PIC32MX230F064DT-I/ML - 40MHz 32-bit MCU 64KB Flash | Microchip
部品番号: PIC32MX230F064DT-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.62 | $3.62 |
| 10 | $3.25 | $32.50 |
| 100 | $2.89 | $289.00 |
| 500 | $2.59 | $1,295.00 |
| 1,000 | $2.31 | $2,310.00 |
PIC32MX230F064DT-I/ML 概要
A microcontroller (MCU) is a single-chip computer that combines a CPU core, program memory (Flash), data memory (SRAM), and a configurable set of peripheral interfaces on one silicon die. The PIC32MX230 family belongs to the Microchip 32-bit PIC32 hierarchy: PIC32MX -> MIPS M4K 32-bit core -> general-purpose MCU with USB and mTouch. It is widely used as a low-cost, deterministic alternative to ARM Cortex-M0/M3 parts in cost-sensitive consumer and industrial designs.
Key features include 33 digital I/O lines, two I2S/SPI modules for codec and serial audio, Peripheral Pin Select (PPS) remappable peripherals, a Parallel Master Port (PMP) for graphics interfaces, mTouch capacitive-touch support, 1 ns high-resolution time measurement, and on-chip temperature sensing. Five 16-bit general-purpose timers and a 5-channel 10-bit ADC at 1 Msps provide analog and timing flexibility.
The architecture combines a Harvard-style 5-stage pipeline MIPS32 M4K core with a dedicated DMA controller and a USB 2.0 full-speed device/host/OTG transceiver on-chip, eliminating the need for an external PHY. Integrated crypto and unique-device-id features support secure boot use cases, while low-power Run, Idle, and Sleep modes cut typical current draw to 0.5 mA/MHz active.
Typical applications include USB audio peripherals, low-cost graphics HMI panels, capacitive-touch user interfaces, sensor hubs, and small-format IoT edge nodes. The wide operating temperature range of -40C to +105C suits industrial enclosures and outdoor installations.
For new designs, prefer the T (tape-and-reel) and -I (industrial temp) suffix ordering code, and ensure the EP pad is soldered to a properly sized copper thermal plane to meet the 8x8 mm QFN thermal budget. Refer to the Microchip PIC32MX230/250/270/330/350/370 data sheet for register-level details and peripheral library code.
ドロップイン代替品: PIC32MX230F064DT-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX230F064DT-I/ML （同一形状・フットプリント） — 相違点: Package, ADC, Operating Temperature, Timers, USB.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX230F064D-I/ML
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX250F064DT-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC32MX130F064DT-I/ML
✅ ドロップイン✓ 在庫あり
$2.42 / 個
データシートを見る →PIC32MX170F256DT-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC32MX120F032DT-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1.92 / 個
データシートを見る →PIC32MX230F064DT-I/ML 最大定格＆電気的特性
| Core Processor | MIPS32 M4K |
| Core Size | 32-Bit Single-Core |
| Maximum CPU Speed | 40 MHz (66 DMIPS) |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 16 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Pins | 33 (some sources: 34) |
| パッケージ | 44-pin QFN (8x8 mm) with EP |
| Package Code | ML (QFN-44 EP) |
| Temperature Range | -40C to +105C (Industrial, I suffix) |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| ADC | 10-bit, up to 1 Msps, 9 channels |
| Timers | Five 16-bit General Purpose Timers |
| Communication Interfaces | 2x I2C, 2x SPI, 2x I2S, 2x UART, LIN, IrDA |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| mTouch Capacitive Touch | Supported |
| Active Current Consumption | 0.5 mA/MHz (typical) |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount |
PIC32MX230F064DT-I/ML ピン構成
| ピン 1 | RB0 — I/O port B bit 0 (PPS-capable) |
| ピン 2 | RB1 — I/O port B bit 1 |
| ピン 3 | RB2 — I/O port B bit 2 |
| ピン 4 | RB3 — I/O port B bit 3 |
| ピン 5 | VBUS — USB VBUS detect (5 V tolerant) |
| ピン 6 | D+ — USB D+ data line |
| ピン 7 | D- — USB D- data line |
| ピン 8 | VDD — Digital supply (2.3-3.6 V) |
| ピン 9 | RB4 — I/O port B bit 4 |
| ピン 10 | RB5 — I/O port B bit 5 |
| ピン 11 | VSS — Digital ground |
| ピン 12 | OSC1/RC12 — Crystal oscillator input or GPIO |
