PIC24F08KL402-I/ML - 16-bit MCU, 8KB Flash, 32MHz | Microchip
部品番号: PIC24F08KL402-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.05 | $2.05 |
| 10 | $1.84 | $18.40 |
| 100 | $1.62 | $162.00 |
| 500 | $1.42 | $710.00 |
| 1,000 | $1.25 | $1,250.00 |
PIC24F08KL402-I/ML 概要
A microcontroller (MCU) is a single-chip computer containing a processor core, program and data memory, and integrated peripherals such as timers, communication interfaces and analog blocks. The PIC24F family sits at the low-power, low-cost end of Microchip's 16-bit MCU portfolio, sitting below dsPIC and PIC24EP parts in performance hierarchy. Compared with 8-bit PIC MCUs, PIC24F devices offer 16-bit data paths, higher MIPS per MHz and richer peripherals, while keeping the same MPLAB X IDE and XC16 toolchain compatibility. The KL402 sub-family further adds nanoWatt XLP sleep modes that drop current into the nanoampere range for battery-powered designs.
Key features include 17 general-purpose I/O pins, a 10-bit ADC with multiple channels, two UART modules, MSSP (I2C/SPI), CCP/ECCP capture/compare/PWM peripherals, and 5 timer modules. The 10-bit ADC supports up to 12 input channels with automatic sampling. Real-time clock, hardware CRC and a charge time measurement unit (CTMU) for capacitive touch round out the on-chip peripheral set. The device also integrates a 32 kHz low-power oscillator and supports multiple low-power sleep modes including Sleep, Idle and Doze.
The PIC24F08KL402 uses a modified Harvard architecture with a 16-bit datapath and 24-bit instruction word, achieving 16 MIPS at 32 MHz. The CIP (Core Independent Peripherals) concept allows peripherals to operate without CPU intervention, reducing firmware complexity and active-time power. The CTMU enables mTouch capacitive touch sensing without an external charge pump, while the MSSP peripheral supports both I2C and SPI masters/slaves, simplifying sensor and display integration.
Typical applications include low-power IoT sensor nodes, consumer white goods, home automation, battery-powered handheld instruments, LED lighting control, and cost-sensitive industrial controls. The combination of XLP sleep currents under 100 nA and the 32 MHz performance makes it well suited for products that spend most of their life in sleep but wake periodically to perform measurement or communication tasks.
When designing with this part, plan the layout to keep the exposed thermal pad (EP) soldered to the ground plane for mechanical strength and thermal relief. Use MPLAB X IDE with the XC16 compiler for firmware development, and consider the free MPLAB Code Configurator (MCC) plug-in to generate peripheral init code. Decouple VDD/VSS with a 100 nF ceramic capacitor close to each power pin pair as called out in the datasheet.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet, giving engineers a single reference for part selection, sourcing and PCB layout.
ドロップイン代替品: PIC24F08KL402-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC24F08KL402-I/ML （同一形状・フットプリント） — 相違点: ADC, Package, Operating Temperature, Core Architecture, Low-Power Technology.
クイック比較ツール — 並列比較する代替部品を選択:
PIC24F08KL402-E/ML
✅ ドロップイン✓ 在庫あり
$1.52 / 個
データシートを見る →PIC24F08KL302-I/ML
✅ ドロップイン✓ 在庫あり
$1.45 / 個
データシートを見る →PIC24F08KA102-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1.78 / 個
データシートを見る →PIC24F08KL402-I/ML 最大定格＆電気的特性
| Core Architecture | PIC24F (16-bit modified Harvard) |
| CPU Clock Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 8 KB (2.75K x 24) |
| Data SRAM | 1 KB |
| Data EEPROM | 512 B |
| Supply Voltage (VDD) | 3.0 V to 3.6 V |
| I/O Pins | 17 |
| ADC | 10-bit, multi-channel |
| UART Modules | 2 |
| MSSP (I2C/SPI) | 1 |
| CCP / ECCP | Yes |
| Timers (16-bit) | 5 |
| 動作温度 | -40C to +85C (Industrial) |
| パッケージ | VQFN-28 (ML) 6x6 mm with EP |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Low-Power Technology | nanoWatt XLP |
| CTMU (Capacitive Touch) | Yes |
PIC24F08KL402-I/ML ピン構成
| ピン 1 | RA0 — Digital I/O / analog input AN0 |
| ピン 2 | RA1 — Digital I/O / analog input AN1 |
| ピン 3 | RA2 — Digital I/O / analog input AN2 |
| ピン 4 | RA3 — Digital I/O / analog input AN3 |
| ピン 5 | RA4 — Digital I/O / analog input AN4 |
| ピン 6 | VDD — Positive supply voltage (3.0-3.6 V) |
| ピン 7 | VSS — Ground reference |
| ピン 8 | OSC1 — Crystal oscillator input / external clock |
| ピン 9 | OSC2 — Crystal oscillator output |
| ピン 10 | RC0 — Digital I/O |
| ピン 11 | RC1 — Digital I/O |
| ピン 12 | RC2 — Digital I/O |
| ピン 13 | RC3 — Digital I/O |
| ピン 14 | RC4 — Digital I/O |
| ピン 15 | RC5 — Digital I/O |
| ピン 16 | RC6 — Digital I/O / UART TX |
| ピン 17 | RC7 — Digital I/O / UART RX |
| ピン 18 | RB0 — Digital I/O / programming pin |
| ピン 19 | RB1 — Digital I/O |
| ピン 20 | RB2 — Digital I/O |
| ピン 21 | RB3 — Digital I/O |
| ピン 22 | RB4 — Digital I/O |
| ピン 23 | RB5 — Digital I/O |
| ピン 24 | RB6 — Digital I/O / ICS PGC |
| ピン 25 | RB7 — Digital I/O / ICS PGD |
| ピン 26 | MCLR — Master clear reset (active low) |
| ピン 27 | AVDD — Analog supply voltage |
| ピン 28 | AVSS — Analog ground reference |
主な用途
PIC24F08KL402-I/ML の用途: 6 件s: Low-Power IoT Sensor Node, Consumer White Goods Control, Battery-Powered Handheld Instruments, Home Automation / Smart Home Devices, LED Lighting Control, Cost-Sensitive Industrial Controls.
