PIC32MZ0512EFE124-E/TL - 32-bit MCU 200MHz 512KB Flash 124-VTLA | Microchip
Référence : PIC32MZ0512EFE124-E/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.5 | $13,50 |
| 10 | $12.15 | $121,50 |
| 100 | $10.8 | $1 080,00 |
| 500 | $9.45 | $4 725,00 |
| 1 000 | $8.1 | $8 100,00 |
PIC32MZ0512EFE124-E/TL Présentation
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), working memory (RAM), and a rich set of on-chip peripherals (timers, ADC/DAC, communication controllers) into a single device. The PIC32MZ EF family sits at the top of the PIC32 hierarchy and is engineered for high-performance embedded applications requiring both connectivity and rich analog/mixed-signal integration.
Key features include a 200 MHz / 330 DMIPS core with 252 MHz headroom in the family, 512 KB Flash with Dual Panel Live Update, 128 KB SRAM, Hi-Speed USB 2.0 (480 Mbps) with on-chip PHY, 10/100 Ethernet MAC with IEEE 1588 PTP support, Serial Quad Interface (SQI) for external flash, up to 97 I/O lines, multiple 12-bit ADC and DAC channels, DMA controllers, and PWM peripherals suited for motor control. The VTLA-124 (9x9 mm) laminate package exposes a large die-attach pad for low thermal resistance in space-constrained designs.
Architecturally, the device combines a 5-stage MIPS pipeline with tightly-coupled SRAM, hardware multiply-accumulate DSP extensions, and dedicated peripherals (USB, ENET, SQI, CAN, I2S) that offload the CPU. This balanced compute-and-connectivity integration eliminates the need for an external PHY or bus-marshalling CPLD in many designs.
Typical applications include industrial automation, automotive connectivity gateways, IoT edge nodes, HMI/graphics terminals, audio processing with I2S/USB streaming, and motor control. The wide peripheral mix supports HMI + connectivity + analog sensing on a single chip.
Designers should verify the Live Update dual-panel firmware sequence in MPLAB Harmony before field deployment and budget sufficient PCB copper under the exposed pad to honor thermal limits at high MIPS loads.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ0512EFE124-E/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFE124-E/TL (même facteur de forme et même empreinte) — différant par FPU, Package, Operating Temperature, Core Architecture, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFE124-E/TL
✅ Remplacement direct✓ En stock
$8.91 / unité
Voir la fiche technique →PIC32MZ0512EFE124-I/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.72 / unité
Voir la fiche technique →PIC32MZ0512EFE124T-E/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFE124T-E/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFF124-E/TL
✅ Remplacement direct✓ En stock
$8.95 / unité
Voir la fiche technique →PIC32MZ0512EFE124-E/TL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32® M-Class (Warrior M-class) |
| Largeur du bus de données | 32-bit |
| Maximum CPU Speed | 200 MHz (252 MHz family max) |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754 single-precision |
| DSP Extensions | 4x 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Température de fonctionnement | -40C to +125C (automotive grade) |
| Boîtier | 124-VTLA (9x9 mm) |
| Type de montage | Surface Mount |
| I/O Lines | Up to 97 |
| USB | Hi-Speed USB 2.0 with on-chip PHY |
| Ethernet | 10/100 MAC with IEEE 1588 PTP |
| SQI (Serial Quad Interface) | Yes |
| Crypto Engine | No |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ0512EFE124-E/TL 124-vtla (9x9 mm)
Configuration des broches du PIC32MZ0512EFE124-E/TL (boîtier 124-vtla (9x9 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ0512EFE124-E/TL.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ0512EFE124-E/TL convient pour 6 applications: Industrial IoT Gateway, Automotive Connectivity Module, HMI / Graphics Terminal, Audio Processing / USB Streaming, BLDC / PMSM Motor Control, Edge Sensor Hub / Wearable.
Industrial IoT Gateway
The PIC32MZ0512EFE124-E/TL fits industrial IoT gateways thanks to its 10/100 Ethernet MAC with IEEE 1588 PTP, Hi-Speed USB 2.0 device/host, and SQI interface for external serial flash. The 200 MHz MIPS M-class core with FPU handles TLS/Modbus/OPC-UA framing plus edge analytics on a single device. The 124-VTLA laminate keeps the footprint small enough for DIN-rail enclosures while exposing up to 97 GPIO for sensor aggregation, RS-485 transceivers, and isolated digital inputs.
Recommandé
Automotive Connectivity Module
The -E suffix denoting -40C to +125C operation and the integrated Hi-Speed USB plus 10/100 Ethernet make this MCU a natural fit for automotive telematics control units (TCUs) and V2X edge nodes. The 330 DMIPS MIPS M-class core runs AUTOSAR MCAL drivers and security stacks at the wire rate, while the Dual Panel Live Update firmware architecture supports fail-safe OTA campaigns required by ISO 26262 functional-safety workflows.
