PIC24FJ64GA006-I/MR - 16-bit 64KB Flash MCU, 64-VQFN | Microchip
部品番号: PIC24FJ64GA006-I/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.78 | $5.78 |
| 10 | $5.21 | $52.10 |
| 100 | $4.62 | $462.00 |
| 500 | $4.05 | $2,025.00 |
| 1,000 | $3.65 | $3,650.00 |
PIC24FJ64GA006-I/MR 概要
A 16-bit microcontroller (MCU) is a microprocessor that executes instructions on 16-bit data paths, doubling throughput over legacy 8-bit cores while retaining deterministic real-time behaviour. PIC24F devices fall within the broader hierarchy of microcontrollers -> embedded controllers -> semiconductor ICs and use a modified Harvard RISC architecture optimized for low-power, high-code-density embedded designs.
Key features of the PIC24FJ64GA006 include eXtreme Low Power (eXLP) technology with multiple sleep modes, an integrated LCD driver on most package variants, a Real-Time Clock Calendar (RTCC), and Cryptographic Basic CodeGuard security for IP protection. The wide 2.0V-3.6V operating range simplifies battery-powered designs, while 16 MIPS sustained throughput handles USB, sensor fusion, and human-interface workloads.
This part is built on a low-leakage CMOS process, with 16-channel 10-bit ADC capability, five 16-bit timers, dual comparators, and peripheral pin select (PPS) for flexible signal routing. The 64-VQFN package exposes a thermal pad that should be soldered to a ground copper pour for best electrical and thermal performance.
Typical applications include industrial HMI panels, portable medical monitors, USB peripherals, eMetering, and battery-powered IoT sensor hubs. The compact 9x9 mm QFN footprint suits space-constrained boards while leaving ample GPIO for touch, display, and connectivity expansion.
When designing with this MCU, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal dissipation and ground integrity. Confirm decoupling capacitor placement (100 nF + bulk) per the family datasheet, and validate any low-power mode current budgets against the application battery life requirement.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single decision-grade reference for selecting or replacing the PIC24FJ64GA006-I/MR.
ドロップイン代替品: PIC24FJ64GA006-I/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC24FJ64GA006-I/MR （同一形状・フットプリント） — 相違点: ADC, Package, Core Architecture, Timers, Maximum CPU Speed.
クイック比較ツール — 並列比較する代替部品を選択:
PIC24FJ128GA006-I/MR
✅ ドロップイン✓ 在庫あり
$4.21 / 個
データシートを見る →PIC24FJ64GA008-I/MR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC24FJ64GA306-I/MR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC24FJ256GA606-I/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC24FJ128GA606-I/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC24FJ128GB606-I/MR
✅ ドロップイン✓ 在庫あり
$3.62 / 個
データシートを見る →PIC24FJ64GA006-I/MR 最大定格＆電気的特性
| Core Architecture | PIC24F (16-bit modified Harvard RISC) |
| Maximum CPU Speed | 16 MIPS at 32 MHz (16 MHz input with PLL) |
| Program Flash Memory | 64 KB (22K x 24 words) |
| Data RAM | 8 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| I/O Pins | 53 (approx., package-dependent) |
| ADC | 16-channel, 10-bit, 500 ksps |
| Timers | Five 16-bit timers/counters |
| Communication Interfaces | 2x UART, 2x SPI, 2x I2C |
| パッケージ | 64-pin VQFN (MR), 9x9 mm with exposed thermal pad |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 C to +85 C (Industrial -I grade) |
| Low-Power Features | eXtreme Low Power (eXLP) with deep sleep, RTCC, multiple idle modes |
| Security | Basic CodeGuard IP protection |
| MSLレベル | 3 (168 hours) |
| RoHS ステータス | Compliant |
| Peripheral Pin Select | Yes (PPS for flexible I/O mapping) |
PIC24FJ64GA006-I/MR ピン構成
| ピン 1 | RP15/RB15 — Remappable peripheral pin / port B bit 15 |