| ピン 13 | OSC2/RC15 — Crystal oscillator output or GPIO |
| ピン 14 | RA1 — I/O port A bit 1 |
| ピン 15 | RA2 — I/O port A bit 2 |
| ピン 16 | RC4/RTCC — I/O or RTCC output |
| ピン 17 | RA3 — I/O port A bit 3 |
| ピン 18 | RA4 — I/O port A bit 4 |
| ピン 19 | RC3 — I/O port C bit 3 |
| ピン 20 | RC2 — I/O port C bit 2 |
| ピン 21 | RC1 — I/O port C bit 1 |
| ピン 22 | RC0 — I/O port C bit 0 |
| ピン 23 | RB6 — I/O port B bit 6 |
| ピン 24 | RB7 — I/O port B bit 7 |
| ピン 25 | AVDD — Analog supply (2.3-3.6 V) |
| ピン 26 | AVSS — Analog ground |
| ピン 27 | RB8 — I/O port B bit 8 |
| ピン 28 | RB9 — I/O port B bit 9 |
| ピン 29 | RB10 — I/O port B bit 10 |
| ピン 30 | RB11 — I/O port B bit 11 |
| ピン 31 | RB12 — I/O port B bit 12 |
| ピン 32 | RB13 — I/O port B bit 13 |
| ピン 33 | RB14/PGM — I/O port B bit 14 / ICSP programming clock |
| ピン 34 | RB15 — I/O port B bit 15 |
| ピン 35 | RA5 — I/O port A bit 5 |
| ピン 36 | RA6 — I/O port A bit 6 |
| ピン 37 | RA7 — I/O port A bit 7 |
| ピン 38 | RC5 — I/O port C bit 5 |
| ピン 39 | RC6 — I/O port C bit 6 |
| ピン 40 | RC7 — I/O port C bit 7 |
| ピン 41 | RC8 — I/O port C bit 8 |
| ピン 42 | RC9 — I/O port C bit 9 |
| ピン 43 | MCLR — Master clear reset (active low) |
| ピン 44 | RA0 — I/O port A bit 0 |
| ピン EP | EP — Exposed thermal pad - must be soldered to ground plane |
主な用途
PIC32MX230F064DT-I/ML の用途: 6 件s: USB Audio Peripherals, Low-Cost Graphics HMI Panels, Capacitive Touch User Interfaces, Industrial Sensor Hubs, Small-Format IoT Edge Nodes, Consumer Appliance Control Boards.
USB Audio Peripherals
The PIC32MX230F064DT-I/ML is well suited to USB audio peripherals such as USB speakers, headsets, and DAC dongles because it integrates a USB 2.0 full-speed OTG controller, two I2S interfaces for external audio codecs, and 16 KB of SRAM to buffer USB audio packets. At 24-bit/48 kHz stereo, the CPU retains roughly 65-70% free bandwidth for control logic and LED handling. Compared with discrete USB+MCU solutions, this part eliminates an external USB PHY and reduces BOM cost. Typical reference designs include the Microchip PIC32MX USB Audio Speaker Kit, and the I2S pins map directly to TI PCM5102A or Cirrus CS4344 DACs.
おすすめ
Low-Cost Graphics HMI Panels
The PIC32MX230F064DT-I/ML is a strong fit for small graphical HMI panels (up to 320x240 QVGA) because its Parallel Master Port (PMP) interfaces directly to TFT controllers like the Solomon Systech SSD1963 or RA8875, while the 16 KB SRAM holds frame buffers and fonts. The 40 MHz MIPS32 M4K core with 66 DMIPS can refresh 320x240 panels at 30 fps without DMA, leaving headroom for touch processing. Peripheral Pin Select (PPS) lets designers reassign PMP data lines to free GPIOs, simplifying PCB routing in space-constrained panels. Microchip's Microchip Graphics Library (MLA) provides drop-in display drivers for common panels.
おすすめ
Capacitive Touch User Interfaces
The PIC32MX230F064DT-I/ML supports mTouch capacitive touch buttons, sliders, and proximity sensors through its on-chip CVD (Charge-Voltage Division) ADC-driven touch peripheral, removing the need for an external touch controller. With 33 I/O pins, a single MCU can scan up to ~25 touch electrodes while still driving LCDs, LEDs, and communication. The 1 Msps 10-bit ADC keeps electrode scan time under 200 microseconds per channel, supporting responsive UI updates. mTouch libraries include water-rejection and noise-handling firmware proven in Microchip reference designs for kitchen appliances and industrial controls.
おすすめ
Industrial Sensor Hubs
The PIC32MX230F064DT-I/ML serves as an industrial sensor hub because it offers dual I2C/SPI/UART interfaces for connecting multiple sensors, two I2S ports for digital microphones, and a -40C to +105C industrial temperature range suitable for factory floors. The 64 KB Flash holds MODBUS/RTU and CANopen stacks alongside application firmware, while 16 KB SRAM supports buffering of sensor bursts up to 1 kHz. On-chip temperature sensing and the 10-bit ADC let the same MCU monitor ambient temperature and analog process variables without external components, reducing system cost and PCB area.
