PIC16LF18855T-I/MV - 8-Bit 32MHz XLP MCU, 14KB Flash, 28-UQFN
部品番号: PIC16LF18855T-I/MV ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.32 | $2.32 |
| 10 | $2.08 | $20.80 |
| 100 | $1.78 | $178.00 |
| 500 | $1.55 | $775.00 |
| 1,000 | $1.39 | $1,390.00 |
PIC16LF18855T-I/MV 概要
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile Flash memory, RAM, EEPROM, peripherals, and I/O on one die, optimized for deterministic real-time control in cost- and power-constrained designs. 8-bit MCUs sit at the bottom of the microcontroller taxonomy (8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC) and remain the dominant choice for simple sensing, driving, and human-interface tasks where latency, code density, and nanoamp sleep currents matter more than raw arithmetic throughput.
The PIC16LF18855T-I/MV integrates a 10-bit ADC with computation, a 5-bit DAC, three 16-bit timers, two comparators, an 8-bit DAC reference, configurable logic cells (CLC), complementary waveform generators, signal measurement timers, and zero-cross detect peripherals. Core-independent peripherals offload tasks from the CPU, while the XLP nanoWatt technology delivers typical sleep currents in the nanoamp range, enabling battery-powered products measured in years of operation.
The 28-UQFN package has a 4x4 mm footprint and includes an exposed thermal pad that must be soldered to the ground plane for electrical performance and thermal dissipation. Communication peripherals include I2C, SPI, and EUSART, supporting sensor hubs, LED drivers, and small human-interface boards.
Typical applications include low-power IoT sensor nodes, battery-powered consumer devices, LED lighting controllers, sensor signal conditioning, and small home appliances. Industrial use cases include remote controls, handheld instrumentation, and energy-harvesting endpoints.
When designing with this MCU, the LF prefix denotes the low-voltage (1.8V to 3.6V) variant - do not confuse with the PIC16F18855 which operates up to 5.5V. Decoupling capacitors must be placed within 3 mm of each power pin, and the exposed pad must be soldered to a continuous ground plane. MPLAB X IDE with XC8 compiler supports the PIC16LF18855 family out of the box.
This page synthesizes distributor stock data, same-family drop-in alternatives, and design guidance not collected on the manufacturer datasheet alone.
ドロップイン代替品: PIC16LF18855T-I/MV — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC16LF18855T-I/MV （同一形状・フットプリント） — 相違点: Package, ADC, Operating Temperature, Program Memory (Flash), Core.
クイック比較ツール — 並列比較する代替部品を選択:
PIC16LF18855-I/MV
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC16F18855T-I/MV
✅ ドロップイン✓ 在庫あり
$0.85 / 個
データシートを見る →PIC16LF18854T-I/MV
✅ ドロップイン✓ 在庫あり
$0.98 / 個
データシートを見る →PIC16LF1789T-I/MV
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC16LF18855T-I/MV 最大定格＆電気的特性
| Core | PIC 8-bit enhanced mid-range |
| Family | PIC16(L)F1885x / PIC16(L)F1887x |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data RAM | 1 KB |
| Data EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage (Vdd) | 1.8 V to 3.6 V (LF variant) |
| パッケージ | 28-UQFN (4x4 mm) with exposed pad (MV) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 C to +85 C (Industrial, 'I' suffix) |
| ADC | 10-bit with computation |
| DAC | 5-bit and 10-bit options |
| Comparators | 2 |
| Timers | 3 x 16-bit (TMR0/1/2, plus SMT and HLT) |
| Communication | I2C, SPI, EUSART (1 each) |
| Core-Independent Peripherals | CLC, CWG, NCO, DSM, ZCD, CRC/SCAN |