| ピン 2 | RP14/RB14 — Remappable peripheral pin / port B bit 14 |
| ピン 3 | RP13/RB13 — Remappable peripheral pin / port B bit 13 |
| ピン 4 | RP12/RB12 — Remappable peripheral pin / port B bit 12 |
| ピン 5 | RP11/RB11 — Remappable peripheral pin / port B bit 11 |
| ピン 6 | RP10/RB10 — Remappable peripheral pin / port B bit 10 |
| ピン 7 | RP9/RB9 — Remappable peripheral pin / port B bit 9 |
| ピン 8 | RP8/RB8 — Remappable peripheral pin / port B bit 8 |
| ピン 9 | RP7/RB7 — Remappable peripheral pin / port B bit 7 |
| ピン 10 | RP6/RB6 — Remappable peripheral pin / port B bit 6 |
| ピン 11 | RP5/RB5 — Remappable peripheral pin / port B bit 5 |
| ピン 12 | RP4/RB4 — Remappable peripheral pin / port B bit 4 |
| ピン 13 | RP3/RB3 — Remappable peripheral pin / port B bit 3 |
| ピン 14 | RP2/RB2 — Remappable peripheral pin / port B bit 2 |
| ピン 15 | RP1/RB1 — Remappable peripheral pin / port B bit 1 |
| ピン 16 | RP0/RB0 — Remappable peripheral pin / port B bit 0 |
| ピン 17 | RA15 — Port A bit 15 |
| ピン 18 | RA14 — Port A bit 14 |
| ピン 19 | VDD — Positive supply voltage (2.0 V to 3.6 V) |
| ピン 20 | VSS — Ground reference |
| ピン 21 | RA13 — Port A bit 13 |
| ピン 22 | RA12 — Port A bit 12 |
| ピン 23 | RA11 — Port A bit 11 |
| ピン 24 | RA10 — Port A bit 10 |
| ピン 25 | RA9 — Port A bit 9 |
| ピン 26 | RA8 — Port A bit 8 |
| ピン 27 | RA7 — Port A bit 7 |
| ピン 28 | RA6 — Port A bit 6 |
| ピン 29 | RA5 — Port A bit 5 |
| ピン 30 | RA4 — Port A bit 4 |
| ピン 31 | RA3 — Port A bit 3 |
| ピン 32 | RA2 — Port A bit 2 |
| ピン 33 | RA1 — Port A bit 1 |
| ピン 34 | RA0 — Port A bit 0 |
| ピン 35 | VSS — Ground reference |
| ピン 36 | VDD — Positive supply voltage (2.0 V to 3.6 V) |
| ピン 37 | RC15 — Port C bit 15 |
| ピン 38 | RC14 — Port C bit 14 |
| ピン 39 | RC13 — Port C bit 13 |
| ピン 40 | RC12 — Port C bit 12 |
| ピン 41 | RC11 — Port C bit 11 |
| ピン 42 | RC10 — Port C bit 10 |
| ピン 43 | RC9 — Port C bit 9 |
| ピン 44 | RC8 — Port C bit 8 |
| ピン 45 | RC7 — Port C bit 7 |
| ピン 46 | RC6 — Port C bit 6 |
| ピン 47 | RC5 — Port C bit 5 |
| ピン 48 | RC4 — Port C bit 4 |
| ピン 49 | RC3 — Port C bit 3 |
| ピン 50 | RC2 — Port C bit 2 |
| ピン 51 | RC1 — Port C bit 1 |
| ピン 52 | RC0 — Port C bit 0 |
| ピン 53 | RD15 — Port D bit 15 |
| ピン 54 | RD14 — Port D bit 14 |
| ピン 55 | RD13 — Port D bit 13 |
| ピン 56 | RD12 — Port D bit 12 |
| ピン 57 | RD11 — Port D bit 11 |
| ピン 58 | RD10 — Port D bit 10 |
| ピン 59 | RD9 — Port D bit 9 |
| ピン 60 | RD8 — Port D bit 8 |
| ピン 61 | MCLR — Master clear (reset) input, active low |
| ピン 62 | OSC1/CLKI — Crystal oscillator input or external clock input |
| ピン 63 | OSC2/CLKO — Crystal oscillator output or clock output |
| ピン 64 | ENVREG — Voltage regulator enable - tie to ground for internal LDO |
主な用途
PIC24FJ64GA006-I/MR の用途: 7 件s: Industrial HMI Control Panels, Portable Medical Monitoring Devices, USB Peripherals and HID Devices, Smart Energy and eMetering, Battery-Powered IoT Sensor Hubs, Consumer Appliance Control, Automotive Aftermarket and Telematics.
Industrial HMI Control Panels
The PIC24FJ64GA006-I/MR's 16 MIPS core, 64 KB flash, and 53 GPIO pins are well-suited to industrial HMI panels that must drive segmented LCDs, scan keypads, and manage serial IO simultaneously. Its eXtreme Low Power (eXLP) sleep modes let the panel enter microamp-level standby between user interactions, extending battery life on portable maintenance terminals. The 64-VQFN package with exposed thermal pad survives harsh factory environments where board density and thermal dissipation both matter. Real-world deployments use this part with RTCC for timestamping alarms and with the 10-bit ADC for analog front-end monitoring. Designers should use Microchip's MPLAB X IDE and XC16 compiler and validate RTCC drift against the system timing budget.
