PIC32MZ1024EFG100-250I/PT - 250MHz 32-bit MCU, 1MB Flash | Microchip
部品番号: PIC32MZ1024EFG100-250I/PT ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.2 | $132.00 |
| 100 | $11.85 | $1,185.00 |
| 500 | $10.6 | $5,300.00 |
| 1,000 | $9.5 | $9,500.00 |
PIC32MZ1024EFG100-250I/PT 概要
What is a 32-bit microcontroller? A 32-bit MCU is an embedded processor with a 32-bit data path, integer ALU, and program word width, sitting in the hierarchy: 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. 32-bit MCUs deliver higher throughput than 8/16-bit devices and typically integrate memory, analog, and communication peripherals in a single chip for embedded designs.
Key features of the PIC32MZ1024EFG100-250I/PT include: a MIPS32 M-Class core with FPU delivering up to 252 MHz (250 MHz in this part), 1 MB (1M x 8) Flash program memory, 512 KB SRAM, and a dedicated 12-bit 18 MSPS ADC. The device includes Hi-Speed USB 2.0 OTG, dual CAN 2.0b controllers, multiple UART/SPI/I2C peripherals, an integrated crypto engine absent on this "G" (no-crypto) variant, and an enhanced PMP/graphics interface for HMI panels.
Architecturally, the PIC32MZ EF family uses the MIPS M4K microAptiv core with 16 KB I-cache and 16 KB D-cache, a 7-stage pipeline, DSP extensions, and a single-precision FPU. The 250 MHz clock provides 3.28 CoreMark/MHz performance, ample for high-speed protocol stacks (TCP/IP, USB, CAN-FD) and real-time DSP processing. A 8-channel DMA controller offloads data movement between peripherals and memory, reducing CPU interrupt load.
Typical applications include industrial control and IoT edge nodes, high-resolution graphics/HMI panels, motor control (BLDC, PMSM, servo), automotive infotainment subsystems, and USB-based embedded devices. The 100-pin TQFP package provides generous I/O for parallel buses, PMP graphics, and multi-channel motor drive feedback.
When designing with this part, ensure decoupling per the family datasheet (typically 100 nF + 4.7 uF near each VDD pair), use the integrated FPU for DSP workloads, and leverage MPLAB Harmony 3 code generation for peripheral setup. Compared to lower-end PIC32MX parts at 80 MHz, the PIC32MZ EF delivers roughly 3x DMIPS for protocol-heavy designs.
This page synthesizes distributor pricing, same-family drop-in alternatives (PIC32MZ1024EFE100T-I/PT, PIC32MZ1024ECG100-I/PT, PIC32MZ1024ECH100-I/PT), and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: PIC32MZ1024EFG100-250I/PT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1024EFG100-250I/PT （同一形状・フットプリント） — 相違点: ADC, Package, Core Architecture, Ethernet, Core.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1024EFE100-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$8.1 / 個
データシートを見る →PIC32MZ1024EFE100T-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$6.78 / 個
データシートを見る →PIC32MZ1024ECG100-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$11.62 / 個
データシートを見る →PIC32MZ1024ECH100-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$8.95 / 個
データシートを見る →PIC32MZ1024ECH100T-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$8.99 / 個
データシートを見る →PIC32MZ1024ECM100-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$7.45 / 個
データシートを見る →PIC32MZ1024EFG100-250I/PT 最大定格＆電気的特性
| Core Architecture | MIPS32 M-Class (M4K microAptiv) |
| Core Frequency | 250 MHz (max 252 MHz) |
| FPU | Yes (single-precision) |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| ADC | 12-bit, 18 MSPS |
| USB | Hi-Speed USB 2.0 OTG |
| CAN | 2x CAN 2.0b |
| Crypto Engine | No (G variant - no crypto, no CAN FD on this device) |
| パッケージ | 100-pin TQFP (PT), 12x12 mm |
| 動作温度 | -40C to +85C (Industrial - I grade) |
| RoHS ステータス | Compliant |
PIC32MZ1024EFG100-250I/PT 100-pin tqfp (pt), 12x12 mm ピン配置ガイド
PIC32MZ1024EFG100-250I/PT (100-pin tqfp (pt), 12x12 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ1024EFG100-250I/PT.
