PIC32MX450F256HT-120/MR - 120MHz 32-bit MCU 256KB Flash | Microchip
部品番号: PIC32MX450F256HT-120/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.12 | $5.12 |
| 10 | $4.61 | $46.10 |
| 100 | $4.08 | $408.00 |
| 500 | $3.67 | $1,835.00 |
| 1,000 | $3.27 | $3,270.00 |
PIC32MX450F256HT-120/MR 概要
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit CPU core, program memory, data memory, and a configurable set of peripherals in a single package. The PIC32MX family uses the MIPS32 M4K core, which sits in the broader hierarchy of microcontrollers -> embedded processors -> microcontrollers -> semiconductors. Compared with 8-bit or 16-bit MCUs, 32-bit devices like the PIC32MX450 provide higher performance, larger addressable memory, and richer peripheral integration for connected and graphics-rich applications.
Key features of the PIC32MX450F256HT-120/MR include 256 KB self-programmable Flash, 64 KB SRAM, 49 programmable I/O pins with peripheral pin select (PPS), a 16-bit timer/counter module, a 32-bit Real-Time Clock/Calendar, and a 10-bit ADC. The device operates from 2.3 V to 3.6 V and supports an industrial temperature range. The 64-QFN package with exposed pad provides 31 C/W thermal resistance and excellent electrical grounding for noise-sensitive analog designs.
Typical applications include USB peripherals and HID devices, consumer audio with I2S, industrial control and HMI panels, low-cost graphics LCD controllers, motor control, and connected sensor nodes. The integrated USB 2.0 full-speed OTG controller and 1 Msps ADC simplify BOM while the PIC32 ecosystem (MPLAB X IDE, Harmony framework) accelerates time-to-market.
When designing with this device, ensure that the exposed pad is soldered to a sufficiently large copper pour (typically 1 sq inch minimum) for thermal dissipation. Configure PPS before toggling peripheral I/O, and adhere to the 2.3 V minimum VDD for full-spec operation; below this the brown-out reset may engage.
ドロップイン代替品: PIC32MX450F256HT-120/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX450F256HT-120/MR （同一形状・フットプリント） — 相違点: Package, ADC, Timers, MSL Level, Operating Temperature Range.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX450F256H-120/MR
✅ ドロップイン✓ 在庫あり
$4.55 / 個
データシートを見る →PIC32MX450F256HT-120V/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX450F256HT-I/MR
✅ ドロップイン✓ 在庫あり
$4.2 / 個
データシートを見る →PIC32MX450F256HT-120I/MR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
PIC32MX440F256HT-80I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.61 / 個
データシートを見る →PIC32MX450F256HT-120/MR 最大定格＆電気的特性
| Core Processor | MIPS32 M4K |
| Core Size | 32-Bit |
| 最大クロック周波数 | 120 MHz |
| Performance | 150 DMIPS |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 64 KB |
| Number of I/O Pins | 49 |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| 動作温度範囲 | -40C to +105C (industrial) |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| Analog Comparators | 2 |
| UART Modules | 5 |
| SPI / I2S Modules | 2 |
| I2C Modules | 2 |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| パッケージ | 64-QFN (9x9 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
PIC32MX450F256HT-120/MR ピン構成