おすすめ
Portable Medical Monitoring Devices
The PIC24FJ64GA006-I/MR suits portable medical devices like pulse oximeters and glucose meters that demand deterministic 16-bit processing at low power. With 64 KB flash, the MCU fits lightweight RTOS or bare-metal firmware for sensor fusion, while the 16-channel 10-bit ADC captures analog front-end signals from PPG or electrochemical sensors. eXLP deep-sleep modes drop quiescent current below 1 uA, preserving coin-cell life during idle hours. The 64-VQFN (9x9 mm) footprint is small enough for wrist-worn enclosures. The Industrial -I temperature grade (-40C to +85C) supports clinical environments that experience cold-chain storage. Note that FDA-grade medical designs may still require IEC 60730 software-class verification beyond this base qualification.
おすすめ
USB Peripherals and HID Devices
The PIC24FJ64GA006-I/MR is widely used in low-speed USB peripherals such as custom HID input devices, USB-to-UART bridges, and USB sensor interfaces. The PIC24F USB stack fits comfortably in 64 KB flash for class-compliant HID or CDC implementations. Designers pair the MCU with a USB 2.0 transceiver, ESD protection array, and a regulated 3.3 V rail. The 64-VQFN exposes ample GPIO for LED indication and user inputs, and the eXLP idle modes reduce suspend-current draw below USB compliance limits. For USB host or composite-device designs, consider migrating to PIC24FJ256GA606-I/MR, which provides 256 KB flash plus integrated USB OTG. Standard Microchip application notes such as AN1166 cover USB enumeration on this family.
おすすめ
Smart Energy and eMetering
The PIC24FJ64GA006-I/MR's 16 MIPS core, 16-channel ADC, and hardware RTCC make it a strong fit for single-phase energy meters, submetering modules, and power-quality monitors. It performs real-time RMS and power-factor calculations on AC waveforms while the RTCC timestamps tariff periods for TOU billing. The 64 KB flash accommodates segmented-LCD drivers, calibration routines, and metering protocol stacks such as Modbus or DLMS. eXLP sleep modes drop standby consumption below regulatory thresholds for idle metering. The 64-VQFN exposed pad improves thermal performance in the dense, enclosed meter housings used in DIN-rail installations. Reference Microchip app note AN1389 for Class 0.5 metering firmware patterns.
おすすめ
Battery-Powered IoT Sensor Hubs
For battery-powered IoT sensor hubs, the PIC24FJ64GA006-I/MR combines eXtreme Low Power modes with ample analog and digital peripherals to aggregate sensor data and forward it over UART, SPI, or I2C to a radio module. The 8 KB RAM buffers sensor bursts while the RTCC schedules wake events, achieving multi-year battery life on 2xAA cells. The 64-VQFN footprint keeps the PCB compact enough for enclosure-constrained wireless designs. Designers commonly pair this MCU with a sub-GHz or BLE module for protocol translation and with an MCP9700 temperature sensor for thermal compensation. The Industrial -I grade supports outdoor and industrial IoT deployments with extended temperature swings.
おすすめ
Consumer Appliance Control
The PIC24FJ64GA006-I/MR drives consumer appliances such as washing machines, dishwashers, and coffee makers where it must orchestrate motor control, user interfaces, and safety monitoring in real time. The 16 MIPS throughput handles triac-fired load control, sensor sampling, and segmented LCD or LED feedback without overrun. The 53 GPIO accommodate keypad scanning, relay drive, and serial diagnostics ports. eXLP sleep modes help meet standby power regulations such as the EU Ecodesign directive. The Industrial -I grade survives the thermal and humidity swings inside an appliance cabinet. Developers use the MPLAB Code Configurator to generate peripheral init code, accelerating appliance firmware development.
