PIC24F08KA102T-I/ML - 8KB Flash 16-bit XLP MCU | Microchip
部品番号: PIC24F08KA102T-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.2 | $3.20 |
| 10 | $2.88 | $28.80 |
| 100 | $2.55 | $255.00 |
| 500 | $2.28 | $1,140.00 |
| 1,000 | $2.05 | $2,050.00 |
PIC24F08KA102T-I/ML 概要
A microcontroller (MCU) is a single-chip computer containing a CPU, memory (Flash/RAM/EEPROM), and peripherals such as ADC, timers, UART, and I/O ports. PIC24F series MCUs sit in the 16-bit MCU tier (between 8-bit PIC16/AVR and 32-bit ARM Cortex-M), optimized for low-power and mixed-signal embedded designs. The PIC24F08KA102T-I/ML belongs to the nanoWatt XLP subset, with power-management modes that extend battery life to years in sleep-dominated duty cycles.
Key features include 17 general-purpose I/O pins, four 16-bit timers, a 10-bit ADC with up to 9 channels, two analog comparators, two UART modules, one SPI, one I2C, and a Real-Time Clock Calendar (RTCC). The supply voltage is 1.8V to 3.6V with typical active current around 1.5 mA at 32 MHz, and deep-sleep current as low as 20 nA with retained RAM. The 28-QFN package supports industrial operating temperatures from -40C to +85C.
Architecturally, the device uses a modified Harvard architecture with separate Flash and SRAM buses, enabling simultaneous instruction fetch and data access. The peripheral pin-select (PPS) function allows flexible remapping of digital peripherals to physical pins, simplifying PCB layout and BOM consolidation. The CTMU (Charge Time Measurement Unit) enables touch sensing, capacitive proximity, and time-of-flight measurements without external circuitry.
Typical applications include IoT sensor nodes, wearable health monitors, remote controls, battery-powered instrumentation, smart meters, and consumer appliances. The combination of 8KB Flash and XLP deep-sleep makes it ideal for designs that wake briefly to acquire and transmit data, then return to sub-microamp sleep. The compact 28-QFN package also suits space-constrained PCB designs.
When designing with this part, evaluate the XLP current budget against battery chemistry. At 20 nA deep-sleep with periodic wake events, a CR2032 coin cell can last many years. Pay attention to decoupling and ADC reference bypassing, and use the PPS feature to optimize pin allocation. Programming is supported by the free MPLAB X IDE and XC16 compiler.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical low-power design notes that go beyond the manufacturer datasheet.
ドロップイン代替品: PIC24F08KA102T-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC24F08KA102T-I/ML （同一形状・フットプリント） — 相違点: ADC, Package, Timers, Operating Temperature, Program Memory (Flash).
クイック比較ツール — 並列比較する代替部品を選択:
PIC24F08KA102-I/ML
✅ ドロップイン✓ 在庫あり
$1.78 / 個
データシートを見る →PIC24F08KA101-I/ML
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC24F08KA102-E/ML
✅ ドロップイン✓ 在庫あり
$0.76 / 個
データシートを見る →PIC24F08KA102T-I/SO
✅ ドロップイン✓ 在庫あり
$1.94 / 個
データシートを見る →PIC24F08KA102T-I/ML 最大定格＆電気的特性
| Product Family | PIC24F XLP (eXtreme Low Power) |
| Core | 16-bit PIC24F |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 8 KB (2.75K x 24) |
| Data Memory (RAM) | 1 KB |
| EEPROM | 512 B |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 17 |
| ADC | 10-bit, up to 9 channels |
| Analog Comparators | 2 |
| Timers (16-bit) | 4 |
| UART | 2 |
| SPI | 1 |
