Microchip Technology

PIC32MX230F064DT-I/ML - 40MHz 32-bit MCU 64KB Flash | Microchip

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2.3 V to 3.6 V Vdss 0.5 mA/MHz (typical) Id 44-pin QFN (8x8 mm) with EP Package 40 MHz (66 DMIPS) Speed 64 KB (64K x 8) Memory
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Price updated: 2026-10-01
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1 $3.62 $3.62
10 $3.25 $32.50
100 $2.89 $289.00
500 $2.59 $1,295.00
1,000 $2.31 $2,310.00
ℹ️ All prices are in USD

PIC32MX230F064DT-I/ML Overview

The Microchip Technology PIC32MX230F064DT-I/ML is a 32-bit MIPS32 M4K RISC microcontroller integrating 64KB of Flash program memory, 16KB of SRAM, and a peripheral set tuned for audio, graphics, USB, and advanced analog applications. It runs at up to 40 MHz (66 DMIPS), operates from a 2.3 V to 3.6 V supply, and is housed in a 44-pin QFN (8x8 mm) package with an exposed thermal pad (EP).

A microcontroller (MCU) is a single-chip computer that combines a CPU core, program memory (Flash), data memory (SRAM), and a configurable set of peripheral interfaces on one silicon die. The PIC32MX230 family belongs to the Microchip 32-bit PIC32 hierarchy: PIC32MX -> MIPS M4K 32-bit core -> general-purpose MCU with USB and mTouch. It is widely used as a low-cost, deterministic alternative to ARM Cortex-M0/M3 parts in cost-sensitive consumer and industrial designs.

Key features include 33 digital I/O lines, two I2S/SPI modules for codec and serial audio, Peripheral Pin Select (PPS) remappable peripherals, a Parallel Master Port (PMP) for graphics interfaces, mTouch capacitive-touch support, 1 ns high-resolution time measurement, and on-chip temperature sensing. Five 16-bit general-purpose timers and a 5-channel 10-bit ADC at 1 Msps provide analog and timing flexibility.

The architecture combines a Harvard-style 5-stage pipeline MIPS32 M4K core with a dedicated DMA controller and a USB 2.0 full-speed device/host/OTG transceiver on-chip, eliminating the need for an external PHY. Integrated crypto and unique-device-id features support secure boot use cases, while low-power Run, Idle, and Sleep modes cut typical current draw to 0.5 mA/MHz active.

Typical applications include USB audio peripherals, low-cost graphics HMI panels, capacitive-touch user interfaces, sensor hubs, and small-format IoT edge nodes. The wide operating temperature range of -40C to +105C suits industrial enclosures and outdoor installations.

For new designs, prefer the T (tape-and-reel) and -I (industrial temp) suffix ordering code, and ensure the EP pad is soldered to a properly sized copper thermal plane to meet the 8x8 mm QFN thermal budget. Refer to the Microchip PIC32MX230/250/270/330/350/370 data sheet for register-level details and peripheral library code.

Drop-in alternatives for PIC32MX230F064DT-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MX230F064DT-I/ML (same form factor and footprint) — differing in Package, ADC, Operating Temperature, Timers, USB.

Microchip Technology
Package: 44-pin QFN (8x8 mm) with exposed pad
ADC: 10-bit, 1 Msps, up to 13 channels
Operating Temperature: -40C to +85C (Industrial, "I")
Microchip Technology
Package: 44-pin QFN (8x8 mm) with Exposed Pad
Operating Temperature: -40C to +85C (Industrial, I suffix)
Timers: Five 16-bit general-purpose
Microchip Technology
Package: 44-pin QFN (8x8 mm) with exposed pad (ML)
ADC: 10-bit 1 Msps, up to 13 channels (family-level)
Operating Temperature: -40C to +105C (AEC-Q100 Grade 1)
Microchip Technology
Package: 44-pin VTLA (6x6 mm) with exposed pad
ADC: 10-bit, 1.1 Msps, up to 13 channels
Operating Temperature: -40C to +105C (automotive Grade 1, V suffix)
Microchip Technology
Package: 64-pin QFN (9x9 mm) with exposed pad
ADC: 10-bit, up to 28 channels
Operating Temperature: -40C to +105C (V-temp grade)
Microchip Technology
Package: 44-QFN (8x8 mm) with exposed pad
ADC: 10-bit, up to 28 channels, 1 Msps
Operating Temperature: -40C to +85C (Industrial)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MX230F064D-I/ML

