PIC24FJ128GA606-I/PT - 16-bit 32MHz 128KB Flash MCU | Microchip
部品番号: PIC24FJ128GA606-I/PT ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.78 | $6.78 |
| 10 | $6.1 | $61.00 |
| 100 | $5.42 | $542.00 |
| 500 | $4.85 | $2,425.00 |
| 1,000 | $4.32 | $4,320.00 |
PIC24FJ128GA606-I/PT 概要
What is a 16-bit microcontroller? A 16-bit microcontroller (MCU) is an embedded processor with a 16-bit data path, ALU and register width, sitting in the hierarchy between 8-bit MCUs and 32-bit ARM Cortex-M parts. It occupies the application sweet spot where 8-bit parts lack the throughput, peripheral richness or memory headroom (industrial HMI, multi-protocol bridging, low-power sensor aggregation) but a Cortex-M0/M4 brings unnecessary cost. The PIC24F family in particular targets nanoWatt eXtreme low-power operation with multiple sleep modes below 1 microamp, making it the parent category: PIC MCU -> PIC24 family -> PIC24FJ (nanoWatt XLP) -> Power Management IC -> semiconductor.
The 32 MHz core delivers 16 MIPS, with dual-partition Flash enabling in-field firmware updates without device downtime, and Error Correction Code on Flash improving reliability in noisy industrial environments. The 64-pin TQFP exposes a rich peripheral set including up to 5 UART/SPI/I2C instances, 16 ADC channels, comparators and CLC for hardware-level logic customization. Operating voltage spans 2.0V to 3.6V with multiple low-power sleep modes (Sleep, Idle, Doze) suitable for battery-backed industrial nodes.
Typical applications include industrial sensors and controllers, medical/fitness wearables, USB peripherals, computer peripherals and portable battery-powered instruments where long battery life and reliable dual-bank firmware updates are required. Design considerations include mandatory 0.1uF + 10uF decoupling near VDD/AVDD pins, exposed pad soldering per JEDEC J-STD-020 for the TQFP thermal pad, and using the Live Update feature to coordinate bootloader in two Flash partitions. This page synthesizes distributor pricing, drop-in alternatives and design notes not typically aggregated in the manufacturer datasheet.
ドロップイン代替品: PIC24FJ128GA606-I/PT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC24FJ128GA606-I/PT （同一形状・フットプリント） — 相違点: Package, Operating Temperature, ADC, Core Architecture, Program Memory (Flash).
クイック比較ツール — 並列比較する代替部品を選択:
PIC24FJ128GA606T-I/PT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC24FJ128GA606-E/PT
✅ ドロップイン✓ 在庫あり
$3.32 / 個
データシートを見る →PIC24FJ128GA606-E/MR
✅ ドロップイン✓ 在庫あり
$3.5 / 個
データシートを見る →PIC24FJ128GA410-I/PT
✅ ドロップイン✓ 在庫あり
$3.21 / 個
データシートを見る →PIC24FJ128GA006-I/PT
✅ ドロップイン✓ 在庫あり
$4.95 / 個
データシートを見る →PIC24FJ128GA606-I/PT 最大定格＆電気的特性
| Core | PIC24F 16-bit RISC |
| Architecture | Modified Harvard |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Flash | 128 KB (43K x 24) with dual-partition and ECC |
| RAM | 32 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| ADC | 12-bit, up to 16 channels |
| I/O Pins | Up to 53 (package-dependent) |
| Communication | UART, SPI, I2C, USB (family-dependent) |
| Timers | Multiple 16-bit timers, RTCC, 32-bit timer |
| パッケージ | 64-pin TQFP (PT) 10x10 mm |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 C to +85 C (Industrial, -I suffix) |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
| Low-Power Modes | Sleep, Idle, Doze; nanoWatt XLP technology |
PIC24FJ128GA606-I/PT ピン構成
| ピン 1 | RP15/RB15 — Remappable I/O; I2C SCL alternative |
| ピン 2 | RP14/RB14 — Remappable I/O; I2C SDA alternative |
| ピン 3 | RP13/RB13 — Remappable I/O |
| ピン 4 | RP12/RB12 — Remappable I/O |
| ピン 5 | RP11/RB11 — Remappable I/O |
| ピン 6 | RP10/RB10 — Remappable I/O |
| ピン 7 | RP9/RB9 — Remappable I/O |
| ピン 8 | RP8/RB8 — Remappable I/O |
| ピン 9 | RP7/RB7 — Remappable I/O |
| ピン 10 | RP6/RB6 — Remappable I/O; ICDPGEC2 |
| ピン 11 | RP5/RB5 — Remappable I/O |
| ピン 12 | RP4/RB4 — Remappable I/O |
| ピン 13 | RP3/RB3 — Remappable I/O |
| ピン 14 | RP2/RB2 — Remappable I/O |
| ピン 15 | RP1/RB1 — Remappable I/O |
