PIC16LF1787-E/ML - 8-bit XLP MCU, 14KB Flash, 44-QFN | Microchip
部品番号: PIC16LF1787-E/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.18 | $3.18 |
| 10 | $2.86 | $28.60 |
| 100 | $2.18 | $218.00 |
| 500 | $1.75 | $875.00 |
| 1,000 | $1.4 | $1,400.00 |
PIC16LF1787-E/ML 概要
A PIC microcontroller (MCU) is a compact programmable processor that combines a CPU core, non-volatile program memory (Flash), working RAM, and a rich set of peripherals — timers, ADC/DAC, communication buses, and interrupt logic — on a single silicon die. The PIC16F/LF family uses a RISC-based 8-bit core optimized for deterministic execution, predictable interrupt latency, and ultra-low sleep currents. Within the broader taxonomy, PIC16F/LF sits between smaller PIC10/12/16 baseline devices and larger PIC18/24 MCUs; the "LF" prefix specifically designates the low-voltage (1.8–3.6 V) XLP variants aimed at energy harvesting and battery applications. The 44-QFN package places the entire MCU + analog chain on a tiny surface-mount footprint suitable for space-constrained consumer, industrial, and IoT products.
Key features include 14 KB self-programmable Flash, 1 KB RAM, 256 bytes of EEPROM, an integrated 12-bit ADC with up to 14 channels, an 8-bit DAC, two operational amplifiers, comparators, and PWM/capture/compare modules. Communication peripherals include I2C, SPI, and EUSART (UART). XLP technology delivers typical sleep currents in the tens of nanoamps and active currents in the microamp-per-MHz range, enabling years of operation from coin-cell or single-AA batteries.
The PIC16LF1787's 8-bit RISC pipeline executes most instructions in one instruction cycle (4 clock cycles), and the 32 MHz internal oscillator removes the need for external crystals in cost-sensitive designs. The on-chip op-amps and 12-bit ADC provide a tightly-integrated analog front-end for sensor conditioning without external active components.
Typical applications include IoT sensor nodes, low-power wireless remote controls, battery-powered instrumentation, portable medical devices, and consumer appliances where the MCU must sleep for long periods and wake to perform quick measurements. Designers also use it in HVAC controls, smart meters, and energy-harvesting switches.
When designing with this device, remember that the "LF" voltage range is 1.8–3.6 V — it cannot be used on 5 V rails. Decouple VDD with at least 100 nF close to the pin, configure unused pins as outputs (not inputs) to minimize leakage, and use the nanoWatt XLP sleep modes to achieve the lowest quiescent current.
This page combines distributor pricing, drop-in package alternatives, and practical design notes — engineering guidance not packaged together in the manufacturer's datasheet PDF.
ドロップイン代替品: PIC16LF1787-E/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC16LF1787-E/ML （同一形状・フットプリント） — 相違点: ADC, DAC, Package, Program Memory (Flash), Communication.
クイック比較ツール — 並列比較する代替部品を選択:
PIC16LF1787-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.63 / 個
データシートを見る →PIC16LF1789-E/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC16LF1784-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.15 / 個
データシートを見る →PIC16LF1783-E/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1.92 / 個
データシートを見る →PIC16LF1787T-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC16LF1787-E/ML 最大定格＆電気的特性
| Product Family | PIC16 LF XLP 8-bit Microcontroller |
| Core Architecture | PIC16 (8-bit RISC, 14-bit instruction word) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data RAM | 1 KB |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz (8 MIPS) |
| Operating Voltage Range | 1.8 V to 3.6 V (LF low-voltage variant) |
| パッケージ | 44-QFN (8x8 mm), leadless |
| ピン数 | 44 |
| I/O Pins | 36 (approx., per QFN-44 variant) |
| ADC | 12-bit, up to 14 channels |
| DAC | 8-bit on-chip |
| Op-Amps | 2 on-chip operational amplifiers |
| Communication | I2C, SPI, EUSART (UART) |