Recommandé
HMI / Graphics Terminal
HMI terminals benefit from the 200 MHz core, parallel display interface (EPI/ PMP), and 128 KB SRAM that drives small TFT-LCDs at 30+ fps. The PIC32MZ EF family integrates dedicated graphics peripherals and the I2S audio block, enabling combined video + audio playback from a single chip. The 124-VTLA package exposes sufficient GPIO for capacitive touch controllers and backlight PWM while remaining under 9x9 mm.
Recommandé
Audio Processing / USB Streaming
Audio DAC/amplifier products use the PIC32MZ0512EFE124-E/TL to bridge Hi-Speed USB audio streaming (UAC2) to I2S codecs. The integrated Hi-Speed USB PHY eliminates an external ULPI chip, and the 200 MHz MIPS core handles SRC and effect DSP via the four 64-bit accumulators. The DMA engine moves audio samples without CPU intervention, freeing MIPS for user DSP algorithms while the FPU accelerates biquad filter calculations.
Recommandé
BLDC / PMSM Motor Control
Field-oriented control of BLDC and PMSM motors demands deterministic PWM generation, fast ADC sampling, and DSP throughput - all delivered by the PIC32MZ0512EFE124-E/TL. The PWM peripheral with complementary outputs and dead-band generation drives three-phase inverters up to 50 kHz switching frequency, while the 12-bit 28 MSPS ADC samples phase currents synchronized to the PWM cycle. The FPU and DSP extensions run Park/Clarke transforms at 200 MHz with sub-microsecond loop latency.
Recommandé
Edge Sensor Hub / Wearable
Wearable sensor hubs use the PIC32MZ0512EFE124-E/TL as the central processor to aggregate IMU, bio-sensor, and BLE radio data through the on-chip I2C/SPI controllers. The 200 MHz core runs always-on sensor fusion while the integrated 10/100 Ethernet (when connected to a docking cradle) offloads data at gigabit rates. The 124-VTLA 9x9 mm package is small enough for wrist-mounted form factors while exposing adequate GPIO for multi-sensor I/O.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFE124-E/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFE124-E/TL | PIC32MZ0512EFE124-I/TL | PIC32MZ0512EFE124T-E/TL | PIC32MZ1024EFE124T-E/TL | PIC32MZ0512EFF124-E/TL |
|---|---|---|---|---|---|---|
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB | 1024 KB | 512 KB | 512 KB | 1024 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Temperature Grade | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) |
| Crypto Engine | No | No | No | No | No | Yes (AES/SHA) |
| Core Speed (max) | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Hi-Speed USB + Ethernet | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Dual Panel Live Update firmware architecture (vs PIC32MX795F512LT-80I/PF)
- Hi-Speed USB 2.0 with on-chip PHY (vs PIC32MX795F512LT-80I/PF)
- Higher MIPS density with FPU (vs PIC32MX795F512LT-80I/PF)
Notes de conception
The 124-VTLA laminate package dissipates up to approximately 1 W typical when running core benchmarks; the exposed die-attach pad must be soldered to a continuous copper land pattern with an array of thermal vias (recommended 0.3 mm drill, 0.5 mm pitch) to a 2 oz inner-plane copper pour. Without proper thermal attachment the junction temperature will exceed 125 C at +85 C ambient during sustained MIPS workloads. Cross-check with the family datasheet section 35 (Packaging Information) for the exact land pattern dimensions.
Route the Hi-Speed USB D+/D- lines as a 90 ohm differential pair with length matching within 150 mil; keep the on-chip PHY decoupling capacitors (100 nF + 4.7 uF) within 2 mm of the VUSB pin. For Ethernet RMII, match the 50 MHz reference clock trace to within 50 mil of the data lines to minimize jitter. SQI signals require 50 ohm characteristic impedance with a 33 ohm series damping resistor near the MCU.
When using Dual Panel Live Update firmware, ensure the bootloader uses CRC32 verification on each panel before swapping the CPU vector base; failure to do so can brick the device if the inactive panel is corrupted by brown-out during programming. Also note that the -E suffix denotes -40C to +125C automotive grade and the -I suffix denotes -40C to +85C industrial; mixing them in production boards will cause thermal shutdown at high ambient.
Informations de conformité
RoHS and lead-free compliant per Microchip product page. AEC-Q100 qualification not separately listed for this part number though it carries the automotive -E temperature grade; check with Microchip for full automotive PPAP documentation.