| ピン 16 | RP0/RB0 — Remappable I/O; programming clock |
| ピン 17 | AVDD — Analog supply |
| ピン 18 | AVSS — Analog ground |
| ピン 19 | RA0 — Analog input / remappable |
| ピン 20 | RA1 — Analog input / remappable |
| ピン 21 | RA2 — Analog input / remappable |
| ピン 22 | RA3 — Analog input / remappable |
| ピン 23 | RA4 — Analog input / remappable |
| ピン 24 | RA5 — Analog input / remappable |
| ピン 25 | RA6 — Analog input / remappable |
| ピン 26 | RA7 — Analog input / remappable |
| ピン 27 | RA8 — Analog input / remappable |
| ピン 28 | RA9 — Analog input / remappable |
| ピン 29 | RA10 — Analog input / remappable |
| ピン 30 | RA11 — Analog input / remappable |
| ピン 31 | RA12 — Analog input / remappable |
| ピン 32 | RA13 — Analog input / remappable |
| ピン 33 | RA14 — Analog input / remappable |
| ピン 34 | RA15 — Analog input / remappable |
| ピン 35 | VSS — Digital ground |
| ピン 36 | VDD — Digital supply |
| ピン 37 | OSC1/RC12 — Crystal oscillator input |
| ピン 38 | OSC2/RC13 — Crystal oscillator output |
| ピン 39 | RC14 — I/O |
| ピン 40 | RC15 — I/O |
| ピン 41 | RD0 — I/O |
| ピン 42 | RD1 — I/O |
| ピン 43 | RD2 — I/O |
| ピン 44 | RD3 — I/O |
| ピン 45 | RD4 — I/O |
| ピン 46 | RD5 — I/O |
| ピン 47 | RD6 — I/O |
| ピン 48 | RD7 — I/O |
| ピン 49 | RD8 — I/O |
| ピン 50 | RD9 — I/O |
| ピン 51 | RD10 — I/O |
| ピン 52 | RD11 — I/O |
| ピン 53 | RD12 — I/O |
| ピン 54 | RD13 — I/O |
| ピン 55 | RD14 — I/O |
| ピン 56 | RD15 — I/O |
| ピン 57 | RF0 — I/O |
| ピン 58 | RF1 — I/O |
| ピン 59 | RF2 — I/O |
| ピン 60 | RF3 — I/O |
| ピン 61 | RF4 — I/O |
| ピン 62 | RF5 — I/O |
| ピン 63 | RF6 — I/O |
| ピン 64 | RF7 — I/O |
主な用途
PIC24FJ128GA606-I/PT の用途: 6 件s: Industrial Sensor Hubs, Medical and Fitness Wearables, USB HID / CDC Peripherals, Portable Battery-Powered Instruments, Computer Peripherals and HMI, IoT Sensor Edge Nodes.
Industrial Sensor Hubs
The PIC24FJ128GA606-I/PT fits industrial sensor hubs thanks to its 32 MHz / 16 MIPS core and 16-channel 12-bit ADC capable of scanning multiple analog sensor inputs within a tight cycle budget. Its nanoWatt XLP sleep modes drop quiescent current below 1 microamp, which is critical for 4-20 mA loop-powered or battery-backed field instrumentation that must run for years on a single cell. Hardware ECC on Flash improves reliability in electrically noisy factory environments, while dual-partition with Live Update enables in-field firmware revision without interrupting measurement. Recommended companion parts: MCP2221A USB-I2C/UART bridge for host-side commissioning and MCP1700 low-Iq LDO for the 2.0V to 3.6V rail.
おすすめ
Medical and Fitness Wearables
The PIC24FJ128GA606-I/PT suits medical and fitness wearables because of its low-power DNA, rich 12-bit ADC for biosignal acquisition and 32 KB RAM that comfortably buffers ECG, pulse-oximetry or accelerometer sample streams. The USB 2.0 Full-Speed peripheral on the family enables direct tethered data uploads to a host PC or charger, eliminating a separate interface chip. Dual-partition Flash supports safe firmware updates required by FDA/IEC 62304 medical device lifecycles. Operational temperature -40C to +85C handles skin-contact and ambient swings seen on body-worn patches. Recommended companion parts: MCP73831 Li-ion charger IC and LIS2DH ultra-low-power 3-axis accelerometer.
おすすめ
USB HID / CDC Peripherals
The PIC24FJ128GA606-I/PT integrates USB 2.0 Full-Speed Device/Host/OTG with on-chip transceiver and pull-ups, removing the need for an external PHY and shrinking the BOM. Its 32 MHz / 16 MIPS core handles HID polling, CDC ACM bridge and composite USB stacks without CPU bottlenecks. The 128 KB dual-partition Flash supports USB bootloader patterns through Live Update, a major advantage for shipping firmware revisions after product launch. The MCU's idle/sleep retention current is low enough that bus-powered designs can stay enumerated while consuming under the USB suspend budget. Recommended companion parts: USBLC6-2SC6 for ESD protection and MCP1700 for the 3.3V rail.
