PIC32MX220F032B-I/ML - 32-bit MCU 40MHz 32KB Flash USB QFN-28 | Microchip
部品番号: PIC32MX220F032B-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.84 | $3.84 |
| 10 | $3.45 | $34.50 |
| 100 | $3.06 | $306.00 |
| 500 | $2.74 | $1,370.00 |
| 1,000 | $2.44 | $2,440.00 |
PIC32MX220F032B-I/ML 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and programmable peripherals into one package. The PIC32MX family sits in the hierarchy: microcontroller -> embedded processor -> semiconductor IC. It targets cost-sensitive 32-bit embedded designs where ARM-class performance is desired but the ecosystem, tools (MPLAB X IDE, XC32 compiler, Harmony framework), and Peripheral Pin Select (PPS) flexibility are preferred.
Key features include Peripheral Pin Select (PPS) for flexible pin assignment, 4 channels of hardware DMA with automatic data size detection, separate PLLs for CPU and USB clocks, and configurable WDT with low-power RC oscillator. Multiple power management modes (Sleep, Idle, Doze) keep active current under 0.5 mA/MHz typical, enabling USB battery-powered designs.
The M4K core executes most instructions in one cycle and is supported by a complete toolchain including MPLAB X, Harmony, and a rich set of application libraries. Integrated USB 2.0 FS eliminates the need for an external PHY for many designs. The 28-QFN package with thermal pad provides a compact footprint suited to space-constrained USB peripherals and consumer products.
Typical applications include USB HID peripherals, audio playback with I2S codec, capacitive-touch human-machine interfaces, low-cost graphics using PMP, sensor aggregation with CTMU, and industrial control nodes. The wide peripheral set allows a single MCU to replace a discrete MCU + external USB bridge + external touch IC in many products.
When designing with this device, ensure the VBUS pin is properly decoupled and the 48 MHz USB PLL is configured per the datasheet. The PPS feature requires careful pin lock configuration - applications should set PPS once at startup and avoid runtime re-mapping to prevent glitches.
This page synthesizes distributor pricing, parametric comparison against same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: PIC32MX220F032B-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX220F032B-I/ML (同一形状・フットプリント) — 相違点: Package, ADC, Operating Temperature, SRAM, Core.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX220F032B-50I/ML
✅ ドロップイン📋 参考代替品(カタログ未掲載)
PIC32MX230F032B-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
PIC32MX130F128L-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.71 / 個
データシートを見る →PIC32MX150F128B-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.3 / 個
データシートを見る →PIC32MX270F256B-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
PIC32MX220F032B-I/ML 最大定格&電気的特性
| Core Architecture | MIPS32 M4K RISC |
| Core Width | 32-bit |
| Maximum CPU Speed | 40 MHz (50 MHz for -50I variants) |
| MIPS Performance | Up to 52 MIPS (83 DMIPS for -50I) |
| Flash Memory | 32 KB (32K x 8) |
| SRAM | 8 KB |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| I2S/SPI Modules | 2 |
| UART Modules | 2 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| ADC | 10-bit, 1 Msps, up to 13 channels |
| DMA Channels | 4 (with automatic data size detection) |
| CTMU (Charge Time Measurement Unit) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| Operating Voltage | 2.3 V to 3.6 V |
| 動作温度 | -40C to +85C (Industrial, -I) |
| パッケージ | 28-pin QFN (6x6 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
| Tube Quantity | Per tube packaging (ML suffix) |
PIC32MX220F032B-I/ML ピン構成
| ピン 1 | RA0 — Port A bit 0 / analog input / PPS-mappable I/O |
| ピン 2 | RA1 — Port A bit 1 / analog input / PPS-mappable I/O |
| ピン 3 | RA2 — Port A bit 2 / analog input / PPS-mappable I/O |
| ピン 4 | RA3 — Port A bit 3 / analog input / reference voltage |
| ピン 5 | RA4 — Port A bit 4 / analog input / PPS-mappable I/O |
| ピン 6 | VDD — Positive supply voltage (2.3 V to 3.6 V) |
| ピン 7 | VSS — Ground reference |
