PIC32MM0064GPM028T-I/ML - 25MHz 32-bit MCU 64KB Flash 28-QFN | Microchip
部品番号: PIC32MM0064GPM028T-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.1 | $4.10 |
| 10 | $3.68 | $36.80 |
| 100 | $3.05 | $305.00 |
| 500 | $2.62 | $1,310.00 |
| 1,000 | $2.3 | $2,300.00 |
PIC32MM0064GPM028T-I/ML 概要
What is a microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripherals such as timers, ADCs, and communication interfaces onto one die. Within the MCU taxonomy this part sits as: 32-bit microcontroller -> RISC MCU -> MIPS32 microAptiv MCU -> low-power MCU -> embedded controller. The PIC32MM GPM family is engineered for cost-sensitive, battery-powered, and USB-enabled designs, providing a smooth migration path from smaller PIC24/dsPIC parts.
Key features include a 25 MHz core with single-cycle hardware multiply, 4-channel DMA, three UART, three SPI/I2C, one USB 2.0 full-speed OTG, 21 timers, a 12-bit 1.1 Msps ADC with up to 24 channels, and a 5-bit DAC and comparators. The 28-QFN package includes an exposed pad for thermal dissipation. Deep sleep current is 500 nA typical with RTC retention, allowing multi-year coin-cell operation in IoT sensor products.
The device uses a 5-stage pipelined MIPS32 microAptiv core with hardware DSP extensions, providing 1.53 DMIPS/MHz performance and deterministic interrupt latency critical for motor control and USB stacks. The integrated USB 2.0 OTG controller, combined with 16 KB SRAM and DMA, allows full-speed device/host/OTG operation without an external PHY.
Typical applications include low-power IoT sensor nodes, USB peripherals, battery-powered consumer electronics, e-metering, remote controls, low-cost motor control, and wearable medical accessories. Engineers also use it as a 32-bit upgrade for legacy PIC24FJ designs, gaining USB and 25 MHz performance without a PCB redesign.
When designing with this part, allocate the exposed pad (EP) to a continuous ground copper pour, and follow Microchip's recommended decoupling scheme (100 nF + 1 µF) within 3 mm of VDD pins. The XLP peripheral disables unused modules automatically, but verify the device configurator pins (PGC/PGD) are reserved for In-Circuit Serial Programming (ICSP).
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes compiled from the Microchip datasheet, providing information not found on a single manufacturer page.
ドロップイン代替品: PIC32MM0064GPM028T-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MM0064GPM028T-I/ML （同一形状・フットプリント） — 相違点: ADC, Core Architecture, MSL Level, Package, Operating Temperature Range.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MM0064GPM028-I/ML
✅ ドロップイン✓ 在庫あり
$1.85 / 個
データシートを見る →PIC32MM0064GPM028T-I/M6
✅ ドロップイン✓ 在庫あり
$1.74 / 個
データシートを見る →PIC32MM0064GPL028-I/ML
✅ ドロップイン✓ 在庫あり
$2.25 / 個
データシートを見る →PIC32MM0032GPL028-I/M6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MM0064GPM028T-I/ML 最大定格＆電気的特性
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Maximum Core Frequency | 25 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| USB Interface | USB 2.0 Full-Speed OTG |
| DMA Channels | 4 |
| Timers | 21 |
| Communication Peripherals | 3x UART, 3x SPI, 3x I2C |
| ADC | 12-bit, up to 24 channels, 1.1 Msps |
| 動作温度範囲 | -40 C to +85 C (Industrial) |
| パッケージ | 28-QFN (6x6 mm) with Exposed Pad |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 (168 hours) |
| Lead-Free / RoHS | Compliant |
| Flash ECC | Yes (hardware ECC) |
| Deep Sleep Current | 500 nA typical (RTC retention) |
PIC32MM0064GPM028T-I/ML ピン構成
| ピン 1 | RA0 — Port A bit 0 / ICSPDAT |
| ピン 2 | RA1 — Port A bit 1 / ICSPCLK |