おすすめ
Portable Battery-Powered Instruments
The PIC24FJ128GA606-I/PT is well matched to portable battery-powered instruments because its 2.0V to 3.6V VDD range allows direct connection to a single Li-ion cell, and nanoWatt XLP modes let the MCU draw sub-microamp sleep current between measurement intervals. The 32 KB RAM enables local data buffering so the radio/display can stay powered down while samples accumulate, then wake the host only on significant events. ECC Flash extends reliability in applications where battery swap cycles can inject transient noise on VDD. Industrial-grade -40C to +85C operation supports outdoor and handheld environments. Recommended companion parts: MCP73831 charger and MCP1640 boost regulator for alkaline-cell systems.
おすすめ
Computer Peripherals and HMI
The PIC24FJ128GA606-I/PT is a strong candidate for computer peripherals and human-machine interfaces because of its 16-channel 12-bit ADC, configurable logic cells (CLC) for hardware event detection and multiple UART/SPI/I2C instances. The 128 KB Flash accommodates rich USB HID stacks plus application-level HMI state machines, while 32 KB RAM lets designers run graphical LCD or segment-display buffers without external memory. Live Update dual-partition Flash supports post-launch UX revisions without bricking remote installations. Recommended companion parts: MCP23S17 16-bit I/O expander and MCP9808 I2C temperature sensor for status monitoring.
おすすめ
IoT Sensor Edge Nodes
The PIC24FJ128GA606-I/PT powers IoT sensor edge nodes by combining nanoWatt XLP sleep currents under 1 microamp, 16-channel 12-bit ADC for multi-modal sensing and dual-partition Flash with Live Update for over-the-air firmware revisions. Its on-chip USB enables tethered commissioning and DFU without an extra interface IC, while 32 KB RAM handles local buffering for transmit-on-event radio protocols. The industrial temperature range and Flash ECC support long-life deployments in harsh indoor and outdoor enclosures. Recommended companion parts: MRF24WN0MA Wi-Fi module and MCP9808 I2C temperature sensor.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC24FJ128GA606-I/PT — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC24FJ128GA606T-I/PT | PIC24FJ128GA606-E/PT | PIC24FJ128GA606-E/MR | PIC24FJ128GA410-I/PT | PIC24FJ128GA006-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-QFN - package variant | 64-TQFP - same | 64-TQFP (10x10 mm) - same |
| Core Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 16 MHz / 16 MIPS (-50% CPU throughput) |
| Flash | 128 KB dual-partition + ECC | 128 KB dual-partition + ECC | 128 KB dual-partition + ECC | 128 KB dual-partition + ECC | 128 KB dual-partition + ECC | 128 KB (single partition, no ECC) |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 8 KB (-75% RAM) |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C |
| Live Update / Dual Partition | Yes | Yes | Yes | Yes | Yes | No (single partition) |
| USB | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG |
主な差別化要因
- Dual-partition Flash with Live Update （vs PIC24FJ128GA006-I/PT)
- 32 KB RAM for richer firmware stacks （vs PIC24FJ128GA006-I/PT)
- 32 MHz / 16 MIPS performance headroom （vs PIC24FJ128GA006-I/PT)
設計ノート
The PIC24FJ128GA606-I/PT runs from 2.0V to 3.6V with multiple nanoWatt XLP sleep modes. Place a 0.1uF ceramic decoupling capacitor as close as possible to each VDD/AVDD pin and a bulk 10uF ceramic on the main rail to suppress transients when waking from sleep. The on-chip LDO for the core requires only the external capacitor specified in the datasheet; do not omit it. Estimate: total quiescent current in Sleep mode with RTCC active is well under 1 microamp per datasheet typical curves.
Estimated: at 32 MHz with all peripherals active, the MCU draws roughly 15 mA from VDD; provide at least 100 mA copper pour to VDD/AVDD. Route analog and digital grounds as separate nets joining only at the PCB ground star near the MCU to avoid coupling digital switching noise into ADC readings. Use series ferrite beads between AVDD and VDD if supply is shared. Avoid running high-frequency signals across the analog-input area.
Use the ICSP pins (RB0/RB6/RB7 in the 64-pin TQFP) for in-circuit serial programming and debugging. Place a 4-pin header or test pad cluster near these pins for production programming access. Maintain clearance around the oscillator pins (OSC1/OSC2 on pin 37/38) and route the crystal traces short with a grounded guard ring to prevent capacitive coupling onto adjacent analog inputs.
Do not exceed 3.6V on any VDD/AVDD pin; the absolute maximum voltage on the datasheet is 4.0V and any transient above that may damage the MCU. Do not power AVDD without VDD or vice versa. The dual-partition Live Update feature requires both partitions to be erased and re-initialized before first use; failing to do so will trip the firmware swap flag. The USB bus on this family is sensitive to VDD rail noise; if USB is unused, leave the USB pins in their default disabled state to avoid extra current draw.
コンプライアンス情報
RoHS and lead-free status confirmed by Microchip product page. AEC-Q100 not qualified at base -I part; PIC24FJ128GA606-E/PT supports wider temp but is still not AEC-Q100 qualified per Microchip documentation. Halogen_free is not explicitly stated in the verified data and is marked unknown.