詳細は データシート をご参照ください。
主な用途
PIC32MZ1024EFG100-250I/PT の用途: 7 件s: Industrial IoT Edge Nodes, High-Resolution HMI / Graphics Panels, BLDC / PMSM Motor Control, Automotive Infotainment Subsystems, USB-Based Embedded Devices, DSP Audio Processing, Medical Monitoring Equipment.
Industrial IoT Edge Nodes
The PIC32MZ1024EFG100-250I/PT's 250 MHz MIPS core with FPU and 1 MB Flash makes it well suited for industrial IoT edge nodes running TLS-secured MQTT or HTTP clients. The crypto-less G variant suits designs using software TLS libraries, while the dual CAN 2.0b controllers bridge to industrial fieldbuses (CANopen, DeviceNet). The Hi-Speed USB 2.0 OTG enables local configuration via mass-storage or CDC. Designers typically pair the MCU with an ENC28J60 or external PHY for Ethernet connectivity.
おすすめ
High-Resolution HMI / Graphics Panels
The PIC32MZ1024EFG100-250I/PT drives high-resolution HMI panels through its Parallel Master Port (PMP) graphics interface, supporting TFT displays up to 24-bit color. With 512 KB SRAM it accommodates partial framebuffers, and the 1 MB Flash stores UI assets, fonts, and image data. The 12-bit 18 MSPS ADC handles touch-screen analog front-ends. The 250 MHz core sustains real-time UI updates, animations, and on-screen data plotting without frame jitter.
おすすめ
BLDC / PMSM Motor Control
Field-oriented control (FOC) of BLDC and PMSM motors requires fast floating-point math for Park/Clarke transforms and PID loops - the PIC32MZ1024EFG100-250I/PT's 250 MHz MIPS core with single-precision FPU delivers this in software or via DSP extensions. The 12-bit 18 MSPS ADC samples multi-phase current feedback, and the motor-control PWM peripherals generate complementary 3-phase outputs with dead-time insertion. The 100-pin TQFP provides ample I/O for Hall/encoder feedback and protection signals.
おすすめ
Automotive Infotainment Subsystems
The PIC32MZ1024EFG100-250I/PT powers automotive infotainment subsystems requiring high-performance 32-bit processing, USB connectivity for media, and CAN bus integration for vehicle networks. The Industrial temperature grade (-40C to +85C) suits cabin environments, and the 250 MHz core handles audio codec interfaces (I2S), Bluetooth HCI over UART, and capacitive touch key scanning. Note: for under-hood or powertrain applications requiring AEC-Q100, select the automotive-qualified variants instead.
おすすめ
USB-Based Embedded Devices
The PIC32MZ1024EFG100-250I/PT's Hi-Speed USB 2.0 OTG controller enables embedded devices that act as USB device, host, or dual-role - including USB mass storage, CDC virtual COM ports, HID interfaces, and USB audio class devices. The 250 MHz core handles USB protocol stacks, descriptor management, and bulk transfers with low CPU overhead. Combined with 1 MB Flash and 512 KB SRAM, the part supports complex USB peripherals such as programmable instruments and data loggers.
おすすめ
DSP Audio Processing
The PIC32MZ1024EFG100-250I/PT's MIPS M4K core with DSP extensions and single-precision FPU performs real-time audio DSP - filters, EQ, dynamics, FFT analysis - at sample rates up to 192 kHz. The I2S peripheral interfaces to external DACs/ADCs, while the DMA controller offloads sample transfer between I2S and SRAM. The 100-pin TQFP exposes multiple timer/PWM channels for LED VU meters or soft-mute control, and the 1 MB Flash stores coefficient tables and presets.