Low-Power IoT Sensor Node
The PIC24F08KL402-I/ML is purpose-built for battery-powered IoT sensor nodes thanks to its nanoWatt XLP sleep currents under 100 nA and the 32 MHz / 16 MIPS performance burst capability. With 8 KB Flash and 1 KB SRAM it can host a wireless stack fragment plus sensor processing firmware, while the 17 I/O pins drive multiple sensor interfaces. The CTMU enables capacitive water-level or proximity sensing without extra ICs, cutting BOM cost. Typical duty ratios of 0.1% active / 99.9% sleep extend coin-cell life to multiple years. Compared with 8-bit PIC16 alternatives it doubles code density per instruction and halves active CPU time.
おすすめ
Consumer White Goods Control
The PIC24F08KL402-I/ML fits washing-machine, dishwasher and microwave user-interface panels because it offers the right balance of cost, peripheral count and PCB footprint. The two UARTs drive main board / display communication, the MSSP (I2C/SPI) connects to LED drivers or EEPROM, and the CCP/ECCP modules generate PWM for buzzer, relay or triac control. With 32 MHz CPU speed it can refresh a 7-segment display while servicing UART and ADC without dropped frames. Industrial-grade -40C to +85C operation survives the kitchen thermal environment, and the small 6x6 mm QFN package fits tight UI-board layouts.
おすすめ
Battery-Powered Handheld Instruments
Handheld instruments such as digital thermometers, multimeters and medical spot-check devices benefit from the PIC24F08KL402-I/ML's XLP sleep modes and 10-bit ADC. The ADC supports direct connection to thermistor bridges or shunt resistors, while the CTMU allows capacitive button replacement of mechanical keys - critical for sealed, disinfectable enclosures. 8 KB Flash accommodates calibration tables and small GUI strings, and 1 KB SRAM buffers measurement data between transmission bursts. Power consumption in standby is dominated by the nanoWatt XLP RTC, enabling multi-year battery life in always-on instruments.
おすすめ
Home Automation / Smart Home Devices
Smart thermostats, dimmers, door/window sensors and HVAC controllers leverage the PIC24F08KL402-I/ML's combination of low power, MSSP (I2C/SPI) for sensor/display bus, and 2 UARTs for Wi-Fi/BLE co-processor host links. The CTMU enables modern capacitive touch keypads for thermostats and dimmers, while the 17 I/Os directly drive relays, triacs and status LEDs. With 8 KB Flash, code can implement secure commissioning plus simple OTA bootloader stubs. The 3.3 V supply aligns with common wireless module rails, simplifying power-tree design.
おすすめ
LED Lighting Control
LED drivers and color-mixing controllers use the PIC24F08KL402-I/ML to manage dimming, color-temperature blending, and DMX or DALI communication. The CCP/ECCP modules generate multi-channel PWM at resolutions suitable for high-frequency dimming without visible flicker. The 10-bit ADC reads ambient light sensors and current-shunt amplifiers for closed-loop control, while the MSSP peripheral drives SPI LED driver ICs. With nanoWatt XLP, always-on standby power can stay below 100 uA, meeting stringent energy-saving regulations such as Energy Star. Industrial temp range handles enclosed-luminaire thermal rise.
