PIC32MZ2064DAS169-I/6J - 200MHz 32-bit MCU 2MB Flash 169-LFBGA | Microchip
部品番号: PIC32MZ2064DAS169-I/6J ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.45 | $18.45 |
| 10 | $16.62 | $166.20 |
| 100 | $14.78 | $1,478.00 |
| 500 | $13.25 | $6,625.00 |
| 1,000 | $11.94 | $11,940.00 |
PIC32MZ2064DAS169-I/6J 概要
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit CPU core, program and data memory, and a rich set of peripheral interfaces on a single silicon die. The PIC32MZ DA family belongs to the broader hierarchy: microcontroller -> embedded processor -> system-on-chip (SoC) -> semiconductor. It targets graphical HMI and connected-embedded workloads where traditional MCUs lack the bandwidth for parallel display driving and where discrete MPUs impose additional complexity. The 'DAS' sub-family specifically denotes parts that integrate the stacked DDR2 memory, while 'DAH' parts use an external DDR2 interface only.
Key features include 2 MB Flash with live-update support, 640 KB SRAM, a hardware crypto accelerator for AES/SHA, an integrated TFT LCD controller with dedicated 2D graphics processor, Hi-Speed USB 2.0 device/host/OTG, two CAN 2.0b controllers, six UART/SPI/I2C modules, twelve 16-bit timers, and a 12-bit 18 MSPS ADC with up to 45 analog input channels. The 169-LFBGA package exposes 120 general-purpose I/O pins, supports multiple I/O voltage domains from 1.8 V to 3.3 V, and provides a 24-bit address bus for the integrated DDR2 controller.
Architecturally, the PIC32MZ2064DAS169-I/6J implements the MIPS32 microAptiv core with DSP and FPU enhancements, a dual-issue pipeline, hardware multiply-accumulate, and 16 KB I-cache plus 16 KB D-cache. The integrated DDR2 memory interface and dedicated graphics peripherals eliminate the need for an external memory controller, allowing designers to allocate the full 32 MB of stacked DDR2 to framebuffer, texture, or general-purpose data storage while the CPU executes graphical workloads at full bus efficiency.
Typical applications include graphical human-machine interfaces (HMIs) on industrial equipment, smart home control panels, automotive infotainment displays, medical patient-monitoring terminals, point-of-sale (POS) terminals, and IoT edge devices requiring on-device rendering. The integrated crypto engine and secure boot features also make the part suitable for connected products that must meet evolving security and firmware-authentication requirements.
When designing with this MCU, allocate the four DDR2 supply rails (VDD_DDR, VTT, VREF) with careful decoupling and matched-length routing to maintain signal integrity. The 169-LFBGA's 0.8 mm ball pitch demands a multilayer PCB with microvia stack-ups; a 4-layer 1 oz copper stack is the minimum recommended. Always validate DDR2 timing margins against the IBIS model before committing to layout.
This page synthesizes distributor pricing, datasheet specifications, drop-in same-package alternatives from the PIC32MZ DA family, and practical design guidance not aggregated on standard distributor listings.
ドロップイン代替品: PIC32MZ2064DAS169-I/6J — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ2064DAS169-I/6J （同一形状・フットプリント） — 相違点: Graphics Controller, Operating Temperature, CAN, USB, ADC.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ2064DAS169T-I/6J
✅ ドロップイン✓ 在庫あり
$10.85 / 個
データシートを見る →PIC32MZ2064DAS169-V/6J
✅ ドロップイン✓ 在庫あり
$15.18 / 個
データシートを見る →PIC32MZ2064DAS169-I/6JX
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ2064DAS169T-V/6J
✅ ドロップイン✓ 在庫あり
$6.42 / 個
データシートを見る →PIC32MZ2064DAG169-I/6J
✅ ドロップイン✓ 在庫あり
$12.95 / 個
データシートを見る →PIC32MZ2064DAS169-I/6J 最大定格＆電気的特性
| Core Architecture | MIPS32 microAptiv with DSP/FPU |
| CPU Frequency | 200 MHz |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Integrated DDR2 DRAM | 32 MB (stacked) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated TFT LCD + dedicated 2D GPU |
| USB | Hi-Speed USB 2.0 (Device/Host/OTG) |
| CAN | 2x CAN 2.0b |
| UART / SPI / I2C | 6 modules |
| Timers | 12x 16-bit |
| Crypto Accelerator | Hardware AES / SHA |
| GPIO | 120 pins |
| パッケージ | 169-LFBGA (11x11 mm) |
| 動作温度 | -40C to +85C (Industrial) |
| 電源電圧 | 1.8 V to 3.3 V (multiple rails) |
| Address Bus | 24-bit |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
PIC32MZ2064DAS169-I/6J 169-lfbga (11x11 mm) ピン配置ガイド
PIC32MZ2064DAS169-I/6J (169-lfbga (11x11 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ2064DAS169-I/6J.
詳細は データシート をご参照ください。
主な用途
PIC32MZ2064DAS169-I/6J の用途: 6 件s: Industrial Human-Machine Interface (HMI), Smart Home Control Panels, Automotive Infotainment Displays, Medical Patient-Monitoring Terminals, Point-of-Sale (POS) Terminals, IoT Edge Devices with On-Device Rendering.
