PIC32MX130F256B-V/ML - 32-bit MCU, 256KB Flash, USB, 28-QFN | Microchip
部品番号: PIC32MX130F256B-V/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.92 | $4.92 |
| 10 | $4.43 | $44.30 |
| 100 | $3.94 | $394.00 |
| 500 | $3.55 | $1,775.00 |
| 1,000 | $3.16 | $3,160.00 |
PIC32MX130F256B-V/ML 概要
A PIC32MX microcontroller is a 32-bit RISC MCU built on the MIPS microAptiv/M4K core, sitting in the product hierarchy as: PIC32MX -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. Compared with 8-bit PIC16/PIC18 parts, PIC32MX devices deliver 83 DMIPS at 40 MHz with instruction execution in a single clock cycle, while consuming roughly 0.5 mA/MHz. This performance level bridges the gap between classic 16-bit PIC24/dsPIC parts and higher-tier Cortex-M devices, making PIC32MX well suited for cost-sensitive applications that still require USB, graphics, or audio interfaces.
Key differentiating features include 256 KB self-programmable Flash, 16 KB SRAM, a 10-bit 1 Msps ADC with up to 13 channels, on-chip temperature sensor, and mTouch capacitive touch support via the CTMU. PPS allows remapping of digital peripherals to any I/O after PCB layout, while PMP enables direct connection to graphics displays, SRAM, or FIFOs without external glue logic. USB 2.0 full-speed with on-chip transceiver eliminates external PHY cost.
Typical applications include USB peripherals (HID, CDC, mass-storage), capacitive touch human-machine interfaces, audio playback via I2S to DACs, and small graphical displays. Industrial uses span sensor hubs and motor control entry points; consumer uses span fitness wearables, toys, and home appliances. The automotive-grade -V variant fits body controllers, lighting modules, and HVAC human-machine interfaces.
When designing with this part, place a 10 µF bulk and 0.1 µF ceramic bypass close to VDD/AVDD pairs, route USB DP/DM as a 90-ohm differential pair, and use the PPS registers to remap peripherals only after the I/O matrix is finalized. Avoid sharing analog and digital ground returns - use a star-ground or split-plane layout to keep ADC noise below 1 LSB at full sampling rate.
This page synthesizes verified distributor pricing, same-brand and cross-brand drop-in alternatives, and practical PCB/application design notes that complement, but do not replace, the Microchip family datasheet.
ドロップイン代替品: PIC32MX130F256B-V/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX130F256B-V/ML （同一形状・フットプリント） — 相違点: Package, ADC, Operating Temperature, USB, Program Memory (Flash).
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX130F256B-I/ML
✅ ドロップイン✓ 在庫あり
$4.12 / 個
データシートを見る →PIC32MX230F256B-V/ML
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX130F256BT-I/ML
✅ ドロップイン✓ 在庫あり
$3.65 / 個
データシートを見る →PIC32MX130F256BT-I/SS
✅ ドロップイン✓ 在庫あり
$3.12 / 個
データシートを見る →PIC32MX130F064B-V/ML
✅ ドロップイン✓ 在庫あり
$2.54 / 個
データシートを見る →PIC32MX130F256B-V/ML 最大定格＆電気的特性
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 40 MHz (50 MHz / 83 DMIPS family max) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage Range | 2.5 V / 3.3 V (AEC-Q100) |
| ADC | 10-bit, up to 13 channels |
| USB | USB 2.0 Full-Speed with on-chip transceiver |
| Communication Interfaces | 2x I2S/SPI, I2C, UART |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| CTMU / mTouch | Yes (capacitive touch support) |
| 動作温度範囲 | -40 C to +105 C (automotive -V grade) |
| パッケージ | 28-pin QFN (6x6x0.9 mm), exposed pad |
| 実装タイプ | Surface Mount |
| Automotive Qualification | AEC-Q100 |
| RoHS ステータス | Compliant |
PIC32MX130F256B-V/ML ピン構成
| ピン 1 | RA0 — I/O / analog; PPS-mappable |
| ピン 2 | RA1 — I/O / analog; PPS-mappable |
| ピン 3 | RB0 — I/O; CTMU capable |
| ピン 4 | RB1 — I/O; CTMU capable |
| ピン 5 | RB2 — I/O; CTMU capable |
| ピン 6 | RB3 — I/O; CTMU capable |
| ピン 7 | RB4 — I/O; SDA1 I2C1 (PPS) |
| ピン 8 | RB6 — I/O; PGEC1 ICD |
| ピン 9 | RB7 — I/O; PGED1 ICD |
| ピン 10 | RB8 — I/O; CTMU capable |
| ピン 11 | RB9 — I/O; CTMU capable |
| ピン 12 | RB10 — I/O; CTMU capable |
| ピン 13 | RB11 — I/O; CTMU capable |
| ピン 14 | VSS — Ground |
| ピン 15 | VDD — Supply voltage 2.5 V / 3.3 V |
| ピン 16 | RA2 — I/O / analog |
| ピン 17 | RA3 — I/O / analog |
| ピン 18 | RC0 — I/O; PPS-mappable |
| ピン 19 | RC1 — I/O; PPS-mappable |
| ピン 20 | RC2 — I/O; PPS-mappable |
| ピン 21 | RC3 — I/O; PPS-mappable |
| ピン 22 | RC4 — I/O; PPS-mappable |
| ピン 23 | RC5 — I/O; PPS-mappable |
| ピン 24 | RC6 — I/O; PPS-mappable |
| ピン 25 | RC7 — I/O; PPS-mappable |
| ピン 26 | RC8 — I/O; PPS-mappable |
| ピン 27 | RC9 — I/O; PPS-mappable |
| ピン 28 | VUSB — USB 3.3 V regulator bypass / supply |
主な用途
PIC32MX130F256B-V/ML の用途: 6 件s: USB HID / CDC Peripherals, Automotive Body & Lighting HMI, Audio Playback (I2S DAC) Devices, Capacitive Touch Industrial Panels, Small Graphic Display Controllers, IoT Sensor Hubs & Edge Nodes.
