PIC32MZ1025DAL169T-I/HF - 1MB Flash 32-bit MCU 200MHz LFBGA-169 | Microchip
料号： PIC32MZ1025DAL169T-I/HF ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.2 | $132.00 |
| 100 | $11.85 | $1,185.00 |
| 500 | $10.55 | $5,275.00 |
| 1,000 | $9.4 | $9,400.00 |
| 3,000 | $8.3 | $24,900.00 |
PIC32MZ1025DAL169T-I/HF 概述
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals into one device. Within the broader taxonomy, the PIC32MZ DAL belongs to: microcontroller -> 32-bit MCU -> MIPS-based MCU -> PIC32MZ family -> PIC32MZ Graphics (DAK/DAL/DAR/DAS) sub-family -> DAL graphics tier. This hierarchy matters because engineers selecting an MCU for a graphics HMI typically compare core frequency, internal memory, graphics acceleration, peripheral mix (USB, CAN, ADC), and package size against competing MPU/MCU products.
Key features of this part include: 1 MB on-chip Flash (the '1025' designator indicates the Flash density in KB), 256 KB SRAM, 200 MHz maximum CPU clock, 12-bit 18 MSPS ADC with up to 45 analog inputs, USB 2.0 High-Speed OTG, two CAN 2.0b modules, an integrated Graphics Controller with parallel RGB output, and 8-/16-bit PMP. The 'T' suffix denotes Tape and Reel packaging, and the 'I/HF' industrial temperature grade ranges from -40C to +85C.
Architecturally, the PIC32MZ1025DAL169T uses the MIPS32 microAptiv core with a 5-stage pipeline, hardware Multiply/Divide, DSP ASE, and a dedicated bus matrix that allows concurrent DMA between SRAM and peripherals. The integrated Graphics Processor (GPU) offloads line-draw, block-copy, and alpha-blend operations from the CPU, which is essential for driving TFT LCDs at QVGA/WQVGA without taxing the application thread.
Typical applications include industrial HMI panels, home appliance user interfaces, automotive infotainment secondary displays, medical device GUIs, and low-cost point-of-sale terminals. The combination of on-chip 2D GPU and HS USB makes it well suited for connected, touch-driven products.
When designing with this MCU, note that the LFBGA-169 package requires PCB micro-via technology (laser-drilled, ~0.1 mm pad pitch) and controlled-impedance routing for the parallel RGB bus; expect 4-6 layer stack-ups and follow Microchip's TB3137 PCB layout guidelines for fan-out and length-matching. The DAL variant does not support external DDR2 - if you need higher frame-buffer headroom for >WVGA panels, step up to the DAK sub-family.
This page synthesizes distributor pricing, same-family drop-in alternatives, and PCB design notes that are not found in the manufacturer datasheet alone.
直接替换替代料： PIC32MZ1025DAL169T-I/HF ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ1025DAL169T-I/HF （相同外形与封装尺寸） ——差异在于 Graphics Controller, USB, Package, External Memory Interface, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ1025DAB169T-I/HF
✅ 直接替换✓ 有现货
$12.65 / 个
查看数据手册 →PIC32MZ1025DAB169-I/HF
✅ 直接替换✓ 有现货
$7.85 / 个
查看数据手册 →PIC32MZ1025DAK169-I/HF
✅ 直接替换✓ 有现货
$10.95 / 个
查看数据手册 →PIC32MZ1025DAL169-V/HF
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1025DAL169-I/HF
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1025DAB176T-I/2J
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$21.75 / 个
查看数据手册 →PIC32MZ1025DAL169T-I/HF 最大额定值与电气特性
| Series | PIC32MZ Graphics (DAK/DAL/DAR/DAS) Family |
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-Bit Single-Core |
| Maximum CPU Clock | 200 MHz |
| Program Memory (Flash) | 1 MB (1024 KB) |
| RAM (SRAM) | 256 KB |
| Operating Voltage (Core) | 1.8 V |
| Operating Voltage (I/O) | 3.3 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (RGB parallel output) |
| GPU / 2D Accelerator | Yes (line-draw, block-copy, alpha-blend) |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2x CAN 2.0b |
| Parallel Master Port (PMP) | 8-/16-bit |
| 封装 | 169-LFBGA (11x11 mm) |
| 安装类型 | Surface Mount (Tape and Reel) |
| 工作温度 | -40C to +85C (Industrial) |
| MSL 等级 | 3 |
| RoHS 状态 | Compliant |
PIC32MZ1025DAL169T-I/HF 169-lfbga (11x11 mm) 引脚配置指南
PIC32MZ1025DAL169T-I/HF（169-lfbga (11x11 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MZ1025DAL169T-I/HF.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MZ1025DAL169T-I/HF 适用于 6 应用s: Industrial HMI Touch Panels, Home Appliance User Interfaces, Automotive Infotainment Secondary Displays, Medical Device GUI Controllers, Point-of-Sale Terminals, Connected IoT Gateways with Display.
Industrial HMI Touch Panels
The PIC32MZ1025DAL169T-I/HF fits industrial HMI panels because it pairs a 200 MHz MIPS32 microAptiv core with an integrated 2D GPU, on-chip 256 KB SRAM frame buffer, and a 12-bit 18 MSPS ADC for analog sensor readout behind the touchscreen. The integrated Graphics Controller drives parallel RGB TFTs up to WQVGA without external DDR2, reducing BOM cost. Place the device between the TFT LCD connector (RGB bus) and the touch-controller I2C bus; the HS USB OTG connects to upstream PLCs or HMI bridges. The -40C to +85C industrial grade meets factory-floor operating conditions.