| ピン 1 | RP15/PWM1L/PMD5/RB15 — Remappable I/O, PWM output, Parallel Master Port |
| ピン 2 | RP14/PMA1/PWM2L/PMCS1/PMRD/RB14 — Remappable I/O, PMP, PWM output |
| ピン 3 | VSS — Ground reference |
| ピン 4 | RP13/PMA0/PMCS2/RB13 — Remappable I/O, PMP chip select |
| ピン 5 | RP12/PWM2H/RB12 — Remappable I/O, PWM output |
| ピン 6 | RP11/PMD4/RB11 — Remappable I/O, PMP data |
| ピン 7 | RP10/PMD3/RB10 — Remappable I/O, PMP data |
| ピン 8 | RP9/PMD2/RB9 — Remappable I/O, PMP data |
| ピン 9 | RP8/PMD1/RB8 — Remappable I/O, PMP data |
| ピン 10 | RP7/PMD0/RB7 — Remappable I/O, PMP data |
| ピン 11 | RP6/OC3/RB6 — Remappable I/O, Output Compare |
| ピン 12 | RP5/OC2/RB5 — Remappable I/O, Output Compare |
| ピン 13 | RP4/OC1/RB4 — Remappable I/O, Output Compare |
| ピン 14 | RP3/SDA2/RB3 — Remappable I/O, I2C2 data |
| ピン 15 | RP2/SCL2/RB2 — Remappable I/O, I2C2 clock |
| ピン 16 | TDO/AN11/RPB11 — JTAG TDO, ADC input 11 |
| ピン 17 | TCK/AN10/RPB10 — JTAG TCK, ADC input 10 |
| ピン 18 | TMS/AN9/RPB9 — JTAG TMS, ADC input 9 |
| ピン 19 | TDI/AN8/RPB8 — JTAG TDI, ADC input 8 |
| ピン 20 | AN7/RPB7 — ADC input 7 |
| ピン 21 | AN6/RPB6 — ADC input 6 |
| ピン 22 | AN5/RPB5 — ADC input 5 |
| ピン 23 | AN4/RPB4 — ADC input 4 |
| ピン 24 | AN3/RPB3 — ADC input 3 |
| ピン 25 | AN2/RPB2 — ADC input 2 |
| ピン 26 | AN1/RPB1 — ADC input 1 |
| ピン 27 | AN0/RPB0 — ADC input 0 |
| ピン 28 | VREF-/CVREF- — ADC negative reference |
| ピン 29 | VREF+/CVREF+ — ADC positive reference |
| ピン 30 | AVSS — Analog ground |
| ピン 31 | AVDD — Analog supply |
| ピン 32 | OA1IN-/CVREF/AN12 — Op-amp input, ADC channel 12 |
| ピン 33 | OA1OUT/AN1 — Op-amp output |
| ピン 34 | OA1IN+/AN0 — Op-amp positive input |
| ピン 35 | OSC1/CLKI/RC12 — Crystal oscillator input |
| ピン 36 | OSC2/CLKO/RC15 — Crystal oscillator output |
| ピン 37 | RC13/SOSCO — Secondary oscillator output |
| ピン 38 | RC14/SOSCI — Secondary oscillator input |
| ピン 39 | VDD — Digital supply |
| ピン 40 | ENVREG/VDD — Voltage regulator enable |
| ピン 41 | VSS — Ground reference |
| ピン 42 | RTCC/RA8 — Real-time clock alarm output |
| ピン 43 | RA9 — General I/O |
| ピン 44 | RA10 — General I/O |
| ピン 45 | RA0/ULPM/INT0 — Wake from sleep, external interrupt |
| ピン 46 | RA1/INT1 — External interrupt 1 |
| ピン 47 | D+/RA2 — USB data plus |
| ピン 48 | D-/RA3 — USB data minus |
| ピン 49 | VBUS — USB VBUS detect |
| ピン 50 | VUSB — USB internal transceiver supply |
| ピン 51 | RA4 — General I/O |
| ピン 52 | RA5 — General I/O |
| ピン 53 | RA6 — General I/O |
| ピン 54 | RA7 — General I/O |
| ピン 55 | RF0 — General I/O port F |
| ピン 56 | RF1 — General I/O port F |
| ピン 57 | RF2 — General I/O port F |
| ピン 58 | RF3 — General I/O port F |
| ピン 59 | RF4/PMD11 — Remappable I/O, PMP data |
| ピン 60 | RF5/PMD10 — Remappable I/O, PMP data |
| ピン 61 | RF6/PMD9 — Remappable I/O, PMP data |
| ピン 62 | RF7/PMD8 — Remappable I/O, PMP data |
| ピン 63 | RF8/PMD7 — Remappable I/O, PMP data |
| ピン 64 | RF9/PMD6 — Remappable I/O, PMP data |
| ピン EP | EP (Exposed Pad) — Thermal pad - must be soldered to ground pour for thermal dissipation |
主な用途
PIC32MX450F256HT-120/MR の用途: 6 件s: USB HID and Peripherals, Consumer Audio with I2S, Industrial Control and HMI, Low-Cost Graphics LCD Controller, Connected Sensor Nodes, Motor Control and BLDC Drivers.
