PIC32MX130F256D-50I/TL - 50MHz 32-bit MCU, 256KB Flash | Microchip
部品番号: PIC32MX130F256D-50I/TL ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.12 | $5.12 |
| 10 | $4.62 | $46.20 |
| 100 | $4.07 | $407.00 |
| 500 | $3.71 | $1,855.00 |
| 1,000 | $3.42 | $3,420.00 |
PIC32MX130F256D-50I/TL 概要
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit processor core, volatile and non-volatile memory, and programmable peripherals. Microcontrollers sit at the lowest tier of embedded computing, below microprocessors and application processors, and are classified within the broader category of integrated circuits and semiconductors. The PIC32MX1XX/2XX family uses a Harvard architecture with separate Flash and SRAM buses, enabling deterministic instruction fetch and improving effective throughput versus single-bus Von Neumann designs at the same clock rate.
Key features include 256 KB Flash (256K x 8), 16 KB SRAM, 50 MHz / 83 DMIPS core, USB 2.0 full-speed On-The-Go (OTG) device/host, two I2S/SPI modules for codec and serial communications, Peripheral Pin Select (PPS) for flexible signal routing, Parallel Master Port (PMP) for graphics interfaces, mTouch capacitive-touch support, Charge Time Measurement Unit (CTMU), 1 ns high-resolution time measurement, on-chip temperature measurement, and 10-bit ADC. The Industrial (-I) temperature range is -40 C to +85 C.
The architecture combines a 5-stage pipelined MIPS32 M4K core with single-cycle multiply and hardware divide, giving 1.66 DMIPS/MHz efficiency. The 0.5 mA/MHz typical run current keeps active power around 25 mA at 50 MHz, while multiple low-power sleep modes with RTCC retention drop quiescent consumption into the microamp range - useful for battery-powered sensor nodes and industrial meters.
Typical applications include USB peripherals (HID, CDC, mass-storage), audio playback and recording with the on-chip I2S interface, low-cost graphics via PMP to TFT panels, capacitive-touch user interfaces, industrial sensor hubs, and small-footprint IoT edge nodes. The combination of USB-OTG, I2S, and PPS makes the device a strong fit when system BOM and board area must remain small.
When designing with this device, ensure the VTLA-44 exposed pad is soldered to a continuous ground plane with sufficient thermal vias. Decouple AVDD/AVSS analog rails with a 10 uF plus 0.1 uF pair placed within 5 mm of the pins to preserve ADC accuracy.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: PIC32MX130F256D-50I/TL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX130F256D-50I/TL （同一形状・フットプリント） — 相違点: Package, ADC, Timers, Operating Temperature, USB.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX130F256D-50I/PT
✅ ドロップイン✓ 在庫あり
$3.42 / 個
データシートを見る →PIC32MX130F256D-I/TL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX130F256D-I/PT
✅ ドロップイン✓ 在庫あり
$3.3 / 個
データシートを見る →PIC32MX130F256B-I/ML
✅ ドロップイン✓ 在庫あり
$4.12 / 個
データシートを見る →PIC32MX130F256B-50I/SP
✅ ドロップイン✓ 在庫あり
$3.1 / 個
データシートを見る →PIC32MX130F256D-50I/TL 最大定格＆電気的特性
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Clock | 50 MHz (83 DMIPS) |
| Core Efficiency | 1.66 DMIPS/MHz |
| Program Flash | 256 KB (256K x 8) |
| SRAM | 16 KB |
| 電源電圧 | 2.3 V to 3.6 V (3.3 V typical) |
| Active Current | 0.5 mA/MHz (typical) |
| ADC | 10-bit, 1 Msps |
| USB | USB 2.0 Full-Speed OTG device/host |
| Serial Interfaces | 2x I2C, 2x SPI/I2S, UART with IrDA/LIN, PMP |
| Timers | 5x 16-bit, 1 ns resolution capture |
| 動作温度 | -40 C to +85 C (Industrial, -I) |
| パッケージ | VTLA-44 (6x6 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
| Special Features | Peripheral Pin Select (PPS), mTouch CTMU, Parallel Master Port |
PIC32MX130F256D-50I/TL vtla-44 (6x6 mm) with exposed pad ピン配置ガイド
PIC32MX130F256D-50I/TL (vtla-44 (6x6 mm) with exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MX130F256D-50I/TL.
詳細は データシート をご参照ください。
主な用途
PIC32MX130F256D-50I/TL の用途: 6 件s: USB HID / CDC Peripheral, Audio Playback with I2S Codec, Low-Cost TFT Graphics HMI, Capacitive Touch User Interface, Industrial Sensor Hub, IoT Edge Node with USB Diagnostics.
USB HID / CDC Peripheral
The PIC32MX130F256D-50I/TL's on-chip USB 2.0 Full-Speed OTG device/host controller makes it well suited for USB HID (keyboards, mice, custom input devices) and USB CDC (virtual COM port) applications. The 50 MHz MIPS32 M4K core delivers 83 DMIPS, providing headroom for USB stack plus application code, while the 256 KB Flash accommodates the full Microchip USB framework, HID class driver, and CDC class driver. The 16 KB SRAM is sufficient for two USB endpoints plus ring buffers. Typical circuit: 5 V USB VBUS fed through a 3.3 V LDO to VDDCORE, with D+/D- tied directly to the chip's USB pins and a 1.5 kohm pull-up on D- for full-speed device mode.