✅ Drop-In
📦 44-pin QFN (8x8 mm, ML)
same die, same ML QFN-44 footprint; tray packaging instead of tape-and-reel

📋 Reference alternative (not in catalog)

PIC32MX250F064DT-I/ML

✅ Drop-In ⚠️ Specs Unverified
📦 44-pin QFN (8x8 mm, ML)
same QFN-44 ML footprint; upgraded PIC32MX250 die with more peripherals and 256 KB Flash family (different sub-family)

📋 Reference alternative (not in catalog)

PIC32MX130F064DT-I/ML

✅ Drop-In
Microchip Technology
📦 44-pin QFN (8x8 mm, ML)
MIPS32 M4K 32-bit RISC · 40 MHz · 1.56 DMIPS/MHz (62 DMIPS peak) · 64 KB (64K x 8) · 16 KB · 2.3 V to 3.6 V · -40C to +85C (Industrial, I suffix) · 21

✓ In Stock

$2.42 / Unit

View Datasheet →

PIC32MX170F256DT-I/ML

✅ Drop-In ⚠️ Specs Unverified
📦 44-pin QFN (8x8 mm, ML)
same QFN-44 ML footprint; PIC32MX170 die with 256 KB Flash and 64 KB RAM (4x program memory)

📋 Reference alternative (not in catalog)

PIC32MX120F032DT-I/ML

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 44-pin QFN (8x8 mm, ML)
MIPS32 M4K 32-bit RISC · 40 MHz · 32 KB (32K x 8) · 8 KB · 2.3 V to 3.6 V · 21 · USB 2.0 Full-Speed with on-chip transceiver · 10-bit, 1 Msps, up to 13 channels

✓ In Stock

$1.92 / Unit

View Datasheet →

PIC32MX230F064DT-I/ML Maximum Ratings & Electrical Characteristics

Core Processor MIPS32 M4K
Core Size 32-Bit Single-Core
Maximum CPU Speed 40 MHz (66 DMIPS)
Program Memory (Flash) 64 KB (64K x 8)
RAM 16 KB
Supply Voltage (VDD) 2.3 V to 3.6 V
I/O Pins 33 (some sources: 34)
Package 44-pin QFN (8x8 mm) with EP
Package Code ML (QFN-44 EP)
Temperature Range -40C to +105C (Industrial, I suffix)
USB USB 2.0 Full-Speed Device/Host/OTG
ADC 10-bit, up to 1 Msps, 9 channels
Timers Five 16-bit General Purpose Timers
Communication Interfaces 2x I2C, 2x SPI, 2x I2S, 2x UART, LIN, IrDA
Peripheral Pin Select (PPS) Yes
Parallel Master Port (PMP) Yes
mTouch Capacitive Touch Supported
Active Current Consumption 0.5 mA/MHz (typical)
RoHS Status Compliant
Mounting Type Surface Mount