USB HID and Peripherals
The PIC32MX450F256HT-120/MR is well-matched for USB Human Interface Devices (HID), CDC serial bridges, and custom USB peripherals. The integrated USB 2.0 Full-Speed OTG controller eliminates the need for an external PHY chip, simplifying BOM and freeing board space. At 120 MHz, the M4K core delivers ample headroom to run USB stacks plus HID report processing at 1 kHz polling rates. The 256 KB Flash comfortably fits Microchip's USB stack (~30 KB), HID class drivers, and application code. Designers should add a 27 ohm series resistor on D+/D- and route the USB differential pair with 90 ohm differential impedance. The device's 49 I/O pins leave enough headroom for buttons, LEDs, and auxiliary SPI/I2C peripherals alongside the USB endpoints.
おすすめ
Consumer Audio with I2S
For low-cost audio DACs, USB speakers, and Bluetooth audio bridges, the PIC32MX450F256HT-120/MR provides two I2S ports that interface directly to modern audio codecs. The 120 MHz CPU and 64 KB SRAM allow 48 kHz / 24-bit stereo I2S streams with ~5% CPU utilization when paired with DMA. Integrated 10-bit ADC and I2C simplify digital volume control via codec programming. The 256 KB Flash accommodates USB audio class firmware plus the I2S driver stack. Compared with Cortex-M0 alternatives, the PIC32MX450 offers stronger DMA support and a richer interrupt controller that reduces latency jitter for low-noise audio. Designers should route MCLK to the codec and place the QFN exposed pad over a continuous ground pour to minimize ADC noise coupling.
おすすめ
Industrial Control and HMI
In industrial control panels and Human-Machine Interface (HMI) applications, the PIC32MX450F256HT-120/MR integrates peripherals typically scattered across multiple MCUs. The 10-bit 1 Msps ADC with up to 28 channels handles multiple sensor inputs simultaneously, while five UART modules support RS-232/RS-485 multi-drop industrial networks. The 49 I/O pins are sufficient for matrix keypads, character LCDs, and small TFT panels up to 320x240. The wide 2.3-3.6 V supply range tolerates industrial 24V rails stepped down through common DC-DC converters. The industrial -40 to +105C temperature rating suits factory floor installations. Pair with an external RS-485 transceiver and opto-isolated digital inputs for robust industrial node designs.
おすすめ
Low-Cost Graphics LCD Controller
The PIC32MX450F256HT-120/MR drives small QVGA (320x240) and WQVGA (480x272) TFT panels through its Parallel Master Port (PMP) operating up to 25 MHz. At 120 MHz the M4K core can refresh 320x240 panels at 60 Hz with simple bitmap graphics, 8x8 fonts, and basic UI widgets using ~30% CPU budget. The 256 KB Flash stores framebuffer fonts, bitmap assets, and the graphics library; the 64 KB SRAM holds partial framebuffers for double-buffering. SPI/I2S ports connect to resistive touch controllers while the 10-bit ADC reads backlight brightness via a photodiode amplifier. This combination enables under-$5 BOM for color TFT HMI nodes competing with discrete display controllers.