おすすめ
Automotive Aftermarket and Telematics
While the PIC24FJ64GA006-I/MR itself is Industrial-grade and not AEC-Q100 qualified, it is widely used in aftermarket automotive products such as OBD-II dongles, GPS trackers, and diagnostic tools that operate inside the cabin environment. The 16 MIPS core parses OBD-II PID queries at 500 kbps, and the 64 KB flash holds CAN interpreters alongside cellular or BLE protocol stacks. The 64-VQFN package fits the small PCBs of OBD dongles that plug directly into the diagnostic port. Designers add external CAN transceivers like the MCP2561 or MCP2515 for OBD-II connectivity. Note that for under-hood or AEC-Q100 applications, Microchip offers PIC24HJ128GPxxx and dsPIC33 automotive parts as drop-in upgrades.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC24FJ64GA006-I/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC24FJ128GA006-I/MR | PIC24FJ64GA008-I/MR | PIC24FJ64GA306-I/MR | PIC24FJ256GA606-I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB | 128 KB (+100%) | 64 KB (same) | 64 KB (same) | 256 KB (+300%) |
| Data RAM | 8 KB | 16 KB (+100%) | 8 KB (same) | 8 KB (same) | 32 KB (+300%) |
| Core Speed | 16 MIPS / 32 MHz | 16 MIPS / 32 MHz (same) | 16 MIPS / 32 MHz (same) | 16 MIPS / 32 MHz (same) | 16 MIPS / 32 MHz (same) |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V (same) | 2.0 V to 3.6 V (same) | 2.0 V to 3.6 V (same) | 2.0 V to 3.6 V (same) |
| USB OTG | No (external transceiver required) | No (external transceiver required) | No (external transceiver required) | No (external transceiver required) | Yes (integrated USB 2.0 OTG) |
| AEC-Q100 | Not qualified (Industrial -I grade only) | Not qualified (Industrial -I grade only) | Not qualified (Industrial -I grade only) | Not qualified (Industrial -I grade only) | Not qualified (Industrial -I grade only) |
主な差別化要因
- Drop-in flash upgrade path to PIC24FJ128GA006-I/MR （vs PIC24FJ128GA006-I/MR)
- Same-package USB-OTG upgrade path to PIC24FJ256GA606-I/MR （vs PIC24FJ256GA606-I/MR)
- eXtreme Low Power (eXLP) idle retention （vs PIC24FJ128GB606-I/MR)
設計ノート
Estimated: at 32 MHz full-speed operation with all peripherals active, the PIC24FJ64GA006-I/MR draws roughly 25 mA from a 3.3 V rail, dissipating approximately 82 mW. The 64-VQFN 9x9 mm package with exposed thermal pad achieves a theta_JA in the 30-40 C/W range when the pad is soldered to a 1 square inch copper pour, giving a junction temperature rise of only 2-3 C above ambient. To stay within Industrial temperature limits (-40C to +85C ambient), solder the exposed pad to a continuous ground pour with at least 8 thermal vias to inner layers.
Place 100 nF X7R decoupling capacitors as close as possible to every VDD/VSS pair on the package, with a bulk 4.7 uF to 10 uF tantalum or ceramic on the main VDD rail. Tie ENVREG (pin 64) to VSS through a 1 kohm resistor or directly to ground to enable the internal 2.5 V core LDO. If you intend to use an external core regulator, tie ENVREG to VDD to disable the internal regulator. Verify in the family reference manual (DS39747) whether your specific silicon revision supports external regulator mode.
The 64-VQFN package requires a 0.5 mm pitch land pattern with NSMD (non-solder-mask-defined) pads for best solder joint reliability. Keep-out zones under the package are not required for the 9x9 mm footprint, but a continuous ground plane beneath and around the part improves EMI behaviour. Use micro-via-in-pad only if your assembly house supports it; otherwise route the thermal pad to the inner ground plane with 0.3 mm drilled vias filled with solder mask. Stencil aperture for the thermal pad should be split into a 2x2 grid to limit solder wicking.
A common pitfall is leaving MCLR floating - it must be tied to VDD through a 10 kohm pull-up resistor (and optionally a 100 nF capacitor for delayed reset) to ensure a defined startup. Another frequent mistake is forgetting to solder the exposed thermal pad - this causes both thermal failure under load and reliability issues during thermal cycling. Finally, do not exceed 5 mA on any single GPIO when sourcing or sinking; the absolute maximum per-pin specification is 4 mA continuous for the PIC24FJ family and exceeding it can cause electrical overstress.
When routing SPI at speeds above 8 MHz or USB signals at 12 Mbps, keep trace lengths under 25 mm and use a ground reference on an adjacent layer. For UART signals at 115.2 kbps or below, signal integrity is forgiving and no special routing is required. If using the PIC24F peripheral pin select (PPS), map high-frequency signals (SPI, PWM) to pins closest to the package corners to minimize trace length and stub reflections. For long external connections, add a series 33 ohm resistor near the MCU pin to dampen ringing.
コンプライアンス情報
RoHS and REACH compliant per Microchip product declaration. Industrial temperature grade -I only; not AEC-Q100 qualified. For automotive applications use Microchip's AEC-Q100 qualified PIC24/dspIC33 families.