PIC32MX230F064DT-I/ML Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 RB0 — I/O port B bit 0 (PPS-capable)
Pin 2 RB1 — I/O port B bit 1
Pin 3 RB2 — I/O port B bit 2
Pin 4 RB3 — I/O port B bit 3
Pin 5 VBUS — USB VBUS detect (5 V tolerant)
Pin 6 D+ — USB D+ data line
Pin 7 D- — USB D- data line
Pin 8 VDD — Digital supply (2.3-3.6 V)
Pin 9 RB4 — I/O port B bit 4
Pin 10 RB5 — I/O port B bit 5
Pin 11 VSS — Digital ground
Pin 12 OSC1/RC12 — Crystal oscillator input or GPIO
Pin 13 OSC2/RC15 — Crystal oscillator output or GPIO
Pin 14 RA1 — I/O port A bit 1
Pin 15 RA2 — I/O port A bit 2
Pin 16 RC4/RTCC — I/O or RTCC output
Pin 17 RA3 — I/O port A bit 3
Pin 18 RA4 — I/O port A bit 4
Pin 19 RC3 — I/O port C bit 3
Pin 20 RC2 — I/O port C bit 2
Pin 21 RC1 — I/O port C bit 1
Pin 22 RC0 — I/O port C bit 0
Pin 23 RB6 — I/O port B bit 6
Pin 24 RB7 — I/O port B bit 7
Pin 25 AVDD — Analog supply (2.3-3.6 V)
Pin 26 AVSS — Analog ground
Pin 27 RB8 — I/O port B bit 8
Pin 28 RB9 — I/O port B bit 9
Pin 29 RB10 — I/O port B bit 10
Pin 30 RB11 — I/O port B bit 11
Pin 31 RB12 — I/O port B bit 12
Pin 32 RB13 — I/O port B bit 13
Pin 33 RB14/PGM — I/O port B bit 14 / ICSP programming clock
Pin 34 RB15 — I/O port B bit 15
Pin 35 RA5 — I/O port A bit 5
Pin 36 RA6 — I/O port A bit 6
Pin 37 RA7 — I/O port A bit 7
Pin 38 RC5 — I/O port C bit 5
Pin 39 RC6 — I/O port C bit 6
Pin 40 RC7 — I/O port C bit 7
Pin 41 RC8 — I/O port C bit 8
Pin 42 RC9 — I/O port C bit 9
Pin 43 MCLR — Master clear reset (active low)
Pin 44 RA0 — I/O port A bit 0
Pin EP EP — Exposed thermal pad - must be soldered to ground plane

Typical Applications

PIC32MX230F064DT-I/ML is suitable for 6 applications: USB Audio Peripherals, Low-Cost Graphics HMI Panels, Capacitive Touch User Interfaces, Industrial Sensor Hubs, Small-Format IoT Edge Nodes, Consumer Appliance Control Boards.

🎧

USB Audio Peripherals

The PIC32MX230F064DT-I/ML is well suited to USB audio peripherals such as USB speakers, headsets, and DAC dongles because it integrates a USB 2.0 full-speed OTG controller, two I2S interfaces for external audio codecs, and 16 KB of SRAM to buffer USB audio packets. At 24-bit/48 kHz stereo, the CPU retains roughly 65-70% free bandwidth for control logic and LED handling. Compared with discrete USB+MCU solutions, this part eliminates an external USB PHY and reduces BOM cost. Typical reference designs include the Microchip PIC32MX USB Audio Speaker Kit, and the I2S pins map directly to TI PCM5102A or Cirrus CS4344 DACs.

📺

Low-Cost Graphics HMI Panels

The PIC32MX230F064DT-I/ML is a strong fit for small graphical HMI panels (up to 320x240 QVGA) because its Parallel Master Port (PMP) interfaces directly to TFT controllers like the Solomon Systech SSD1963 or RA8875, while the 16 KB SRAM holds frame buffers and fonts. The 40 MHz MIPS32 M4K core with 66 DMIPS can refresh 320x240 panels at 30 fps without DMA, leaving headroom for touch processing. Peripheral Pin Select (PPS) lets designers reassign PMP data lines to free GPIOs, simplifying PCB routing in space-constrained panels. Microchip's Microchip Graphics Library (MLA) provides drop-in display drivers for common panels.