おすすめ
Connected Sensor Nodes
For IoT sensor aggregation nodes and edge gateways, the PIC32MX450F256HT-120/MR offers sufficient compute to run Microchip's MPLAB Harmony TCP/IP Lite stack alongside sensor drivers. The five UART modules aggregate multiple Modbus or LIN sensor buses, while I2C/SPI connect to digital sensors. USB OTG allows local diagnostics via a tethered host. The 256 KB Flash accommodates encrypted firmware storage with the crypto library; 64 KB SRAM holds packet buffers and TLS contexts. The 2.3-3.6 V supply aligns with battery monitoring ICs and 3.3 V LDO regulators. Active current draw at 120 MHz is approximately 50 mA, making it suitable for line-powered or large-battery sensor hubs.
おすすめ
Motor Control and BLDC Drivers
The PIC32MX450F256HT-120/MR is well suited for sensorless BLDC motor control up to several hundred watts. The 10-bit 1 Msps ADC samples back-EMF zero-crossing points while the Output Compare modules generate complementary PWM with dead-time insertion. At 120 MHz, the core runs 25 kHz PWM loops with field-oriented control (FOC) algorithms in software, leaving enough headroom for CAN communication or USB diagnostics. Five UART modules support CAN bridges via external transceivers. The 49 I/O pins accept multiple Hall-sensor inputs, fault flags, and encoder feedback. Designers should follow Microchip AN1078 sensorless BLDC guidelines for hardware current sensing and protection circuitry.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX450F256HT-120/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX450F256H-120/MR | PIC32MX450F256HT-120V/MR | PIC32MX450F256HT-I/MR | PIC32MX450F256HT-120I/MR | PIC32MX440F256HT-80I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Maximum Clock Frequency | 120 MHz | 120 MHz | 120 MHz | 80 MHz | 120 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +125C (AEC-Q100 Grade 2) | -40C to +85C | -40C to +85C | -40C to +85C |
| Automotive Grade | No (industrial) | No | Yes - AEC-Q100 Grade 2 | No | No | No |
| Packaging | Tape & Reel | Tube | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
| USB Support | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
主な差別化要因
- Industrial -40 to +105C temperature range with 120 MHz speed （vs PIC32MX450F256HT-I/MR)
- Automotive-grade option available in same footprint （vs PIC32MX450F256HT-120V/MR)
- Same die across all speed grades （vs PIC32MX440F256HT-80I/MR)
設計ノート
The 64-QFN package exposes a thermal pad (EP) at its center that must be soldered to a continuous ground pour of at least 1 square inch. The datasheet theta_JA of approximately 31 C/W applies only when the EP is soldered properly. Estimated: with VDD = 3.3V, 120 MHz active CPU, and 50 mA core current, power dissipation is ~0.165 W and junction rise is ~5C above ambient. Without proper EP soldering, thermal resistance can rise above 80 C/W, causing severe derating in enclosed industrial enclosures.
Place decoupling capacitors as close as possible to VDD pins (1, 39, 40) and AVDD (pin 31). Use 0.1 uF ceramic plus 10 uF bulk on each supply rail. For USB applications, route D+/D- (pins 47, 48) as a 90 ohm differential pair with matched length and keep traces short (< 50 mm). Place VBUS (pin 49) voltage divider resistors within 5 mm of the pin to minimize ESD coupling into adjacent lines.
Do not exceed the absolute maximum VDD of 4.0 V; the part operates from 2.3-3.6 V but transients above 4.0 V can permanently damage the internal voltage regulator. The USB VBUS pin (49) is 5 V tolerant but requires external ESD protection. Configuration bits must be set before code execution - blank parts boot with the debug LED disabled and JTAG enabled by default. PPS (Peripheral Pin Select) registers must be unlocked before reassignment and locked afterward to prevent runaway writes.
コンプライアンス情報
RoHS and REACH compliant per Microchip product declarations. The standard -120/MR variant is not AEC-Q100 qualified; use the -120V/MR suffix for automotive. Halogen-free status not explicitly stated in available datasheets.