| 動作温度範囲 | -40 C to +125 C (E grade = extended) |
| XLP Sleep Current | NanoWatt XLP, typical < 100 nA (per datasheet) |
| Temperature Grade | AUTOMOTIVE (E suffix) |
| RoHS ステータス | Compliant |
| Lead Finish / Terminal | NO LEAD (QFN) |
PIC16LF1787-E/ML ピン構成
| ピン 1 | RA0/AN0 — GPIO / Analog input channel 0 |
| ピン 2 | RA1/AN1 — GPIO / Analog input channel 1 |
| ピン 3 | RA2/AN2 — GPIO / Analog input channel 2 |
| ピン 4 | RA3/AN3 — GPIO / Analog input channel 3 |
| ピン 5 | RA4/AN4 — GPIO / Analog input channel 4 |
| ピン 6 | RA5/AN5 — GPIO / Analog input channel 5 |
| ピン 7 | RA6/OSC2 — GPIO / Oscillator output |
| ピン 8 | RA7/OSC1 — GPIO / Oscillator input |
| ピン 9 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| ピン 10 | VSS — Ground reference |
| ピン 11 | RB0/AN12 — GPIO / Analog input channel 12 |
| ピン 12 | RB1/AN10 — GPIO / Analog input channel 10 |
| ピン 13 | RB2/AN8 — GPIO / Analog input channel 8 |
| ピン 14 | RB3/AN9 — GPIO / Analog input channel 9 |
| ピン 15 | RB4/AN11 — GPIO / Analog input channel 11 |
| ピン 16 | RB5/AN13 — GPIO / Analog input channel 13 |
| ピン 17 | RB6/PGC — GPIO / ICSP clock (programming) |
| ピン 18 | RB7/PGD — GPIO / ICSP data (programming) |
| ピン 19 | MCLR/VPP — Master clear (reset) / programming voltage |
| ピン 20 | VSS — Ground reference |
| ピン 21 | VDD — Positive supply voltage |
| ピン 22 | RC0 — GPIO port C |
| ピン 23 | RC1 — GPIO port C |
| ピン 24 | RC2 — GPIO port C |
| ピン 25 | RC3/SCL — GPIO / I2C clock |
| ピン 26 | RC4/SDA — GPIO / I2C data |
| ピン 27 | RC5 — GPIO port C |
| ピン 28 | RC6/TX — GPIO / UART transmit |
| ピン 29 | RC7/RX — GPIO / UART receive |
| ピン 30 | VSS — Ground reference |
| ピン 31 | VDD — Positive supply voltage |
| ピン 32 | RD0 — GPIO port D |
| ピン 33 | RD1 — GPIO port D |
| ピン 34 | RD2 — GPIO port D |
| ピン 35 | RD3 — GPIO port D |
| ピン 36 | RD4 — GPIO port D |
| ピン 37 | RD5 — GPIO port D |
| ピン 38 | RD6 — GPIO port D |
| ピン 39 | RD7 — GPIO port D |
| ピン 40 | RE0 — GPIO port E |
| ピン 41 | RE1 — GPIO port E |
| ピン 42 | RE2 — GPIO port E |
| ピン 43 | RE3 — GPIO port E (input-only on most PIC16) |
| ピン 44 | EP — Exposed thermal pad (must be soldered to VSS plane) |
主な用途
PIC16LF1787-E/ML の用途: 6 件s: Battery-Powered IoT Sensor Node, Portable Medical Monitoring Device, Smart Energy Meter / Home Energy Monitor, Industrial HVAC Control Module, Consumer Appliance User Interface Controller, Automotive Body Electronics Sensor Cluster.
Battery-Powered IoT Sensor Node
The PIC16LF1787-E/ML fits battery-powered IoT sensor nodes because its XLP sleep current under 100 nA lets it sleep for years on a coin cell and wake only when a measurement is needed. The integrated 12-bit ADC with up to 14 channels handles multiple sensors (temperature, humidity, light) directly, while the on-chip op-amps condition low-amplitude analog signals without external amplifiers. At a 32 MHz core speed, the MCU completes sensor reads, averaging, and packet framing in microseconds before returning to deep sleep, preserving battery life. Designers wire it between a CR2032 cell and an SPI/I2C sensor or low-power RF transceiver like the MRF24J40, using the QFN-44's compact 8x8 mm footprint for tiny wearable or environmental sensor form factors.
おすすめ
Portable Medical Monitoring Device
The PIC16LF1787-E/ML is well suited for portable medical monitoring such as pulse oximeters, glucose meters, and wearable health patches because its LF low-voltage operation (1.8–3.6 V) matches single lithium or coin-cell chemistries. The on-chip 12-bit ADC and dual op-amps provide the analog front-end for photodiode or bio-potential signal conditioning without external instrumentation amplifiers, shrinking the BOM and reducing noise pickup. XLP technology ensures patient-safe low EMI and years of standby operation. The 44-QFN package fits inside small medical enclosures where board space is at a premium, and the extended -40 C to +125 C temperature grade supports clinical and home-environment variability.