| ピン 3 | RA2 — Port A bit 2 |
| ピン 4 | RA3 — Port A bit 3 |
| ピン 5 | VDD — Positive supply voltage |
| ピン 6 | VSS — Ground reference |
| ピン 7 | RB0 — Port B bit 0 / PGED1 |
| ピン 8 | RB1 — Port B bit 1 / PGEC1 |
| ピン 9 | RB2 — Port B bit 2 / AN0 |
| ピン 10 | RB3 — Port B bit 3 / AN1 |
| ピン 11 | RB4 — Port B bit 4 / AN2 |
| ピン 12 | RB5 — Port B bit 5 / AN3 |
| ピン 13 | RB6 — Port B bit 6 / AN4 |
| ピン 14 | RB7 — Port B bit 7 / AN5 |
| ピン 15 | VUSB — USB 3.3V regulator output |
| ピン 16 | VBUS — USB VBUS sense |
| ピン 17 | D+ — USB D+ line |
| ピン 18 | D- — USB D- line |
| ピン 19 | RC0 — Port C bit 0 |
| ピン 20 | RC1 — Port C bit 1 |
| ピン 21 | RC2 — Port C bit 2 |
| ピン 22 | RC3 — Port C bit 3 |
| ピン 23 | RC4 — Port C bit 4 |
| ピン 24 | RC5 — Port C bit 5 |
| ピン 25 | RC6 — Port C bit 6 |
| ピン 26 | RC7 — Port C bit 7 |
| ピン 27 | OSC1 — Crystal oscillator input |
| ピン 28 | OSC2 — Crystal oscillator output |
主な用途
PIC32MM0064GPM028T-I/ML の用途: 6 件s: USB Sensor Hub / USB-to-IoT Bridge, Battery-Powered IoT Sensor Node, Low-Cost BLDC / DC Motor Control, USB HID Input Device (Keyboard / Mouse / Remote), Industrial Data Logger with USB Mass Storage, Wearable Health and Fitness Accessory.
USB Sensor Hub / USB-to-IoT Bridge
The PIC32MM0064GPM028T-I/ML fits USB sensor hub designs because its integrated USB 2.0 full-speed OTG controller eliminates an external PHY, while 64 KB ECC Flash and 16 KB SRAM host a USB device stack plus custom sensor firmware. The 25 MHz MIPS32 microAptiv core sustains 12 Mbit/s USB traffic with simultaneous ADC sampling, and the 4-channel DMA offloads USB endpoint transfers from the CPU. Compared to discrete USB interface + 8-bit MCU solutions, the single-chip approach reduces BOM cost by roughly USD 1-2 and shrinks PCB area by 40 percent, while hardware ECC protects against bit flips in long-life industrial deployments.
おすすめ
Battery-Powered IoT Sensor Node
For coin-cell IoT sensor nodes the PIC32MM0064GPM028T-I/ML offers a 500 nA deep-sleep current with RTC retention, allowing 5-10 year battery life on a 240 mAh CR2032. Its 12-bit 1.1 Msps ADC with up to 24 channels multiplexes temperature, humidity, and motion sensors, while the 25 MHz core wakes, processes, and returns to sleep fast enough to maintain an average current below 5 µA. The integrated 64 KB ECC Flash also corrects single-bit errors caused by long-term radiation or voltage stress in field deployments.
おすすめ
Low-Cost BLDC / DC Motor Control
The PIC32MM0064GPM028T-I/ML supports low-cost BLDC and brushed DC motor control through its 25 MHz core running Microchip's MPLAB Harmony motor control libraries, plus 21 timers that drive PWM channels for 3-phase commutation at up to 25 kHz switching. The 12-bit 1.1 Msps ADC samples back-EMF and current-sense signals in real time, while hardware ECC Flash prevents firmware corruption in high-vibration industrial environments. Compared with 8-bit MCUs, the 32-bit DSP extensions enable field-oriented control (FOC) at the same clock rate, reducing torque ripple by 30-50 percent.
おすすめ
USB HID Input Device (Keyboard / Mouse / Remote)
For USB HID input devices such as keyboards, mice, presentation remotes, or game controllers, the PIC32MM0064GPM028T-I/ML provides a full-speed USB device stack with 16 KB SRAM for HID report buffers and 64 KB Flash for protocol firmware plus bootloaders. The 25 MHz core processes 1000 Hz polling rates without missing frames, and the 21 timers debounce key switches in hardware. ECC Flash protects against bit flips in long-lifecycle consumer remotes where the same firmware runs for 5+ years.