推荐
Home Appliance User Interfaces
The PIC32MZ1025DAL169T-I/HF suits smart-appliance UIs (washing machines, ovens, refrigerators) thanks to its 2D GPU that accelerates icon and progress-bar rendering on small TFT displays, plus dual CAN 2.0b for connection to the appliance's main controller and a 45-channel 12-bit ADC for reading temperature, humidity, and motor-current sensors. The integrated HS USB OTG supports firmware update and Wi-Fi dongle attachment. The LFBGA-169 footprint fits behind 3.5-5 inch displays where PCB space is tight; the industrial -40C to +85C temperature range covers appliance use cases.
推荐
Automotive Infotainment Secondary Displays
The PIC32MZ1025DAL169T-I/HF is well matched to rear-seat entertainment or HVAC secondary displays. Its integrated 2D GPU drives small LCDs from internal SRAM, while dual CAN 2.0b ports connect to the vehicle CAN bus for HVAC, seat, or rear-seat entertainment control. For under-hood or direct-sunlight cabin conditions, the -40C to +85C industrial grade suffices; step up to the PIC32MZ1025DAL169-V/HF automotive grade if -40C to +105C is required. The LFBGA package is automotive-vibration compatible when properly PCB-mounted.
推荐
Medical Device GUI Controllers
The PIC32MZ1025DAL169T-I/HF powers medical-device front panels such as infusion pumps, patient monitors, and diagnostic analyzers. The 200 MHz MIPS core plus integrated 2D GPU renders trend graphs, menus, and waveform overlays on TFT displays without taxing the main application thread. The 12-bit 18 MSPS ADC with up to 45 channels acquires multiple sensor signals (pressure, flow, temperature) with low-latency DMA to SRAM. The HS USB OTG supports wired connectivity to hospital networks. The industrial -40C to +85C temperature range meets IEC 60601-1 ambient requirements when paired with appropriate isolation.
推荐
Point-of-Sale Terminals
The PIC32MZ1025DAL169T-I/HF drives POS terminals requiring a color touchscreen GUI plus multiple connectivity options. The 200 MHz core runs GUI stacks and transaction encryption in parallel; the integrated 2D GPU renders receipt previews and signature-capture screens. HS USB OTG connects to printers, barcode scanners, and payment peripherals; dual CAN is rarely used here but available for vending-machine extensions. The on-chip 1 MB Flash stores GUI assets and bootloader images; the 256 KB SRAM handles the frame buffer for small TFTs. Industrial temperature grade supports retail-environment operation.
推荐
Connected IoT Gateways with Display
The PIC32MZ1025DAL169T-I/HF serves IoT gateways that need a local HMI display plus HS USB for Wi-Fi/BLE dongles. The MIPS32 microAptiv core runs TCP/IP stacks alongside the GUI; the integrated 2D GPU offloads icon rendering for status displays showing sensor readings or network status. The 12-bit 18 MSPS ADC monitors rail voltages and external sensors. With dual CAN and USB, the same device can act as a CAN-to-USB bridge with a local diagnostic display. The LFBGA-169 footprint fits compact gateway enclosures where a 3-5 inch TFT is mounted on the front panel.
推荐
推荐产品汇总
工程参考数据： PIC32MZ1025DAL169T-I/HF ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ1025DAB169T-I/HF | PIC32MZ1025DAK169-I/HF | PIC32MZ1025DAL169-V/HF |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Flash Memory | 1 MB | 1 MB | 2 MB | 1 MB |
| External DDR2 Controller | No (DAL sub-family) | Yes (DAB sub-family) | Yes (DAK sub-family) | No (DAL sub-family) |
| Maximum CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +105C (Automotive Grade) |
| Integrated GPU | Yes (2D) | Yes (2D) | Yes (2D) | Yes (2D) |
| USB | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG |
| Approx. Single-Piece Price (USD) | $14.50 | ~$15.10 | ~$17.20 | ~$16.80 |
关键差异点
- Lower BOM cost versus DAB/DAK variants by omitting external DDR2 （对比 PIC32MZ1025DAB169T-I/HF)
- Drop-in automotive-grade upgrade path （对比 PIC32MZ1025DAL169-V/HF)
- Same-family higher-Flash upgrade path （对比 PIC32MZ1025DAK169-I/HF)
设计说明
The 169-LFBGA package has 0.8 mm ball pitch and requires micro-via PCB technology. Use a 4-6 layer stack-up with a dedicated ground plane beneath the BGA and length-matched routing for the parallel RGB bus. Per Microchip TB3137, fan-out the BGA signals on the top layer through micro-vias to inner layers; keep the RGB data/clock skew under 50 ps. Apply corner staking or underfill to improve vibration resistance for industrial environments.
The PIC32MZ1025DAL169T-I/HF requires separate 1.8 V core and 3.3 V I/O rails; decouple each rail with 100 nF ceramic capacitors placed within 5 mm of every VDD/VSS pair, plus bulk 4.7 uF tantalum or ceramic capacitors at the regulator outputs. Enable Power-on-Reset delay (POR) by holding the MCLR pin low until both rails are stable. The integrated 2D GPU can draw dynamic current spikes up to 80 mA during alpha-blend operations - use 22 uF bulk on the core rail to suppress rail droop.
Do not assume the DAL variant supports external DDR2 - it does not. If your design needs >WVGA frame buffer memory, choose the DAB or DAK sub-family instead. Also, the 256 KB internal SRAM is shared between data, stack, and frame buffer; allocating a QVGA frame buffer at 16bpp consumes 150 KB, leaving only ~100 KB for application data. Use the integrated GPU's tile-based rendering to reduce frame buffer footprint when designing with small internal SRAM.
合规信息
RoHS and REACH compliant per Microchip product page. The standard -I/HF industrial grade is not AEC-Q100 qualified; choose the -V/HF automotive grade variant for AEC-Q100 applications.