おすすめ
Audio Playback with I2S Codec
The two on-chip I2S/SPI modules allow the PIC32MX130F256D-50I/TL to drive external audio codecs at 44.1/48 kHz sample rates for USB-audio docks or stand-alone audio players. The 50 MHz core and DMA-assisted I2S transfers free the CPU for DSP-style sample-rate conversion or graphic-EQ processing, while the 256 KB Flash holds audio class drivers plus codec configuration tables. Use the on-chip timer or the 1 ns resolution capture module to bit-bang MCLK if the codec lacks a PLL. The exposed thermal pad on the VTLA-44 keeps junction temperature low even with sustained I2S DMA activity.
おすすめ
Low-Cost TFT Graphics HMI
The PIC32MX130F256D-50I/TL integrates a Parallel Master Port (PMP) that can drive small TFT panels (up to 8-bit parallel data + control) for low-cost HMI touch interfaces in appliances and industrial control panels. The 83 DMIPS core handles framebuffer composition and on-screen graphics primitives, while Peripheral Pin Select (PPS) lets the designer remap PMP signals to free I/O for capacitive-touch buttons. Combined with the mTouch CTMU module, a complete touch + display HMI fits in the 256 KB Flash footprint. The 6x6 mm VTLA package keeps PCB area minimal behind the display.
おすすめ
Capacitive Touch User Interface
The PIC32MX130F256D-50I/TL's mTouch CTMU peripheral enables robust capacitive-touch buttons, sliders, and proximity sensors without an external touch controller. The CTMU measures sub-nanosecond timing differences via charge time measurement, supporting reliable detection through 3-5 mm of glass or plastic overlay. The 50 MHz core easily handles button-scanning state machines plus communication back to a host, while PPS allows the designer to assign CTMU channels to any available I/O pin for flexible PCB layout. Industrial -40 to +85 C temperature range supports automotive and harsh-environment HMI.
おすすめ
Industrial Sensor Hub
With multiple UART/I2C/SPI interfaces, the PIC32MX130F256D-50I/TL can aggregate data from multiple sensors (temperature, pressure, flow) into a single USB-attached or RS-485-linked industrial sensor hub. The 10-bit ADC with 1 Msps handles analog sensor front-ends directly, while the 1 ns resolution capture module decodes quadrature encoders or pulse-train flowmeters. The -40 to +85 C industrial temperature range ensures operation in factory environments, and the 0.5 mA/MHz active current plus multiple low-power sleep modes with RTCC retention keep average power low for battery-backed installations.
おすすめ
IoT Edge Node with USB Diagnostics
The PIC32MX130F256D-50I/TL's USB-OTG plus multiple serial interfaces make it an effective IoT edge node with a USB diagnostics channel for field updates and logging. Designers can route sensor data to a local USB host (laptop, tablet) for configuration while maintaining UART/I2C links to downstream peripherals. The 256 KB Flash stores Microchip's TCP/IP-lite stacks, MQTT client, or AWS-IoT MQTT over TLS, while the 50 MHz core supports lightweight crypto. The small 6x6 mm VTLA package keeps the BOM area minimal in compact edge devices.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX130F256D-50I/TL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX130F256D-50I/PT | PIC32MX130F256D-I/TL | PIC32MX130F256D-I/PT | PIC32MX130F256B-I/ML | PIC32MX130F256B-50I/SP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VTLA-44 (6x6 mm) - exposed pad | TQFP-44 (10x10 mm) | VTLA-44 (6x6 mm) - same | TQFP-44 (10x10 mm) | QFN-44 | SPDIP-28 |
| Maximum Clock Speed | 50 MHz | 50 MHz | 40 MHz | 40 MHz | 50 MHz | 50 MHz |
| Program Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| USB-OTG | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | No | No |
| PMP (Parallel Master Port) | Yes | Yes | Yes | Yes | No | No |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Pin Count | 44 | 44 | 44 | 44 | 44 | 28 |
主な差別化要因
- Higher CPU clock than /I variant （vs PIC32MX130F256D-I/TL)
- Smaller PCB footprint than /PT variant （vs PIC32MX130F256D-50I/PT)
- Built-in USB-OTG vs /B variant （vs PIC32MX130F256B-I/ML)
設計ノート
The VTLA-44 package relies on its exposed thermal pad (EP) for heat removal. At 50 MHz with USB plus I2S active, total current draw is approximately 25 mA (0.5 mA/MHz x 50 MHz) plus I/O switching. Estimated: with EP soldered to a 1 square inch copper ground pour on a 4-layer FR4 board, theta_JA is roughly 30 C/W, keeping junction rise below 5 C even at full peripheral activity. Stencil aperture should cover 60-80% of EP area with multiple thermal vias (0.3 mm drill, 1.0 mm pitch) to the inner ground plane for best thermal and electrical performance.
Place the 10 uF bulk + 0.1 uF high-frequency bypass capacitor pair within 5 mm of the VDDCORE and VDDIO pins; USB-specific decoupling (0.1 uF on VUSB) should be placed within 3 mm of pin. The 44-pin VTLA package has fine-pitch leads requiring a 0.4 mm pitch land pattern with NSMD pads. Maintain a continuous reference ground plane beneath the entire MCU footprint to control impedance for USB D+/D- differential routing (90 ohm differential impedance per USB 2.0 spec).
Do not omit the 1.5 kohm pull-up resistor on the USB D- line for full-speed device mode - it is required by the USB 2.0 specification and without it the host will not enumerate the device. The exposed thermal pad MUST be soldered to ground; leaving it floating creates both a thermal hot-spot and an EMI risk. When using PPS to remap peripherals, lock the PPS registers early in initialization - late remapping can cause spurious peripheral events on boot.
コンプライアンス情報
RoHS and REACH compliance per Microchip product page. Industrial -I temperature grade is -40 C to +85 C; not AEC-Q100 qualified - choose PIC32MX130F256D-V (automotive grade) for AEC-Q100 needs.