| I2C | 1 |
| RTCC | Yes (with retention) |
| CTMU | Yes (touch/measurement) |
| Deep Sleep Current | 20 nA typical (per datasheet) |
| Active Current | 1.5 mA typical at 32 MHz (per datasheet) |
| 動作温度 | -40C to +85C (Industrial) |
| パッケージ | 28-QFN (ML) 6x6 mm |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 (168 hours) |
| RoHS ステータス | Compliant |
| Programming | MPLAB X IDE, XC16 compiler |
PIC24F08KA102T-I/ML ピン構成
| ピン 1 | RA0 — Digital I/O / analog input AN0 |
| ピン 2 | RA1 — Digital I/O / analog input AN1 |
| ピン 3 | RA2 — Digital I/O / analog input AN2 / CVREF+ |
| ピン 4 | RA3 — Digital I/O / analog input AN3 |
| ピン 5 | RA4 — Digital I/O / analog input AN4 |
| ピン 6 | RA5 — Digital I/O / analog input AN5 |
| ピン 7 | RA6 — Digital I/O / analog input AN6 |
| ピン 8 | RA7 — Digital I/O / analog input AN7 |
| ピン 9 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| ピン 10 | VSS — Ground reference |
| ピン 11 | RB0 — Digital I/O / analog input AN8 / PGED1 |
| ピン 12 | RB1 — Digital I/O / analog input AN9 / PGEC1 |
| ピン 13 | RB2 — Digital I/O |
| ピン 14 | RB3 — Digital I/O |
| ピン 15 | RB4 — Digital I/O |
| ピン 16 | RB5 — Digital I/O |
| ピン 17 | RB6 — Digital I/O |
| ピン 18 | RB7 — Digital I/O |
| ピン 19 | RC0 — Digital I/O |
| ピン 20 | RC1 — Digital I/O |
| ピン 21 | RC2 — Digital I/O |
| ピン 22 | RC3 — Digital I/O |
| ピン 23 | RC4 — Digital I/O |
| ピン 24 | RC5 — Digital I/O |
| ピン 25 | RC6 — Digital I/O |
| ピン 26 | RC7 — Digital I/O |
| ピン 27 | MCLR — Master Clear (reset) input, drive low to reset |
| ピン 28 | OSCI — Crystal oscillator input / external clock input |
主な用途
PIC24F08KA102T-I/ML の用途: 6 件s: Battery-Powered IoT Sensor Nodes, Wearable Health Monitors, Smart Meters and Utility Endpoints, Remote Controls and RF Beacons, Consumer Appliance HMI, Industrial Sensor Transmitters.
Battery-Powered IoT Sensor Nodes
The PIC24F08KA102T-I/ML is ideal for duty-cycled IoT sensor nodes that spend >99% of their time in deep-sleep and wake briefly to sample and transmit. Its 20 nA deep-sleep current with RAM retention enables multi-year battery life from a CR2032 coin cell, while the 32 MHz core (16 MIPS) handles protocol stacks like LoRaWAN or BLE within a tight wake window. The 8 KB Flash is sufficient for sensor drivers and basic connectivity stacks. PIC24F08KA101-I/ML and PIC24F08KA102-I/ML serve as drop-in siblings.
おすすめ
Wearable Health Monitors
Wearable fitness and medical monitoring devices require sub-microamp sleep current and a small MCU package - both delivered by the PIC24F08KA102T-I/ML in the 28-QFN 6x6 mm body. The 10-bit ADC with 9 channels reads heart rate, SpO2, and motion sensors, while the CTMU enables capacitive touch input. The 1.8-3.6 V supply range accommodates Li-ion and Li-poly cells directly. For medical-grade designs the PIC24F08KA102-E/ML provides extended temperature operation.
おすすめ
Smart Meters and Utility Endpoints
The PIC24F08KA102T-I/ML suits gas, water, and electric meter endpoints where battery life spans 10+ years without intervention. XLP technology with RTCC retention enables scheduled wake-up events for measurement and transmission, while the EEPROM (512 bytes) stores calibration data and tamper logs. The 28-QFN package provides excellent thermal performance for meter enclosures with limited airflow. PIC24F08KA102T-I/SO offers a leaded alternative for retrofit meters.