🧩

Capacitive Touch User Interfaces

The PIC32MX230F064DT-I/ML supports mTouch capacitive touch buttons, sliders, and proximity sensors through its on-chip CVD (Charge-Voltage Division) ADC-driven touch peripheral, removing the need for an external touch controller. With 33 I/O pins, a single MCU can scan up to ~25 touch electrodes while still driving LCDs, LEDs, and communication. The 1 Msps 10-bit ADC keeps electrode scan time under 200 microseconds per channel, supporting responsive UI updates. mTouch libraries include water-rejection and noise-handling firmware proven in Microchip reference designs for kitchen appliances and industrial controls.

🏭

Industrial Sensor Hubs

The PIC32MX230F064DT-I/ML serves as an industrial sensor hub because it offers dual I2C/SPI/UART interfaces for connecting multiple sensors, two I2S ports for digital microphones, and a -40C to +105C industrial temperature range suitable for factory floors. The 64 KB Flash holds MODBUS/RTU and CANopen stacks alongside application firmware, while 16 KB SRAM supports buffering of sensor bursts up to 1 kHz. On-chip temperature sensing and the 10-bit ADC let the same MCU monitor ambient temperature and analog process variables without external components, reducing system cost and PCB area.

🌐

Small-Format IoT Edge Nodes

The PIC32MX230F064DT-I/ML fits compact IoT edge nodes because it integrates USB for firmware update, UART for cloud module connectivity (ESP32, Wi-Fi or NB-IoT modems), and PPS-reprogrammable I/O to optimize PCB layout. Its 0.5 mA/MHz active current and sleep modes draw microamp-level standby, suitable for battery-powered nodes. The 64 KB Flash supports TLS client libraries (wolfSSL) and AWS IoT or MQTT stacks, while the 16 KB SRAM holds TLS session keys and packet buffers. With the 8x8 mm QFN package, total PCB area including passives stays under 25x25 mm.

🏭

Consumer Appliance Control Boards

The PIC32MX230F064DT-I/ML suits consumer appliance control boards (washing machines, ovens, air conditioners) because it offers mTouch for glass-front panels, PWM timers for motor and heater control, and an industrial -40C to +105C temperature range for harsh environments. The 40 MHz MIPS32 M4K core with 66 DMIPS runs appliance control loops at 1 ms with margin for safety logic. Its 33 I/O pins handle keypads, LED indicators, relays, and triac drive while PPS remapping simplifies EMC-compliant board layouts. Microchip's Class B safety library (IEC 60730) is pre-validated for this family.