| ピン 8 | RB0 — Port B bit 0 / programming / PPS-mappable I/O |
| ピン 9 | RB1 — Port B bit 1 / programming / PPS-mappable I/O |
| ピン 10 | RB2 — Port B bit 2 / analog input / PPS-mappable I/O |
| ピン 11 | RB3 — Port B bit 3 / analog input / PPS-mappable I/O |
| ピン 12 | RB4 — Port B bit 4 / analog input / PPS-mappable I/O |
| ピン 13 | RB5 — Port B bit 5 / analog input / PPS-mappable I/O |
| ピン 14 | RB6 — Port B bit 6 / analog input / PPS-mappable I/O |
| ピン 15 | RB7 — Port B bit 7 / analog input / PPS-mappable I/O |
| ピン 16 | RC0 — Port C bit 0 / analog input / PPS-mappable I/O |
| ピン 17 | RC1 — Port C bit 1 / analog input / PPS-mappable I/O |
| ピン 18 | RC2 — Port C bit 2 / analog input / PPS-mappable I/O |
| ピン 19 | VUSB — USB voltage supply (3.3 V regulated from VBUS) |
| ピン 20 | VBUS — USB VBUS sense input |
| ピン 21 | D+ — USB D+ data line |
| ピン 22 | D- — USB D- data line |
| ピン 23 | RC3 — Port C bit 3 / analog input / PPS-mappable I/O |
| ピン 24 | RC4 — Port C bit 4 / analog input / PPS-mappable I/O |
| ピン 25 | RC5 — Port C bit 5 / analog input / PPS-mappable I/O |
| ピン 26 | RC6 — Port C bit 6 / analog input / PPS-mappable I/O / OSCCK |
| ピン 27 | RC7 — Port C bit 7 / analog input / PPS-mappable I/O / OSCF |
| ピン 28 | EP — Exposed thermal pad - tie to ground for thermal dissipation |
主な用途
PIC32MX220F032B-I/ML の用途: 6 件s: USB HID Peripheral (Keyboard / Mouse / Custom HID), USB Audio Class Device (USB-to-I2S Bridge), Capacitive Touch HMI (Buttons / Sliders / Proximity), Low-Cost Graphics Display via PMP, Industrial Sensor Aggregation Node, USB Host Embedded Application.
USB HID Peripheral (Keyboard / Mouse / Custom HID)
The PIC32MX220F032B-I/ML's integrated USB 2.0 Full-Speed controller with separate USB PLL makes it an excellent fit for USB HID peripherals where a true 32-bit MCU is preferred over 8/16-bit alternatives. The 40 MHz / 52 MIPS CPU provides ample headroom for the USB stack plus application processing - HID class drivers typically consume less than 5 MIPS, leaving the rest for sensor handling and LED matrix control. Peripheral Pin Select (PPS) allows flexible pin assignment of USB D+/D- across available pins, simplifying PCB layout in space-constrained enclosures. The 28-QFN (6x6) footprint enables compact USB dongle form factors.
おすすめ
USB Audio Class Device (USB-to-I2S Bridge)
The PIC32MX220F032B-I/ML integrates both USB 2.0 Full-Speed OTG and two I2S/SPI modules, making it ideal for USB-to-I2S audio bridges that stream digital audio from a host PC to an external DAC. The dedicated USB PLL isolates USB jitter from the I2S clock domain, and the two I2S modules can drive independent L/R channels or feed a stereo DAC plus a headphone amplifier. At 40 MHz / 52 MIPS the MCU has enough headroom for USB isochronous endpoint handling plus I2S transmit DMA via the 4-channel DMA controller. The CTMU enables front-panel capacitive touch buttons for play/pause/volume.
おすすめ
Capacitive Touch HMI (Buttons / Sliders / Proximity)
The PIC32MX220F032B-I/ML's integrated CTMU (Charge Time Measurement Unit) plus up to 13 channels of 10-bit ADC enables multi-channel capacitive touch sensing without an external touch IC. The CTMU produces a precision current source that, combined with the ADC, measures capacitance changes from finger touches or proximity events. The PPS feature allows touch channels to be remapped to virtually any digital I/O pin, simplifying PCB layout. The 8 KB SRAM comfortably hosts touch-scanning state machines plus USB HID reporting for touch-enabled USB peripherals.
おすすめ
Low-Cost Graphics Display via PMP
The PIC32MX220F032B-I/ML includes a Parallel Master Port (PMP) that interfaces directly to parallel LCD controllers and FPGA graphics engines, enabling low-cost graphical user interfaces. At 40 MHz the PMP can drive small QVGA/WQVGA displays with 8/16-bit data width. The combination of PMP for display data plus I2S/SPI for touch sensing plus USB for configuration upload gives a single-MCU graphics HMI solution. The 32 KB Flash fits modest GUIs with framebuffer compression or direct rendering.