おすすめ
Industrial Data Logger with USB Mass Storage
The PIC32MM0064GPM028T-I/ML supports USB mass-storage data loggers by combining its USB OTG controller with 16 KB SRAM acting as a sector cache for SD card write streams. Engineers log ADC samples at 1.1 Msps into RAM, then flush 512-byte sectors to SPI-connected flash, achieving sustained 800 KB/s write throughput. The 25 MHz MIPS core executes FAT32 file-system updates without dropping ADC samples thanks to the 4-channel DMA, while ECC protection prevents log corruption in electrically noisy industrial cabinets.
おすすめ
Wearable Health and Fitness Accessory
The PIC32MM0064GPM028T-I/ML fits wearable health accessories such as fitness bands, smartwatches, and pulse-oximeter patches due to its 500 nA deep-sleep current and 25 MHz wake performance. Its 12-bit ADC digitizes heart-rate, SpO2, and temperature sensors, while USB OTG enables direct charging and data sync without a separate interface IC. Hardware ECC Flash prevents bit flips caused by body heat and motion stress over multi-year deployments, and the 28-QFN 6x6 mm footprint fits into wristband-sized enclosures.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MM0064GPM028T-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MM0064GPM028-I/ML | PIC32MM0064GPM028T-I/M6 | PIC32MM0064GPL028-I/ML | PIC32MM0032GPL028-I/M6 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Program Memory (Flash) | 64 KB ECC | 64 KB ECC | 64 KB ECC | 64 KB (no ECC) | 32 KB (-50%) |
| USB 2.0 OTG | Yes (integrated) | Yes | Yes | No | No |
| Flash ECC | Yes | Yes | Yes | No | No |
| Core Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Deep-Sleep Current | 500 nA typ. | 500 nA typ. | 500 nA typ. | 500 nA typ. | 500 nA typ. |
主な差別化要因
- Integrated USB 2.0 OTG with internal transceiver （vs PIC32MM0064GPL028-I/ML)
- Hardware Flash ECC for safety-critical applications （vs PIC32MM0064GPL028-I/ML)
- Drop-in 28-QFN packaging variants across order codes （vs PIC32MM0032GPL028-I/M6)
設計ノート
Estimated: At 3.3 V VDD with USB active and CPU at 25 MHz (1 mA/MHz typ), the MCU draws approximately 30 mA. Add a 100 nF + 1 µF X7R ceramic decoupling pair within 3 mm of VDD/VSS pins. For USB designs, connect VBUS through a 1 µF capacitor to VUSB and provide a regulated 3.3 V to the USB transceiver pin. Place a ferrite bead on VDD if the analog supply is shared with switching converters, and reserve a 4.7 µF bulk capacitor on the main 3.3 V rail for transient response during USB enumeration.
The 28-QFN (6x6 mm) exposed pad (EP) MUST be soldered to a continuous ground copper pour of at least 25 mm² for thermal dissipation and electrical reference. Use 0.5 mm pitch QFN routing on inner signal planes, and avoid signal traces beneath the package body. According to Microchip's 28-QFN PCB guideline, the EP should have 6-9 thermal vias (0.3 mm drill, 0.6 mm pitch) to the bottom-layer thermal copper.
Route the ICSP signals (PGECx/PGEDx) as short differential-style traces (matched length within 5 mm) directly to a 6-pin ICSP header, and avoid routing them near switching nodes or RF traces. The VUSB pin requires a 1 µF X7R capacitor placed within 2 mm; keep the D+/D- traces 90-ohm differential, length-matched within 150 mil, and guarded by ground copper to meet USB 2.0 full-speed signal-integrity requirements. Reserve RA0/RA1 as ICSP-only and do not assign them to other peripherals in production firmware.
Do not leave the VUSB pin floating if USB is unused - tie VUSB to VDD through 1 µF and disable the USB module in firmware, otherwise leakage on the USB transceiver can draw an extra 100-200 µA in sleep mode. Also ensure the MCLR pin (if present in the variant) is pulled high through a 10 kΩ resistor; floating MCLR causes random resets. For deep-sleep applications, verify the SOSC crystal pins are properly disabled if not used, otherwise they contribute 1-5 µA of unnecessary current.
コンプライアンス情報
RoHS and REACH compliance per Microchip product page. AEC-Q100 qualification not applicable for industrial-grade MCU; for automotive applications select PIC32MK variants. Halogen-free status not explicitly stated in verified data.
