PIC32MZ1025DAL169T-I/HF - 1MB Flash 32-bit MCU 200MHz LFBGA-169 | Microchip
部品番号: PIC32MZ1025DAL169T-I/HF ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.2 | $132.00 |
| 100 | $11.85 | $1,185.00 |
| 500 | $10.55 | $5,275.00 |
| 1,000 | $9.4 | $9,400.00 |
| 3,000 | $8.3 | $24,900.00 |
PIC32MZ1025DAL169T-I/HF 概要
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals into one device. Within the broader taxonomy, the PIC32MZ DAL belongs to: microcontroller -> 32-bit MCU -> MIPS-based MCU -> PIC32MZ family -> PIC32MZ Graphics (DAK/DAL/DAR/DAS) sub-family -> DAL graphics tier. This hierarchy matters because engineers selecting an MCU for a graphics HMI typically compare core frequency, internal memory, graphics acceleration, peripheral mix (USB, CAN, ADC), and package size against competing MPU/MCU products.
Key features of this part include: 1 MB on-chip Flash (the '1025' designator indicates the Flash density in KB), 256 KB SRAM, 200 MHz maximum CPU clock, 12-bit 18 MSPS ADC with up to 45 analog inputs, USB 2.0 High-Speed OTG, two CAN 2.0b modules, an integrated Graphics Controller with parallel RGB output, and 8-/16-bit PMP. The 'T' suffix denotes Tape and Reel packaging, and the 'I/HF' industrial temperature grade ranges from -40C to +85C.
Architecturally, the PIC32MZ1025DAL169T uses the MIPS32 microAptiv core with a 5-stage pipeline, hardware Multiply/Divide, DSP ASE, and a dedicated bus matrix that allows concurrent DMA between SRAM and peripherals. The integrated Graphics Processor (GPU) offloads line-draw, block-copy, and alpha-blend operations from the CPU, which is essential for driving TFT LCDs at QVGA/WQVGA without taxing the application thread.
Typical applications include industrial HMI panels, home appliance user interfaces, automotive infotainment secondary displays, medical device GUIs, and low-cost point-of-sale terminals. The combination of on-chip 2D GPU and HS USB makes it well suited for connected, touch-driven products.
When designing with this MCU, note that the LFBGA-169 package requires PCB micro-via technology (laser-drilled, ~0.1 mm pad pitch) and controlled-impedance routing for the parallel RGB bus; expect 4-6 layer stack-ups and follow Microchip's TB3137 PCB layout guidelines for fan-out and length-matching. The DAL variant does not support external DDR2 - if you need higher frame-buffer headroom for >WVGA panels, step up to the DAK sub-family.
This page synthesizes distributor pricing, same-family drop-in alternatives, and PCB design notes that are not found in the manufacturer datasheet alone.
ドロップイン代替品: PIC32MZ1025DAL169T-I/HF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1025DAL169T-I/HF （同一形状・フットプリント） — 相違点: Graphics Controller, USB, Package, External Memory Interface, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1025DAB169T-I/HF
✅ ドロップイン✓ 在庫あり
$12.65 / 個
データシートを見る →PIC32MZ1025DAB169-I/HF
✅ ドロップイン✓ 在庫あり
$7.85 / 個
データシートを見る →PIC32MZ1025DAK169-I/HF
✅ ドロップイン✓ 在庫あり
$10.95 / 個
データシートを見る →PIC32MZ1025DAL169-V/HF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1025DAL169-I/HF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1025DAB176T-I/2J
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$21.75 / 個
データシートを見る →PIC32MZ1025DAL169T-I/HF 最大定格＆電気的特性
| Series | PIC32MZ Graphics (DAK/DAL/DAR/DAS) Family |
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-Bit Single-Core |
| Maximum CPU Clock | 200 MHz |
| Program Memory (Flash) | 1 MB (1024 KB) |
| RAM (SRAM) | 256 KB |
| Operating Voltage (Core) | 1.8 V |
| Operating Voltage (I/O) | 3.3 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (RGB parallel output) |
| GPU / 2D Accelerator | Yes (line-draw, block-copy, alpha-blend) |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2x CAN 2.0b |
| Parallel Master Port (PMP) | 8-/16-bit |
| パッケージ | 169-LFBGA (11x11 mm) |
| 実装タイプ | Surface Mount (Tape and Reel) |
| 動作温度 | -40C to +85C (Industrial) |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
PIC32MZ1025DAL169T-I/HF 169-lfbga (11x11 mm) ピン配置ガイド
PIC32MZ1025DAL169T-I/HF (169-lfbga (11x11 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ1025DAL169T-I/HF.
詳細は データシート をご参照ください。
主な用途
PIC32MZ1025DAL169T-I/HF の用途: 6 件s: Industrial HMI Touch Panels, Home Appliance User Interfaces, Automotive Infotainment Secondary Displays, Medical Device GUI Controllers, Point-of-Sale Terminals, Connected IoT Gateways with Display.
Industrial HMI Touch Panels
The PIC32MZ1025DAL169T-I/HF fits industrial HMI panels because it pairs a 200 MHz MIPS32 microAptiv core with an integrated 2D GPU, on-chip 256 KB SRAM frame buffer, and a 12-bit 18 MSPS ADC for analog sensor readout behind the touchscreen. The integrated Graphics Controller drives parallel RGB TFTs up to WQVGA without external DDR2, reducing BOM cost. Place the device between the TFT LCD connector (RGB bus) and the touch-controller I2C bus; the HS USB OTG connects to upstream PLCs or HMI bridges. The -40C to +85C industrial grade meets factory-floor operating conditions.