おすすめ
Industrial Sensor Aggregation Node
The PIC32MX220F032B-I/ML's mix of I2C, UART, SPI, ADC, and CTMU makes it well suited for industrial sensor aggregation nodes that read multiple sensor types and forward data over USB, UART, or industrial protocols. The 4-channel DMA with automatic data size detection offloads repetitive I/O, freeing the 40 MHz M4K core for protocol conversion and data aggregation logic. The industrial -40C to +85C temperature range supports factory-floor deployment; the 28-QFN (6x6) footprint integrates into compact DIN-rail or wall-mount enclosures.
おすすめ
USB Host Embedded Application
In USB Host mode, the PIC32MX220F032B-I/ML can interface to USB mass-storage devices, HID-class peripherals, or USB-to-serial bridges in embedded products such as data loggers, configuration uploaders, or industrial USB host controllers. The USB OTG support allows the same firmware to switch between device and host roles via the ID pin. The 8 KB SRAM is sufficient for USB host stacks and small file system buffers; for larger file systems, the -50I speed grade delivers more MIPS for faster throughput.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX220F032B-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX220F032B-50I/ML | PIC32MX230F032B-I/ML | PIC32MX150F128B-I/ML | PIC32MX270F256B-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Maximum CPU Speed | 40 MHz | 50 MHz (+25%) | 50 MHz (+25%) | 50 MHz (+25%) | 50 MHz (+25%) |
| Flash Memory | 32 KB | 32 KB (same) | 32 KB (same) | 128 KB (+300%) | 256 KB (+700%) |
| SRAM | 8 KB | 8 KB (same) | 8 KB (same) | 32 KB (+300%) | 64 KB (+700%) |
| USB 2.0 FS OTG | Yes | Yes | Yes | No | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
主な差別化要因
- Integrated USB 2.0 FS OTG without external PHY (vs PIC32MX150F128B-I/ML)
- Available in 50 MHz / 83 DMIPS speed grade for performance headroom (vs PIC32MX220F032B-50I/ML)
- CTMU for capacitive touch sensing without external touch IC (vs PIC32MX270F256B-I/ML)
設計ノート
Estimated: The PIC32MX220F032B-I/ML active current is under 0.5 mA/MHz, so at 40 MHz full activity from a 3.3 V rail the MCU core current is ~20 mA. Add USB suspend current (~0.5 mA), ADC sampling (~1 mA), and I/O drive for an estimated total budget of 25-35 mA. The 28-QFN exposed thermal pad (EP) must be soldered to a ground plane to provide thermal dissipation; a 4-layer PCB with continuous ground pour under the EP is recommended.
Place a 100 nF decoupling capacitor as close as possible to each VDD pin, plus a bulk 10 uF tantalum or ceramic capacitor on the main 3.3 V rail. The VUSB pin requires its own 100 nF plus a 4.7 uF capacitor per USB specification - the internal USB transceiver regulator drops the 5 V VBUS to 3.3 V. The D+ and D- traces must be routed as a 90 ohm differential pair and kept short; place the common-mode choke and ESD protection array within 5 mm of the USB connector.
When using Peripheral Pin Select (PPS), configure all PPS mappings at startup and avoid runtime re-mapping while peripherals are active - changing PPS assignments on the fly can cause glitches or peripheral lock-up. For USB device applications, the ID pin (used for OTG) must be properly terminated; floating the ID pin defaults the part to USB device mode. The MCLR reset pin must be pulled high via a 10 kohm resistor for normal operation, and capacitors on MCLR should be avoided to prevent slow reset edges.
The 28-QFN (6x6 mm) package has a thermal pad on the underside that must be soldered to the PCB for proper thermal performance and mechanical reliability. Use a 0.5 mm pitch land pattern with 0.3 mm diameter pads per IPC-7351. Apply a solder paste stencil with apertures slightly reduced (80-90%) over the thermal pad to prevent the part from floating during reflow. Hand-soldering QFN packages is not recommended; use reflow or hot-air rework.
コンプライアンス情報
RoHS compliant per Microchip product page. Lead-free and halogen-free finish per Microchip material declaration. NOT AEC-Q100 qualified - industrial temperature only (-40C to +85C). For automotive applications, use AEC-Q100 qualified PIC32MX variants. Conflict-mineral CMRT status available from Microchip on request.