Recommended Products Summary

PCM5102A I2S audio DAC reference design companion Used in: USB Audio Peripherals PIC32MX230F064D-I/ML Tray-pack variant of same die for development Used in: USB Audio Peripherals, Capacitive Touch User Interfaces, Small-Format IoT Edge Nodes SSD1963 Solomon Systech Used in: Low-Cost Graphics HMI Panels PIC32MX170F256D-I/ML Microchip Technology Used in: Low-Cost Graphics HMI Panels PIC32MX120F032D-I/ML Microchip Technology Used in: Capacitive Touch User Interfaces MCP3421 16-bit delta-sigma ADC companion for precision sensors Used in: Industrial Sensor Hubs PIC32MX230F064B-I/ML Microchip Technology Used in: Industrial Sensor Hubs, Consumer Appliance Control Boards ESP32-WROOM-32 Wi-Fi/BT companion module for cloud connectivity Used in: Small-Format IoT Edge Nodes MCP23S17 SPI I/O expander for additional relays/buttons Used in: Consumer Appliance Control Boards
What is the maximum CPU clock speed of the PIC32MX230F064DT-I/ML?
The PIC32MX230F064DT-I/ML runs up to 40 MHz with a 5-stage pipeline MIPS32 M4K core delivering 66 DMIPS. According to the Microchip PIC32MX1XX/2XX data sheet, the peripheral bus operates at half the system clock, so peripheral I/O is paced at up to 20 MHz. This places the part above Cortex-M0 devices and on par with entry-level Cortex-M3 MCUs for compute-bound tasks.
How much Flash and RAM does the PIC32MX230F064DT-I/ML integrate?
The PIC32MX230F064DT-I/ML integrates 64 KB of Flash program memory (64K x 8) and 16 KB of SRAM, per the Microchip datasheet. The dual-bus Harvard architecture lets the CPU fetch instructions while DMA moves data to/from RAM, and the Flash supports self-programming for in-field firmware updates through the peripheral library's NVM driver.
What is the supply voltage range for the PIC32MX230F064DT-I/ML?
The PIC32MX230F064DT-I/ML operates from 2.3 V to 3.6 V on the VDD pin, with a separate VBUS pin tolerant to 5 V for USB. According to Microchip, a 10 uF bulk plus 0.1 uF decoupling capacitor is recommended within a few millimetres of each VDD pin; failure to do so can cause ADC reference noise and brown-out resets during peak USB bus activity.
Where can I download the PIC32MX230F064DT-I/ML datasheet PDF?
The official Microchip PIC32MX1XX/2XX/3XX/4XX/5XX/6XX/7XX family data sheet (document DS60001168) is available from the Microchip product page at microchip.com/en-us/product/PIC32MX230F064D. The same PDF covers PIC32MX230, 250, 270, 330, 350, and 370 variants because they share a common die, so register descriptions and pinout tables apply directly to PIC32MX230F064DT-I/ML.
What is the pinout of the PIC32MX230F064DT-I/ML in the 44-pin QFN?
The 44-pin QFN (ML) pinout includes pins 1-44 plus the central exposed pad (EP). According to Microchip pin tables: pin 1 = RB0, 6 = VBUS, 8 = VDD, 11 = VSS, 12 = OSC1/RC12, 13 = OSC2/RC15, 16 = RC4/RTCC, 25 = AVDD, 26 = AVSS, 33 = RB15/PGM, 43 = MCLR, 44 = RA0. Always cross-reference the exact datasheet pinout for your device variant because pin 1 location and I/O mapping depend on PPS configuration.
What is the difference between PIC32MX230F064DT-I/ML and PIC32MX230F064D-I/TL?
Both parts use the same PIC32MX230F064D silicon die with 64 KB Flash, 16 KB RAM and 40 MHz MIPS M4K core. The difference is purely package and pinout: PIC32MX230F064DT-I/ML is a 44-pin QFN (8x8 mm, ML suffix), while PIC32MX230F064D-I/TL is a 44-pin VTLA (TL suffix). They are NOT drop-in compatible because the land patterns differ - choose the variant that matches your PCB footprint.
Is the PIC32MX230F064DT-I/ML drop-in compatible with PIC32MX230F064B-I/SP?