おすすめ
Home Appliance User Interfaces
The PIC32MZ1025DAL169T-I/HF suits smart-appliance UIs (washing machines, ovens, refrigerators) thanks to its 2D GPU that accelerates icon and progress-bar rendering on small TFT displays, plus dual CAN 2.0b for connection to the appliance's main controller and a 45-channel 12-bit ADC for reading temperature, humidity, and motor-current sensors. The integrated HS USB OTG supports firmware update and Wi-Fi dongle attachment. The LFBGA-169 footprint fits behind 3.5-5 inch displays where PCB space is tight; the industrial -40C to +85C temperature range covers appliance use cases.
おすすめ
Automotive Infotainment Secondary Displays
The PIC32MZ1025DAL169T-I/HF is well matched to rear-seat entertainment or HVAC secondary displays. Its integrated 2D GPU drives small LCDs from internal SRAM, while dual CAN 2.0b ports connect to the vehicle CAN bus for HVAC, seat, or rear-seat entertainment control. For under-hood or direct-sunlight cabin conditions, the -40C to +85C industrial grade suffices; step up to the PIC32MZ1025DAL169-V/HF automotive grade if -40C to +105C is required. The LFBGA package is automotive-vibration compatible when properly PCB-mounted.
おすすめ
Medical Device GUI Controllers
The PIC32MZ1025DAL169T-I/HF powers medical-device front panels such as infusion pumps, patient monitors, and diagnostic analyzers. The 200 MHz MIPS core plus integrated 2D GPU renders trend graphs, menus, and waveform overlays on TFT displays without taxing the main application thread. The 12-bit 18 MSPS ADC with up to 45 channels acquires multiple sensor signals (pressure, flow, temperature) with low-latency DMA to SRAM. The HS USB OTG supports wired connectivity to hospital networks. The industrial -40C to +85C temperature range meets IEC 60601-1 ambient requirements when paired with appropriate isolation.
おすすめ
Point-of-Sale Terminals
The PIC32MZ1025DAL169T-I/HF drives POS terminals requiring a color touchscreen GUI plus multiple connectivity options. The 200 MHz core runs GUI stacks and transaction encryption in parallel; the integrated 2D GPU renders receipt previews and signature-capture screens. HS USB OTG connects to printers, barcode scanners, and payment peripherals; dual CAN is rarely used here but available for vending-machine extensions. The on-chip 1 MB Flash stores GUI assets and bootloader images; the 256 KB SRAM handles the frame buffer for small TFTs. Industrial temperature grade supports retail-environment operation.
おすすめ
Connected IoT Gateways with Display
The PIC32MZ1025DAL169T-I/HF serves IoT gateways that need a local HMI display plus HS USB for Wi-Fi/BLE dongles. The MIPS32 microAptiv core runs TCP/IP stacks alongside the GUI; the integrated 2D GPU offloads icon rendering for status displays showing sensor readings or network status. The 12-bit 18 MSPS ADC monitors rail voltages and external sensors. With dual CAN and USB, the same device can act as a CAN-to-USB bridge with a local diagnostic display. The LFBGA-169 footprint fits compact gateway enclosures where a 3-5 inch TFT is mounted on the front panel.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1025DAL169T-I/HF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1025DAB169T-I/HF | PIC32MZ1025DAK169-I/HF | PIC32MZ1025DAL169-V/HF |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Flash Memory | 1 MB | 1 MB | 2 MB | 1 MB |
| External DDR2 Controller | No (DAL sub-family) | Yes (DAB sub-family) | Yes (DAK sub-family) | No (DAL sub-family) |
| Maximum CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +105C (Automotive Grade) |
| Integrated GPU | Yes (2D) | Yes (2D) | Yes (2D) | Yes (2D) |
| USB | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG |
| Approx. Single-Piece Price (USD) | $14.50 | ~$15.10 | ~$17.20 | ~$16.80 |
主な差別化要因
- Lower BOM cost versus DAB/DAK variants by omitting external DDR2 （vs PIC32MZ1025DAB169T-I/HF)
- Drop-in automotive-grade upgrade path （vs PIC32MZ1025DAL169-V/HF)
- Same-family higher-Flash upgrade path （vs PIC32MZ1025DAK169-I/HF)
設計ノート
The 169-LFBGA package has 0.8 mm ball pitch and requires micro-via PCB technology. Use a 4-6 layer stack-up with a dedicated ground plane beneath the BGA and length-matched routing for the parallel RGB bus. Per Microchip TB3137, fan-out the BGA signals on the top layer through micro-vias to inner layers; keep the RGB data/clock skew under 50 ps. Apply corner staking or underfill to improve vibration resistance for industrial environments.
The PIC32MZ1025DAL169T-I/HF requires separate 1.8 V core and 3.3 V I/O rails; decouple each rail with 100 nF ceramic capacitors placed within 5 mm of every VDD/VSS pair, plus bulk 4.7 uF tantalum or ceramic capacitors at the regulator outputs. Enable Power-on-Reset delay (POR) by holding the MCLR pin low until both rails are stable. The integrated 2D GPU can draw dynamic current spikes up to 80 mA during alpha-blend operations - use 22 uF bulk on the core rail to suppress rail droop.
Do not assume the DAL variant supports external DDR2 - it does not. If your design needs >WVGA frame buffer memory, choose the DAB or DAK sub-family instead. Also, the 256 KB internal SRAM is shared between data, stack, and frame buffer; allocating a QVGA frame buffer at 16bpp consumes 150 KB, leaving only ~100 KB for application data. Use the integrated GPU's tile-based rendering to reduce frame buffer footprint when designing with small internal SRAM.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. The standard -I/HF industrial grade is not AEC-Q100 qualified; choose the -V/HF automotive grade variant for AEC-Q100 applications.