USB HID / CDC Peripherals
The PIC32MX130F256B-V/ML's USB 2.0 Full-Speed device with on-chip transceiver, 256 KB Flash, and 16 KB SRAM make it ideal for USB HID keyboards/mice, CDC virtual COM ports, and mass-storage devices. With 40 MHz MIPS32 M4K performance (~83 DMIPS at family max), it runs Microchip's USB stack and class drivers without external PHY cost. Placed near a USB-B or USB-C connector with a 90-ohm differential pair on DP/DM and 10 µF bulk decoupling, it delivers a low-BOM USB peripheral. AEC-Q100 -V qualification makes it drop-in for automotive body-control USB hubs and diagnostic interfaces.
おすすめ
Automotive Body & Lighting HMI
The PIC32MX130F256B-V/ML is AEC-Q100 automotive qualified and integrates mTouch capacitive-touch via CTMU plus a 10-bit ADC for slider/wheel feedback, making it ideal for automotive body and lighting human-machine interfaces. With -40 C to +105 C operation, 256 KB Flash for RGB lighting animations, and PMP for driving small LED driver segments, it fits door modules, overhead consoles, and lighting controllers. Place the QFN-32 with thermal vias to the exposed pad; the -V grade survives under-hood and dashboard thermal stress that the -I industrial grade cannot.
おすすめ
Audio Playback (I2S DAC) Devices
The PIC32MX130F256B-V/ML integrates two I2S/SPI modules that directly drive external audio DACs for low-cost playback products, Bluetooth/Wi-Fi audio bridges, and consumer toys. With 16 KB SRAM buffering decoded audio frames at 40 MHz and USB for content delivery, it removes the need for a dedicated audio processor. Connect I2S BCLK/LRCLK/DATA to a 24-bit DAC; route MCLK from a 12.288 MHz crystal divided by the MCU PLL for 48 kHz/96 kHz sample rates. The AEC-Q100 -V grade lets the same firmware serve automotive infotainment rear-seat audio zones.
おすすめ
Capacitive Touch Industrial Panels
The PIC32MX130F256B-V/ML's CTMU (Charge Time Measurement Unit) plus 10-bit ADC support mTouch capacitive buttons, wheels, and sliders for industrial human-machine interfaces where mechanical switches would fail. With 256 KB Flash for touch algorithms and PMP to drive small graphical displays, it replaces discrete touch ICs plus microcontrollers. The QFN-28 (6x6 mm) package fits behind glass or plastic panels. Pair with a PIC32MX170F256B-V/ML when scaling to 36/44-pin panels that need more I/O.
おすすめ
Small Graphic Display Controllers
The PIC32MX130F256B-V/ML integrates a Parallel Master Port (PMP) that drives small QVGA/WQVGA TFT or OLED displays directly without external logic. With 16 KB SRAM for frame buffering and 40 MHz MIPS32 M4K performance, it handles menu UIs, status icons, and basic animations in appliance and fitness-wearable products. The 28-QFN (6x6 mm) footprint fits compact wearables; connect PMP to a 16-bit data bus and use PPS to remap peripherals if PCB layout changes. Choose PIC32MX230F256B-V/ML if you need higher frame rates on larger displays.