おすすめ
Smart Energy Meter / Home Energy Monitor
The PIC16LF1787-E/ML serves smart energy metering and home energy monitor designs where its 12-bit ADC and op-amps accurately digitize current-sense shunt or CT outputs while XLP sleep modes keep standby draw negligible. The MCU's 14 KB Flash is sufficient for energy-calculation firmware, segmented LCD or LED drivers, and communication protocol stacks (Modbus, DLMS, or simple UART bridges). Operating from 1.8–3.6 V lets it share a single low-voltage rail with a wireless M-Bus, LoRa, or Wi-Fi co-processor. The automotive-grade E temperature range (-40 C to +125 C) ensures reliable operation in meter cabinets exposed to outdoor temperature swings.
おすすめ
Industrial HVAC Control Module
Industrial HVAC control modules benefit from the PIC16LF1787-E/ML because the integrated op-amps drive thermistor bridges, the 12-bit ADC reads multiple temperature and pressure zones, and the PWM modules control fan speeds or valve actuators with minimal external circuitry. The extended -40 C to +125 C temperature grade handles attic and rooftop HVAC environments. The 44-QFN package's small 8x8 mm footprint and integrated peripherals reduce part count on the control board, while I2C/SPI connect to external EEPROM, RTC, and display drivers. Microchip's MPLAB X IDE and code configurator streamline firmware development for HVAC engineers transitioning from PIC18 platforms.
おすすめ
Consumer Appliance User Interface Controller
The PIC16LF1787-E/ML is a good fit for consumer appliance user-interface controllers (coffee makers, washing machines, microwave ovens) where it scans keypads, drives LED or segment displays, and orchestrates main SoC communication over UART or SPI. The integrated 12-bit ADC reads potentiometers or thermistors for user-set parameters, and the on-chip DAC generates beeps or analog reference voltages. Operating from a 3.3 V rail common in modern appliances, it pairs with Wi-Fi/BLE co-processors for smart-home connectivity. The 44-QFN keeps the controller board compact enough to fit behind an appliance's display panel.
おすすめ
Automotive Body Electronics Sensor Cluster
The PIC16LF1787-E/ML (extended automotive temperature grade) fits automotive body-electronics sensor clusters such as ambient light modules, rain sensors, or seat-occupancy detectors. Its 12-bit ADC and dual op-amps condition photodiode or capacitive-sensor outputs, while XLP sleep modes keep quiescent draw low to avoid draining the vehicle battery when parked. AEC-Q100-style qualification and the -40 C to +125 C range support under-hood and cabin environments. The 44-QFN package withstands automotive vibration profiles when properly PCB-mounted, and the EUSART/UART peripherals interface with CAN transceivers or LIN bus controllers in body-control networks.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC16LF1787-E/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC16LF1787-I/ML | PIC16LF1789-E/ML | PIC16LF1784-I/ML | PIC16LF1783-E/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Flash Memory | 14 KB | 14 KB | 28 KB | 7 KB | 7 KB |
| Data RAM | 1 KB | 1 KB | 2 KB | 512 B | 512 B |
| CPU Speed | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| ADC Resolution | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| Temperature Grade | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +125 C (E) |
主な差別化要因
- Extended automotive temperature grade with same peripherals as the 1787 （vs PIC16LF1787-I/ML)
- Larger Flash and RAM in the same QFN-44 footprint （vs PIC16LF1784-I/ML)
- 12-bit ADC with dual on-chip op-amps and 8-bit DAC （vs PIC16LF1783-E/ML)
設計ノート
Estimated: at 32 MHz active, the PIC16LF1787-E/ML draws approximately 7 mA from a 3.3 V supply, giving ~23 mW of dissipation. In XLP sleep mode the current drops below 100 nA, so for a sensor-node duty cycle of 0.1% the average draw is well under 10 uA. Decouple every VDD pin with a 100 nF ceramic capacitor placed within 3 mm of the pin and add a bulk 1 uF to 10 uF on the main supply rail to handle core transient currents.
The 44-QFN (8x8 mm) package has an exposed thermal pad (EP) on the underside that must be soldered to a VSS copper pour, both for thermal dissipation and for ground continuity. Use at least four thermal vias in the EP land pattern to sink heat into inner ground planes. Keep the EP land at least 50% covered with solder paste and ensure the PCB stencil aperture covers the entire pad for reliable assembly per IPC-7351.
Do not apply 5 V to VDD or any I/O pin — the LF (low-voltage) variant is rated only to 3.6 V and will be damaged. Configure unused I/O pins as outputs (not inputs) to eliminate floating-input leakage that can dramatically increase sleep current. When using the internal 32 MHz oscillator, allow at least 1 ms startup time before executing peripheral-dependent code; check OSCCON.HFIOFS in firmware before switching to high-frequency mode.
コンプライアンス情報
RoHS and lead-free confirmed by Microchip product page and DigiKey listing (2026-09-24). AEC-Q100 status not explicitly confirmed in the retrieved data - verify with Microchip for automotive qualification requirements.
