom PEX8xxx switches)

Notas de projeto

Route every PCIe Gen3 lane as a 100-ohm differential pair at 8 GT/s (85-ohm designs are also common per board stackup convention; follow the Diodes datasheet layout section). Keep intra-pair skew tight, use AC-coupling capacitors near the receiver side of each link, and route over an unbroken ground reference. For backplane or cable channels, use the switch's SerDes receiver equalization and transmitter settings during link training validation. Measure eye diagrams at the compliance points on first articles rather than relying solely on simulation.

The 324-ball HFCBGA (19x19 mm) requires via-in-pad or dog-bone fanout; plan at least two signal layers for ball escape plus dedicated solid ground and power planes. Sequence power rails per the datasheet power-up ordering, and place bulk and high-frequency decoupling capacitors directly beneath the BGA on the backside layer. Confirm BGA reflow profile and MSL handling per the ordering part number PI7C9X3G816GPBHFCE packaging data before production assembly.

Fix the port partition (2/3/4/5/8-port) and lane-width assignment early, because the partition straps determine which balls are used and PCB routing cannot be changed later. A frequent error is assuming all 16 lanes are available at a single port when the silicon allocates them across the configured partition. Also verify link training with the actual channel insertion loss in the system; a design that passes on a short evaluation board may fail link training over a full backplane without equalization tuning.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Unknown

Compliance status not present in the verified web data captured. Confirm RoHS/REACH status on the official Diodes product page (diodes.com/part/view/PI7C9X3G816GP) before procurement.

Dados verificados em: 2026-10-19 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

PI7C9X3G816GP PI7C9X3G816GP datasheet Diodes Incorporated PI7C9X3G816GP PCIe switch 8-port 16-lane PCIe Gen3 packet switch 324-HFCBGA PCIe switch 19x19 PI7C9X3G816GP NVMe storage switch PI7C9X3G816GP vs Broadcom PEX8xxx PI7C9X3G816GP drop-in replacement equivalent PI7C9X3G816GPBHFCE price buy what is the PI7C9X3G816GP port configuration PCIe Gen3 switch 2-port to 8-port flexible lane width PCIe packet switch for server backplane fan-out

Componentes & termos relacionados

Diodes Incorporated PI7C9X3G816GP PI7C9X3G816GPBHFCE Broadcom PEX8xxx PCI Express Gen 3 packet switch PCIe packet switch PCIe Gen3 SERDES 8 GT/s 324-HFCBGA (19x19 mm) BGA TLP forwarding NVMe SSD storage server expansion backplane networking line card lane width allocation root complex endpoint fan-out link training receiver equalization Mouser Electronics DigiKey TI E2E forum datasheet Revision 4 February 2024
RFQ de cotação rápida
Preencha todos os detalhes — nossa equipe de vendas responderá em até 24 horas
Part number Fabricante Encapsulamento QTY Preço-alvo Total
Total: $0.00 USD
✓
Cotação enviada!

Responderemos seu e-mail em até 24 horas

1
RFQ enviada
2
Cotação recebida
3
Pedido realizado
4
Pagamento
5
Enviado
6
Entregue
Ver detalhes da RFQ