おすすめ
IoT Sensor Hubs & Edge Nodes
The PIC32MX130F256B-V/ML's low 0.5 mA/MHz typical active current, sleep modes with RTC retention, USB for connectivity, and 256 KB Flash for sensor-fusion firmware make it ideal for IoT sensor hubs and edge nodes. With 10-bit ADC sampling at 1 Msps and CTMU for capacitive sensors, it aggregates temperature, humidity, proximity, and touch inputs in a single chip. Use PPS to remap UART to a Wi-Fi/BLE module and I2C to environmental sensors; route analog and digital grounds with a star pattern to keep ADC noise below 1 LSB. AEC-Q100 -V grade suits automotive edge telemetry.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX130F256B-V/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX130F256B-I/ML | PIC32MX230F256B-V/ML | PIC32MX130F256BT-I/ML | PIC32MX130F256BT-I/SS | PIC32MX130F064B-V/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-SSOP (5.30 mm) - different | 28-QFN (6x6 mm) - same |
| Maximum CPU Speed | 40 MHz | 40 MHz | 50 MHz (+25%) | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 64 KB (-75%) |
| SRAM | 16 KB | 16 KB | 32 KB (+100%) | 16 KB | 16 KB | 16 KB |
| AEC-Q100 Grade | Yes (-V automotive) | No (industrial -I) | Yes (-V automotive) | No (industrial -I) | No (industrial -I) | Yes (-V automotive) |
| Operating Temperature | -40 C to +105 C | -40 C to +85 C | -40 C to +105 C | -40 C to +85 C | -40 C to +85 C | -40 C to +105 C |
| USB 2.0 FS | Yes | Yes | Yes | Yes | Yes | Yes |
| CTMU / mTouch | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (USD, qty 100) | 3.94 | 3.50 (industrial, lower cost) | 4.30 (higher speed/SRAM) | 3.94 (tape-and-reel suffix) | 3.94 (SSOP packaging) | 3.20 (smaller Flash) |
主な差別化要因
- Automotive AEC-Q100 qualification with extended -40 C to +105 C operating range （vs PIC32MX130F256B-I/ML)
- Drop-in upgrade path to 50 MHz / 32 KB SRAM within same QFN-28 footprint （vs PIC32MX230F256B-V/ML)
- USB 2.0 Full-Speed with on-chip transceiver eliminates external PHY （vs PIC32MX130F064B-V/ML)
設計ノート
Estimated: at 40 MHz active, the PIC32MX130F256B-V/ML consumes approximately 20 mA (0.5 mA/MHz typical). Add a 10 µF bulk tantalum or ceramic capacitor plus a 0.1 µF ceramic decoupling capacitor on each VDD/AVDD pin pair, placed within 5 mm of the pin. The VUSB pin requires its own 0.1 µF + 4.7 µF bypass for the internal USB 3.3 V regulator. For automotive +12 V body supplies, add a TVS diode and ferrite bead on the input rail to absorb load-dump transients up to 40 V.
The 28-QFN (6x6 mm) package has an exposed thermal pad (EP) that MUST be soldered to a 4x4 array of thermal vias connecting to a ground plane on layer 2 - this is mandatory for thermal dissipation, not optional. Route the USB DP/DM pair as a 90-ohm differential (Z0 = 90 Ω, length-matched within 150 mil). Keep analog (RA0-RA3) traces short and use a star-ground pattern that ties AGND and GND only at the MCU exposed pad to keep ADC noise below 1 LSB at 1 Msps sampling.
Do not skip configuration of the Peripheral Pin Select (PPS) registers - peripherals are mapped to default pins at reset and must be reassigned via PPS unlock sequence (UNLOCK = 0x55, 0xAA) before any other PPS write. Do not exceed 50 MHz CPU clock on PIC32MX130 parts (this is the family maximum, not the part's 40 MHz rating). Do not route I2S MCLK/BCLK/LRCLK traces longer than 50 mm without series damping resistors. Finally, do not assume -I industrial parts work in automotive designs - use the -V/ML AEC-Q100 variant.
Route the 12 MHz primary oscillator traces short and symmetric with a grounded guard ring; the internal PLL multiplies it to 40 MHz CPU and 48 MHz USB. Keep the crystal within 5 mm of OSC1/OSC2 and surround it with a hatched ground pour. Place the ICSP/ICD pins (RB6/RB7 for PGEC1/PGED1) on test-point pads so MPLAB Snap or ICD 4 can program/debug the part in production. If you use USB, add a 1.5 kΩ pull-up on D+ (or D-) selectable via a GPIO to switch between USB high-speed enumeration and low-power attach.
コンプライアンス情報
AEC-Q100 automotive qualified per the -V suffix in the MPN. RoHS and REACH compliant per Microchip product page. Halogen-free status not stated in verified web data - set to unknown.