おすすめ
Medical Monitoring Equipment
The PIC32MZ1024EFG100-250I/PT's 12-bit 18 MSPS ADC, FPU, and rich connectivity suit medical monitoring designs such as pulse oximeters, spirometers, and patient-side monitors. The 250 MHz core runs DSP-based filtering (IIR/FIR) on biosignals, while USB enables data transfer to host applications. Note: medical devices typically require IEC 60601 compliance which is the integrator's responsibility; this part provides the processing and connectivity substrate but is not itself medical-grade certified.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1024EFG100-250I/PT — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1024EFE100-I/PT | PIC32MZ1024ECG100-I/PT | PIC32MZ1024ECH100-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PT) 12x12 mm | TQFP-100 (PT) - same | TQFP-100 (PT) - same | TQFP-100 (PT) - same |
| Core Frequency | 250 MHz | 250 MHz (same) | 200 MHz (-20%) | 250 MHz (same) |
| Flash | 1 MB | 1 MB (same) | 1 MB (same) | 1 MB (same) |
| SRAM | 512 KB | 512 KB (same) | 512 KB (same) | 512 KB (same) |
| Crypto Engine | No (G variant) | Yes (F variant) | No (G variant) | Yes (H variant) |
| CAN FD | No | Yes | No | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| FPU | Yes | Yes | Yes | Yes |
主な差別化要因
- Maximum 250 MHz performance with FPU in the G variant （vs PIC32MZ1024ECG100-I/PT)
- Same-footprint crypto upgrade path available （vs PIC32MZ1024EFE100-I/PT)
- FPU + DSP extensions for floating-point workloads （vs PIC32MX795F512L-80I/PT)
- Hi-Speed USB 2.0 OTG vs Full-Speed on older parts （vs PIC32MX775F512L-80I/PT)
設計ノート
Estimated: at 250 MHz active core and 3.3 V supply, the PIC32MZ1024EFG100-250I/PT draws approximately 70-100 mA active current depending on peripheral usage. Place a 100 nF decoupling capacitor within 5 mm of every VDD/VDDIO pin pair, plus a bulk 4.7 uF to 10 uF tantalum or ceramic near the package. Add a 10 uF bulk on the AVDD analog supply rail to minimize ADC noise. Use a separate ferrite bead between digital and analog grounds if ADC accuracy is critical.
Estimated: the 100-pin TQFP (PT) package has a typical theta_JA of approximately 45-55 C/W depending on PCB copper area. At 250 MHz full-load with all peripherals active (~150 mA total), the part dissipates roughly 0.5 W, giving a junction temperature rise of 25-30 C above ambient. For continuous 250 MHz operation in high-ambient (>70 C) enclosures, add thermal vias under the exposed thermal pad and ensure minimum 1 sq inch copper pour on top and bottom layers.
Route the 50 MHz external crystal traces (OSC1/OSC2) as short as possible with ground guard traces to minimize EMI pickup. Keep USB DP/DM traces 90 ohm differential impedance matched, with the DP line length matching DM within 150 mils. Place the Hi-Speed USB PHY termination resistors within 4 mm of the MCU pins. For PMP/parallel graphics interfaces, group data and control lines and use matched-length routing on the lower-byte and upper-byte groups.
Do not omit the 1 uF + 100 nF decoupling combination on VDDPLL/VCAP pins - failure to do so causes PLL lock failures or unstable operation. Ensure the 32768 Hz secondary oscillator (SOSC) crystal load capacitors match the crystal's specified load capacitance (typically 12.5 pF). When using USB Hi-Speed mode, the internal regulator requires a 4.7 uF capacitor on the VUSB3V3 pin. Programming/debug requires the ICSP pins (PGECx/PGEDx) to be accessible - do not route them to inaccessible pads.
Use a 4-layer PCB stack-up with dedicated ground and power planes for best signal integrity at 250 MHz. Place the MCU at the center of the board with short traces to high-speed peripherals (USB, Ethernet PHY). For Ethernet RMII, route the 50 MHz RMII_REF_CLK with 50 ohm controlled impedance and match the RMII data lines within 50 mils of the clock. Analog signals (ADC inputs) should be routed away from digital switching lines, with a ground guard between analog and digital sections.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free per Microchip environmental compliance documentation. Not AEC-Q100 qualified (Industrial grade only) - for automotive applications use AEC-Q100-qualified MZ variants.