おすすめ
Small-Format IoT Edge Nodes
The PIC32MX230F064DT-I/ML fits compact IoT edge nodes because it integrates USB for firmware update, UART for cloud module connectivity (ESP32, Wi-Fi or NB-IoT modems), and PPS-reprogrammable I/O to optimize PCB layout. Its 0.5 mA/MHz active current and sleep modes draw microamp-level standby, suitable for battery-powered nodes. The 64 KB Flash supports TLS client libraries (wolfSSL) and AWS IoT or MQTT stacks, while the 16 KB SRAM holds TLS session keys and packet buffers. With the 8x8 mm QFN package, total PCB area including passives stays under 25x25 mm.
おすすめ
Consumer Appliance Control Boards
The PIC32MX230F064DT-I/ML suits consumer appliance control boards (washing machines, ovens, air conditioners) because it offers mTouch for glass-front panels, PWM timers for motor and heater control, and an industrial -40C to +105C temperature range for harsh environments. The 40 MHz MIPS32 M4K core with 66 DMIPS runs appliance control loops at 1 ms with margin for safety logic. Its 33 I/O pins handle keypads, LED indicators, relays, and triac drive while PPS remapping simplifies EMC-compliant board layouts. Microchip's Class B safety library (IEC 60730) is pre-validated for this family.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX230F064DT-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX230F064D-I/ML | PIC32MX250F064DT-I/ML | PIC32MX130F064DT-I/ML | PIC32MX170F256DT-I/ML | PIC32MX120F032DT-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN 8x8 mm (ML) | 44-pin QFN 8x8 mm (ML) - same | 44-pin QFN 8x8 mm (ML) - same | 44-pin QFN 8x8 mm (ML) - same | 44-pin QFN 8x8 mm (ML) - same | 44-pin QFN 8x8 mm (ML) - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Max Clock Speed | 40 MHz / 66 DMIPS | 40 MHz / 66 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 66 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 66 DMIPS |
| Flash | 64 KB | 64 KB | 64 KB | 64 KB | 256 KB | 32 KB |
| RAM | 16 KB | 16 KB | 32 KB | 16 KB | 64 KB | 8 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| I/O Pins | 33 | 33 | 33 | 33 | 33 | 33 |
| Temperature Range | -40C to +105C (I) | -40C to +105C (I) | -40C to +105C (I) | -40C to +105C (I) | -40C to +105C (I) | -40C to +105C (I) |
| mTouch / PMP | Both supported | Both supported | Both supported | mTouch only (no PMP) | Both supported | mTouch only (no PMP) |
主な差別化要因
- Higher pin count and full peripheral set vs PIC32MX130/120 in same QFN package （vs PIC32MX120F032DT-I/ML)
- Industrial temperature range with USB OTG （vs PIC32MX230F064D-I/TL (VTLA package))
- Lower-cost tape-and-reel variant for volume manufacturing （vs PIC32MX230F064D-I/ML (tray))
設計ノート
The 44-pin QFN (8x8 mm) package dissipates heat primarily through the central exposed pad (EP). Solder the EP to a continuous ground copper plane with thermal vias (typically 9-16 vias of 0.3 mm drill) to achieve the datasheet theta_JA of approximately 28 C/W. Without EP soldering, junction temperature can exceed 125 C at moderate loads. Always flood the top and bottom copper under the EP and stitch vias into the inner ground plane.
Place a 10 uF bulk ceramic capacitor (X5R/X7R) within 5 mm of each VDD/AVDD pin pair and a 0.1 uF decoupling cap within 2 mm of each VDD pin. The analog AVDD pin should be filtered with a ferrite bead and 10 uF + 0.1 uF to reduce ADC reference noise. USB bus-powered designs require a 4.7 uF bulk on VBUS to handle inrush when the host enumerates the device.
Route the USB D+ and D- traces as a 90-ohm differential pair with continuous ground reference underneath, keeping trace length under 25 mm and matching length to within 150 mil. Avoid splitting the ground plane under the USB traces. PPS reassigns most digital peripherals to alternate I/O pins, so place the MCU near the centre of the board to give all peripherals short equal-length traces.
Do not leave the MCLR pin floating - tie it to VDD through a 10 kohm pull-up and add a 100 nF cap to ground for noise immunity, otherwise spurious resets will occur during power-up. The ICSP programming pins PGECx/PGEDx must be brought out to a programming header; routing them under the QFN EP is not possible. Finally, the on-chip voltage regulator requires an external 10 uF + 0.1 uF cap on the VCAP pin for stability.
コンプライアンス情報
RoHS compliant per Microchip product page. Lead-free and halogen-free per Microchip material declarations. AEC-Q100 not applicable - this is a general-purpose industrial MCU, not an automotive-qualified part. For automotive applications, contact Microchip about AEC-Q100 qualified variants in the PIC32 family.