おすすめ
Cost-Sensitive Industrial Controls
Small industrial controllers such as sensor transmitters, simple PLC slices and remote I/O modules benefit from the PIC24F08KL402-I/ML's industrial temperature rating and rich peripheral set. The two UARTs implement RS-232/RS-485 links via external transceivers, the MSSP handles I2C sensor networks, and the 10-bit ADC reads 4-20 mA loops through burden resistors. With 8 KB Flash and 1 KB SRAM, code space is sufficient for Modbus RTU slave or simple proprietary protocols. The 32 MHz performance ensures deterministic loop times below 10 ms even with multiple communication stacks active.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC24F08KL402-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC24F08KL402-E/ML | PIC24F08KL302-I/ML | PIC24F08KL402-E/SP | PIC24F08KA102-I/ML | PIC24F08KL401-I/SS |
|---|---|---|---|---|---|---|
| Package | VQFN-28 (ML) 6x6 mm | VQFN-28 (ML) 6x6 mm - same | VQFN-28 (ML) 6x6 mm - same | SPDIP-28 (through-hole) | VQFN-28 (ML) 6x6 mm - same | SSOP-28 (wider SMD) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / CPU Speed | PIC24F 16-bit, 32 MHz / 16 MIPS | PIC24F 16-bit, 32 MHz / 16 MIPS | PIC24F 16-bit, 32 MHz / 16 MIPS | PIC24F 16-bit, 32 MHz / 16 MIPS | PIC24F 16-bit, 32 MHz / 16 MIPS | PIC24F 16-bit, 32 MHz / 16 MIPS |
| Flash / SRAM / EEPROM | 8 KB / 1 KB / 512 B | 8 KB / 1 KB / 512 B | 8 KB / 1 KB / 512 B | 8 KB / 1 KB / 512 B | 8 KB / 1 KB / 512 B | 8 KB / 1 KB / 512 B |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 1.8 V to 3.6 V (wider) | 3.0 V to 3.6 V |
| Temperature Range | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| CTMU Capacitive Touch | Yes | Yes | No | Yes | No | Yes |
| UART / MSSP / CCP | 2 UART / 1 MSSP / CCP+ECCP | 2 UART / 1 MSSP / CCP+ECCP | 2 UART / 1 MSSP / CCP only | 2 UART / 1 MSSP / CCP+ECCP | 2 UART / 1 MSSP / CCP+ECCP | 2 UART / 1 MSSP / CCP+ECCP |
| Estimated 1k-piece price | $1.25 - $1.40 | $1.30 - $1.50 | $1.10 - $1.25 | $1.40 - $1.60 | $1.30 - $1.45 | $1.25 - $1.40 |
主な差別化要因
- nanoWatt XLP technology with sub-uA sleep currents （vs PIC24F08KL302-I/ML)
- Integrated CTMU capacitive touch controller （vs PIC24F08KA102-I/ML)
- Extended temperature grade option （vs PIC24F08KL402-I/ML (Industrial) vs PIC24F08KL402-E/ML (Extended))
設計ノート
Estimated: The VQFN-28 (ML) exposed thermal pad (pin 29 / die attach paddle) MUST be soldered to a contiguous ground plane with at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) for reliable mechanical mounting and thermal dissipation. Without proper soldering the package will fail flexure testing (JEDEC JESD22-B111). Keep all signal traces at least 0.2 mm away from the EP edge to avoid solder wicking. The ML package datasheet recommends a 1:1 land pattern with EP covering approximately 60% of package area.
Place a 100 nF (0.1 uF) X7R ceramic decoupling capacitor as close as possible (within 3 mm) to each VDD/VSS pair, plus a bulk 10 uF ceramic or tantalum capacitor at the board supply entry. The PIC24F08KL402 datasheet recommends separate analog (AVDD/AVSS) decoupling - a 100 nF + 10 uF combination on AVDD pins 27/28 reduces ADC noise. For nanoWatt XLP sleep-current measurements, isolate VDD from any LED or pull-up resistor leakage paths to achieve sub-uA standby targets.
The PIC24F08KL402-I/ML operates ONLY from 3.0 V to 3.6 V - applying 5 V to VDD will damage the device. When migrating from PIC18F designs running at 5 V, add a 3.3 V LDO regulator (e.g., MCP1700) on the board. Do not leave the MCLR pin floating - tie it to VDD through a 10 kohm resistor for normal operation, or to the ICD programmer for in-circuit debugging. The OSC1/OSC2 pins require careful PCB layout if using a crystal; keep traces short and surround with a ground guard ring.
For I2C bus communication via MSSP, place 4.7 kohm pull-ups on SDA and SCL lines (calculated for VDD=3.3V and bus capacitance). Keep bus capacitance below 400 pF for Standard-mode (100 kHz) and below 100 pF for Fast-mode (400 kHz). When using SPI, route CLK and MOSI/MISO traces as parallel length-matched pairs (within 5 mm) over a continuous ground plane to avoid ringing at 10 MHz+ clock rates. The CTMU capacitive touch traces should be guarded by a ground ring to suppress noise coupling.
コンプライアンス情報
RoHS and lead-free confirmed per Microchip product page and DigiKey listing. Not AEC-Q100 qualified (industrial-grade -40C to +85C only); choose automotive-grade parts from PIC24/dsPIC families for AEC-Q100 needs. REACH status inferred from Microchip's general compliance statement; specific SVHC declaration on file.