No. PIC32MX230F064DT-I/ML uses a 44-pin QFN (8x8 mm) package with an exposed thermal pad, while PIC32MX230F064B-I/SP uses a 28-pin SPDIP through-hole package. Different pin counts, different footprints, and different I/O counts (33 vs ~21) mean a board redesign is required. Both share the same die and register set, so firmware is portable, but the PCB footprint is not.
What is the price of PIC32MX230F064DT-I/ML as of 2026-10-02?
As of 2026-10-02, the PIC32MX230F064DT-I/ML lists at approximately $3.62 per unit at qty 1, dropping to about $2.31 per unit at qty 1000 at authorised distributors such as DigiKey and Mouser. Volume pricing varies with reel size and lead time; XAIPART recommends requesting an RFQ for orders above 1000 pieces to lock price and confirm date code availability.
Is the PIC32MX230F064DT-I/ML currently in stock?
As of 2026-10-02, PIC32MX230F064DT-I/ML is listed as active and in stock at DigiKey, Mouser and Microchip Direct in tape-and-reel packaging with no last-time-buy notice. Microchip's general lead time for industrial-grade -I parts is currently 8-12 weeks from the factory; check the distributor's live inventory page for same-day shipment confirmation.
What is the lead time for PIC32MX230F064DT-I/ML orders?
As of 2026-10-02, distributor stock for PIC32MX230F064DT-I/ML is available for immediate shipment at qty 1-1000 from DigiKey and Mouser; factory-direct orders from Microchip Direct typically carry 8-12 weeks lead time for industrial-grade tape-and-reel reels. For higher volume production orders, XAIPART recommends confirming date codes and allocation before releasing the PO.
What are the key features of PIC32MX230F064DT-I/ML?
The PIC32MX230F064DT-I/ML integrates a 40 MHz MIPS32 M4K core, 64 KB Flash, 16 KB RAM, 33 I/O pins, USB 2.0 full-speed OTG, two I2S/SPI, two I2C, two UART, a 10-bit 1 Msps ADC, five 16-bit timers, Peripheral Pin Select, Parallel Master Port, mTouch capacitive touch, and a 1 ns resolution input capture. According to Microchip, the EP thermal pad must be soldered to a continuous ground plane to meet the 8x8 mm QFN thermal resistance of approximately 28 C/W.
Can PIC32MX230F064DT-I/ML be used for USB audio applications?
Yes. PIC32MX230F064DT-I/ML integrates a USB 2.0 full-speed OTG controller, two I2S modules, and 16 KB SRAM which together support USB audio class 1.0 streaming at 24-bit/48 kHz stereo. According to Microchip application note AN1422, the I2S peripheral drives external DACs like the TI PCM5102A or Cirrus CS4344; expect roughly 30-35% CPU load when running USB + I2S + control loop simultaneously.
What is the best cross-brand drop-in alternative for PIC32MX230F064DT-I/ML?
There is no true cross-brand drop-in replacement for PIC32MX230F064DT-I/ML because the 44-pin QFN (8x8 mm) footprint with exposed thermal pad and the MIPS32 M4K core are Microchip-unique. Renesas RA2A1 and ST STM32F042 in similar QFN packages can serve as functional alternatives for USB audio with porting effort, but require new firmware and layout review. For true drop-in compatibility within the PIC32 ecosystem, PIC32MX230F064DT-I/PT (44-pin TQFP) is the closest same-brand option, also from Microchip.
What key specifications of PIC32MX230F064DT-I/ML should engineers know?
Engineers specifying PIC32MX230F064DT-I/ML should remember: 40 MHz MIPS32 M4K core with 66 DMIPS, 64 KB Flash, 16 KB SRAM, 33 I/O, 2.3-3.6 V supply, USB 2.0 full-speed OTG, 10-bit ADC at 1 Msps, two I2S/SPI, two UART, two I2C, PMP for graphics, mTouch capacitive sensing, PPS for flexible pin mapping, 1 ns input-capture resolution, and industrial -40C to +105C temperature range. Package is 44-pin QFN 8x8 mm with exposed pad requiring thermal vias.