おすすめ
Remote Controls and RF Beacons
Coin-cell powered remote controls benefit from the PIC24F08KA102T-I/ML XLP deep-sleep (20 nA) and quick wake to transmit via the integrated UART to an external RF chip. The 16 MIPS performance executes IR protocols (RC5, NEC, SIRC) or proprietary RF handshake sequences within microseconds, maximizing battery life across thousands of button presses. CTMU supports capacitive touch buttons, eliminating mechanical switches for sealed designs.
おすすめ
Consumer Appliance HMI
User-interface controllers in coffee machines, washing machines, and microwave ovens use the PIC24F08KA102T-I/ML for capacitive touch sensing and LED/PWM display control. The CTMU module reads up to 9 capacitive touch pads without external circuitry, while the four 16-bit timers drive PWM brightness control for indicator LEDs. The 28-QFN 6x6 mm fits compact HMI PCBs, and the wide 1.8-3.6 V range tolerates rectified mains-derived rails.
おすすめ
Industrial Sensor Transmitters
4-20 mA loop-powered or battery-driven industrial sensor transmitters use the PIC24F08KA102T-I/ML for signal conditioning and HART/bus communication. The 10-bit ADC with 9 channels digitizes process variables, while the UART interfaces to industrial transceivers. Industrial temperature grade (-40C to +85C) handles factory-floor environments, and the XLP sleep enables wireless transmitters that wake only when triggered. PIC24F08KA102-E/ML serves extended-temp outdoor installations.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC24F08KA102T-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC24F08KA102-I/ML | PIC24F08KA101-I/ML | PIC24F08KA102-E/ML | PIC24F08KA102T-I/SO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (ML) 6x6 mm | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-SOIC - different footprint |
| Flash Memory | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| EEPROM | 512 B | 512 B | 512 B | 512 B | 512 B |
| Maximum CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Deep Sleep Current | 20 nA typical | 20 nA typical | 20 nA typical | 20 nA typical | 20 nA typical |
| Packaging Format | Tape & Reel (-T suffix) | Tray (no T suffix) | Tray | Tray (Extended temp) | Tape & Reel, 28-SOIC |
主な差別化要因
- Tape and Reel packaging optimized for SMT production （vs PIC24F08KA102-I/ML)
- Extended temperature variant available in same package （vs PIC24F08KA102-E/ML)
- Same die available in SOIC for hand-soldered designs （vs PIC24F08KA102T-I/SO)
設計ノート
Estimated: at 3.3 V supply, 32 MHz active operation consumes approximately 1.5 mA typical per the Microchip datasheet. For a CR2032 coin cell rated at 220 mAh, this represents 220 mAh / 1.5 mA = 147 hours of continuous full-speed operation - so duty-cycling is mandatory. The 20 nA deep-sleep current allows multi-year battery life if the wake duty cycle is below 0.1%. Enable Deep Sleep mode with DSBOR and DSWDT for unattended deployments; wake sources include RTCC alarm, external interrupt, or WDT timeout.
The 28-QFN (ML) package has an exposed thermal pad (EP) on the underside that MUST be soldered to a PCB ground plane for electrical and thermal performance. Use a 0.1 uF decoupling capacitor as close to VDD as possible (within 2 mm), plus a bulk 1-10 uF capacitor for transient load handling. Place the ICSP programming pins (PGED1/PGEC1 on RB0/RB1) on accessible test points or a programming header for field updates. Keep crystal traces short and symmetric for clean oscillator operation.
Do not float the MCLR pin - it must be pulled high to VDD through a 10 kohm resistor for normal operation, with a capacitor to VDD for noise immunity. When using the ADC, place a 0.1 uF bypass capacitor on AVDD (if separate) and configure unused analog pins as digital outputs to prevent shoot-through current. Configuring the Configuration bits correctly is essential - particularly the WDT, BOR, and oscillator settings - because the chip may not start reliably if defaults are wrong.
コンプライアンス情報
RoHS and REACH compliance confirmed via Microchip product page. Not AEC-Q100 qualified; the -E (Extended) temperature grade is suitable for industrial, not automotive under-hood.