| XLP (eXtreme Low Power) | Yes - nanoWatt technology |
| RoHS | Compliant |
| Peripheral Pin Select (PPS) | Yes |
PIC16LF18855T-I/MV ピン構成
| ピン 1 | RA5 — GPIO / ADC / ICSP data |
| ピン 2 | RA4 — GPIO / ADC / CLC |
| ピン 3 | RA3 — GPIO / MCLR/Vpp (input only) |
| ピン 4 | RA2 — GPIO / ADC / DAC ref |
| ピン 5 | RA1 — GPIO / ADC / ICSP clock |
| ピン 6 | RA0 — GPIO / ICSP data |
| ピン 7 | Vdd — Positive supply (1.8V-3.6V) |
| ピン 8 | Vss — Ground |
| ピン 9 | RB7 — GPIO / I2C SDA / PPS |
| ピン 10 | RB6 — GPIO / I2C SCL / PPS |
| ピン 11 | RB5 — GPIO / SPI SS / PPS |
| ピン 12 | RB4 — GPIO / SPI SDI / PPS |
| ピン 13 | RB3 — GPIO / SPI SCK / PPS |
| ピン 14 | RB2 — GPIO / SPI SDO / PPS |
| ピン 15 | RB1 — GPIO / EUSART RX / PPS |
| ピン 16 | RB0 — GPIO / EUSART TX / PPS |
| ピン 17 | RC7 — GPIO / PWM / CWG |
| ピン 18 | RC6 — GPIO / PWM / CWG |
| ピン 19 | RC5 — GPIO / PWM / DAC output |
| ピン 20 | RC4 — GPIO / PWM / comparator |
| ピン 21 | RC3 — GPIO / PWM / comparator |
| ピン 22 | RC2 — GPIO / PWM / ADC |
| ピン 23 | RC1 — GPIO / PWM / ADC |
| ピン 24 | RC0 — GPIO / PWM / ADC |
| ピン 25 | RA7 — GPIO / oscillator / ADC |
| ピン 26 | RA6 — GPIO / oscillator out |
| ピン 27 | Vss (EP) — Exposed pad - must be soldered to ground plane |
| ピン 28 | Vdd — Positive supply (1.8V-3.6V) |
主な用途
PIC16LF18855T-I/MV の用途: 6 件s: Battery-Powered IoT Sensor Nodes, LED Lighting Controllers, Low-Power Sensor Signal Conditioning, Remote Controls and HMI, Consumer Appliance Control Boards, Handheld Test & Measurement Instruments.
Battery-Powered IoT Sensor Nodes
The PIC16LF18855T-I/MV's nanoWatt XLP technology and 1.8V-3.6V Vdd range make it ideal for coin-cell or AA-powered wireless sensor nodes. The 14KB Flash accommodates BLE/Zigbee host-stack fragments and sensor drivers, while the 10-bit ADC with computation handles analog sensor inputs. Integrated I2C/SPI support standard digital sensors, and sleep currents in the nanoamp range allow multi-year battery life. Unlike 32-bit Cortex-M parts, this MCU delivers deterministic interrupt response and shorter code density for periodic sensor reads.
おすすめ
LED Lighting Controllers
The PIC16LF18855T-I/MV drives multichannel LED strings using its 16-bit PWM, complementary waveform generator (CWG), and 10-bit DAC for analog dimming. The 32 MHz core generates flicker-free PWM at 20 kHz+ while leaving CPU headroom for DMX/DALI protocol parsing. Core-independent peripherals handle LED faults in hardware without CPU intervention. Operating from 1.8V-3.6V allows direct Li-ion battery drive for portable fixtures, eliminating the boost converter.
おすすめ
Low-Power Sensor Signal Conditioning
The PIC16LF18855T-I/MV's 10-bit ADC with computation, two comparators, and 5/10-bit DACs form a complete analog front-end on-chip. The ADC's oversampling and threshold-detection offload signal processing, while the DAC generates excitation voltages for bridge sensors. Operates at sub-microamp sleep current between measurements, suiting battery-powered industrial transmitters. The XLP sleep mode preserves calibration data in EEPROM while drawing nanoamps, enabling decade-long battery life.
おすすめ
Remote Controls and HMI
The PIC16LF18855T-I/MV powers infrared/RF remote controls, replacing mechanical keypads with capacitive-touch input. The capacitive touch peripherals and configurable logic cells (CLC) deliver robust touch sensing without external ICs. The 14KB Flash stores button mapping, IR protocols, and sleep/wake logic. Sleep current under 100 nA enables multi-year coin-cell operation. PPS flexibility reassigns peripherals for compact PCB layouts.