Engineering reference data for PIC32MX230F064DT-I/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC32MX230F064DT-I/ML when your design needs a 32-bit MCU with USB 2.0 full-speed OTG, two I2S interfaces for digital audio, PMP for graphics, and mTouch capacitive touch in a single 44-pin QFN 8x8 mm footprint - all at industrial -40C to +105C. Pick PIC32MX230F064D-I/ML (tray packing) for prototype builds and engineering samples where tape-and-reel handling is inconvenient. Choose PIC32MX250F064DT-I/ML when you need the 50 MHz/83 DMIPS boost and additional peripherals while keeping the same QFN footprint. Switch to PIC32MX120F032DT-I/ML when you need to cut cost on simple HMI or sensor nodes where 32 KB Flash and 8 KB RAM are sufficient. None of these alternatives require PCB rework - they share the same 44-pin QFN land pattern and pinout.

Comparison with Alternatives

Parameter This Product PIC32MX230F064D-I/ML PIC32MX250F064DT-I/ML PIC32MX130F064DT-I/ML PIC32MX170F256DT-I/ML PIC32MX120F032DT-I/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 44-pin QFN 8x8 mm (ML) 44-pin QFN 8x8 mm (ML) - same 44-pin QFN 8x8 mm (ML) - same 44-pin QFN 8x8 mm (ML) - same 44-pin QFN 8x8 mm (ML) - same 44-pin QFN 8x8 mm (ML) - same
Core MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit
Max Clock Speed 40 MHz / 66 DMIPS 40 MHz / 66 DMIPS 50 MHz / 83 DMIPS 40 MHz / 66 DMIPS 50 MHz / 83 DMIPS 40 MHz / 66 DMIPS
Flash 64 KB 64 KB 64 KB 64 KB 256 KB 32 KB
RAM 16 KB 16 KB 32 KB 16 KB 64 KB 8 KB
USB USB 2.0 FS OTG USB 2.0 FS OTG USB 2.0 FS OTG USB 2.0 FS OTG USB 2.0 FS OTG USB 2.0 FS OTG
I/O Pins 33 33 33 33 33 33
Temperature Range -40C to +105C (I) -40C to +105C (I) -40C to +105C (I) -40C to +105C (I) -40C to +105C (I) -40C to +105C (I)
mTouch / PMP Both supported Both supported Both supported mTouch only (no PMP) Both supported mTouch only (no PMP)

Key Differentiators

  • Higher pin count and full peripheral set vs PIC32MX130/120 in same QFN package (vs PIC32MX120F032DT-I/ML)
  • Industrial temperature range with USB OTG (vs PIC32MX230F064D-I/TL (VTLA package))
  • Lower-cost tape-and-reel variant for volume manufacturing (vs PIC32MX230F064D-I/ML (tray))

Design Notes

The 44-pin QFN (8x8 mm) package dissipates heat primarily through the central exposed pad (EP). Solder the EP to a continuous ground copper plane with thermal vias (typically 9-16 vias of 0.3 mm drill) to achieve the datasheet theta_JA of approximately 28 C/W. Without EP soldering, junction temperature can exceed 125 C at moderate loads. Always flood the top and bottom copper under the EP and stitch vias into the inner ground plane.

Place a 10 uF bulk ceramic capacitor (X5R/X7R) within 5 mm of each VDD/AVDD pin pair and a 0.1 uF decoupling cap within 2 mm of each VDD pin. The analog AVDD pin should be filtered with a ferrite bead and 10 uF + 0.1 uF to reduce ADC reference noise. USB bus-powered designs require a 4.7 uF bulk on VBUS to handle inrush when the host enumerates the device.

Route the USB D+ and D- traces as a 90-ohm differential pair with continuous ground reference underneath, keeping trace length under 25 mm and matching length to within 150 mil. Avoid splitting the ground plane under the USB traces. PPS reassigns most digital peripherals to alternate I/O pins, so place the MCU near the centre of the board to give all peripherals short equal-length traces.

Do not leave the MCLR pin floating - tie it to VDD through a 10 kohm pull-up and add a 100 nF cap to ground for noise immunity, otherwise spurious resets will occur during power-up. The ICSP programming pins PGECx/PGEDx must be brought out to a programming header; routing them under the QFN EP is not possible. Finally, the on-chip voltage regulator requires an external 10 uF + 0.1 uF cap on the VCAP pin for stability.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. Lead-free and halogen-free per Microchip material declarations. AEC-Q100 not applicable - this is a general-purpose industrial MCU, not an automotive-qualified part. For automotive applications, contact Microchip about AEC-Q100 qualified variants in the PIC32 family.

Data verified on: 2026-10-02 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC32MX230F064DT-I/ML PIC32MX230F064D MIPS32 M4K PIC32 microcontroller MCU 32-bit MCU QFN-44 QFN package family USB 2.0 OTG I2S SPI I2C UART Parallel Master Port (PMP) Peripheral Pin Select (PPS) mTouch capacitive touch RoHS REACH AEC-Q100 USB audio class DSP instruction set
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