おすすめ
Consumer Appliance Control Boards
The PIC16LF18855T-I/MV handles keypad scan, LCD/LED display driving, motor timing, and safety interlocks in small kitchen and home appliances. The three 16-bit timers deliver precise PWM for DC motor control at 25 kHz+, while the comparators provide overcurrent protection. EEPROM stores user presets across power cycles. The wide 1.8V-3.6V supply simplifies USB-bus-powered or 2x AA designs, and PPS simplifies PCB layout by allowing peripherals on any I/O pin.
おすすめ
Handheld Test & Measurement Instruments
The PIC16LF18855T-I/MV's 10-bit ADC, comparators, and 5-bit DAC support portable multimeters, cable testers, and environmental meters. With 14KB Flash, firmware fits autoranging algorithms, display drivers, and USB-CDC stacks. XLP sleep enables handheld units that run years on AAA cells. The ICSP debug interface and PICkit 4 support accelerate prototype bring-up; PPS simplifies routing to LCD and rotary encoder pins.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC16LF18855T-I/MV — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC16LF18855-I/MV | PIC16F18855T-I/MV | PIC16LF18854T-I/MV | PIC16LF1789T-I/MV |
|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm, MV) | 28-UQFN (4x4 mm, MV) - same | 28-UQFN (4x4 mm, MV) - same | 28-UQFN (4x4 mm, MV) - same | 28-UQFN (4x4 mm, MV) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC 8-bit enhanced mid-range | PIC 8-bit enhanced mid-range | PIC 8-bit enhanced mid-range | PIC 8-bit enhanced mid-range | PIC 8-bit enhanced mid-range |
| Program Memory (Flash) | 14 KB | 14 KB | 14 KB | 7 KB | 28 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 2 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B |
| Operating Voltage | 1.8V - 3.6V (LF) | 1.8V - 3.6V (LF) | 2.3V - 5.5V (F) | 1.8V - 3.6V (LF) | 1.8V - 3.6V (LF) |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Packaging Form | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
主な差別化要因
- True 1.8V minimum Vdd for single-cell Li-ion operation （vs PIC16F18855T-I/MV)
- NanoWatt XLP sleep current in the nA range （vs PIC16LF18854T-I/MV)
- Compact 4x4 mm UQFN footprint for space-constrained designs （vs PIC16LF18855T-I/SS)
設計ノート
The LF (1.8V-3.6V) variant requires careful attention to absolute-maximum Vdd. Do not power from 5V rails - use PIC16F18855T-I/MV instead. Decouple each Vdd pin with a 100nF ceramic capacitor placed within 3 mm of the pin, plus a bulk 1uF-10uF tantalum or ceramic on the main supply. For battery applications, the XLP sleep mode draws nanoamps but ensure all I/O pins are configured as analog (low) or outputs before WFI to avoid parasitic currents.
The 28-UQFN MV package has an exposed thermal/ground pad (pin 27) on the underside. This pad MUST be soldered to a continuous ground plane on the PCB for electrical and thermal performance - poor soldering causes erratic behavior, weak ADC readings, and thermal shutdown. Use a 0.25mm via array (5-9 vias) to stitch the EP to the ground plane. Keep traces away from the EP pad area to prevent solder wicking.
Do not confuse the MV package (28-UQFN 4x4 mm) with the ML package (28-QFN 6x6 mm) or SS package (28-SSOP) - the land patterns are physically incompatible. When migrating from prototype (ML/SS) to production (MV), the PCB must be re-laid out. Also remember that the LF silicon differs from F silicon in Vdd ceiling; mixing them in the same BOM causes brownouts on F devices placed in LF sockets.
Place the ICSP programming header (RA0/RA1/RA3/MCLR/Vdd/Vss) on the edge of the board for in-circuit programming access. Use PPS to route peripherals away from programming pins so the ICSP interface does not conflict with application I/O. Keep analog signals (ADC inputs, DAC outputs) short and guarded with ground traces to minimize crosstalk with digital PWM signals on the same port.
コンプライアンス情報
RoHS and REACH compliance per Microchip product declaration. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified. Refer to Microchip Material Declaration for full disclosure.