Industrial Human-Machine Interface (HMI)
The PIC32MZ2064DAS169-I/6J is engineered for industrial HMIs where 32 MB of stacked DDR2 directly hosts the framebuffer for TFT LCDs up to WXGA. Its 200 MHz MIPS32 microAptiv core sustains GUI redraws while the integrated 2D GPU accelerates blits, alpha blending, and font rendering, eliminating the need for an external graphics controller. Placed on a 4-layer PCB with matched-length DDR2 routing, the MCU drives a 7-10 inch panel at 60 fps without external DRAM. The hardware crypto engine secures firmware updates and authentication flows required by IEC 62443 industrial-security guidelines.
おすすめ
Smart Home Control Panels
Smart-home hubs benefit from the PIC32MZ2064DAS169-I/6J's integrated TFT controller, 32 MB of stacked framebuffer, and HS USB 2.0 OTG for connection to external cameras or Wi-Fi dongles. The 200 MHz MIPS core runs a lightweight embedded GUI while the dual CAN 2.0b controllers tie into HVAC and access-control buses, and the 12-bit 18 MSPS ADC reads analog sensors (temperature, light, occupancy). The crypto accelerator secures MQTT-TLS sessions and Zigbee/BLE commissioning flows demanded by Matter-compatible smart-home devices.
おすすめ
Automotive Infotainment Displays
The PIC32MZ2064DAS169-V/6J (extended-temperature variant) is ideal for automotive infotainment secondary displays such as rear-seat entertainment and HVAC control panels. Its 200 MHz MIPS core drives a WVGA TFT panel smoothly, while the dual CAN 2.0b interfaces connect to vehicle body networks. The 120 GPIO allow direct interfacing with backlight drivers, touch controllers, and rotary encoders. Stacked 32 MB DDR2 stores bitmaps and fonts without external memory, easing BOM and improving reliability under vehicle vibration.
おすすめ
Medical Patient-Monitoring Terminals
Bedside patient monitors use the PIC32MZ2064DAS169-I/6J to drive a multi-waveform color TFT while running vital-sign algorithms on the DSP-enhanced MIPS core. The 12-bit 18 MSPS ADC samples up to 45 analog channels simultaneously for ECG, SpO2, respiration, and temperature inputs. Integrated HS USB 2.0 connects to EMR gateways, while the AES hardware engine secures patient data per HIPAA guidelines. The stacked 32 MB DDR2 holds full-resolution waveforms and trend graphs without external memory.
おすすめ
Point-of-Sale (POS) Terminals
POS terminals rely on the PIC32MZ2064DAS169-I/6J's hardware crypto engine for PCI-PTS certified transaction flows, the integrated TFT controller for the operator display, and the 120 GPIO for keypad, NFC, printer, and cash-drawer interfaces. The 200 MHz MIPS core runs the embedded GUI plus EMV stack concurrently. Stacked DDR2 stores UI assets and transaction buffers, eliminating external memory cost. HS USB 2.0 host mode supports external barcode scanners and customer-facing displays.
おすすめ
IoT Edge Devices with On-Device Rendering
IoT edge gateways benefit from the PIC32MZ2064DAS169-I/6J's ability to render dashboards locally on a TFT panel while aggregating sensor data over CAN, UART, SPI, and I2C. The integrated 2D GPU accelerates gauge widgets and trend charts without taxing the CPU. Stacked 32 MB DDR2 hosts on-device web assets and JSON caches, while the crypto engine secures MQTT-TLS and HTTPS connections to the cloud. The 169-LFBGA package supports compact fanless enclosures with passive cooling.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ2064DAS169-I/6J — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ2064DAS169T-I/6J | PIC32MZ2064DAS169-V/6J | PIC32MZ2064DAS169-I/6JX | PIC32MZ2064DAS169T-V/6J | PIC32MZ2064DAG169-I/6J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same footprint, ball map differs at DDR2 region |
| CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Integrated DDR2 | 32 MB stacked | 32 MB stacked | 32 MB stacked | 32 MB stacked | 32 MB stacked | External DDR2 controller only (no stacked) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +105C | -40C to +85C |
| GPIO | 120 | 120 | 120 | 120 | 120 | 120 |
主な差別化要因
- Integrated 32 MB stacked DDR2 DRAM eliminates external memory BOM （vs PIC32MZ2064DAG169-I/6J)
- Hardware crypto engine accelerates secure firmware boot and TLS （vs Generic ARM Cortex-M4 MCU at 200 MHz)
- Industrial temperature grade with stacked DDR2 in one package （vs PIC32MZ2064DAS169-V/6J)
設計ノート
The 169-LFBGA's 0.8 mm ball pitch requires a multilayer PCB with microvia stack-ups; a 4-layer 1 oz copper stack is the minimum recommended, with 6 layers preferred for matched-length DDR2 routing. Place the four DDR2 supply rails (VDD_DDR, VTT, VREF, VDD_DDR_PLL) with bulk 10uF plus 100nF ceramic decoupling within 2 mm of each supply ball. Match DDR2 trace lengths within +/- 25 mil and 90 ohm differential impedance per the IBIS model.
Estimated: at 200 MHz core and 1.0 V core rail drawing 250 mA typical, internal dissipation is approximately 0.25 W - well within the 169-LFBGA's 30 C/W theta_JA on a 4-layer PCB. The DDR2 controller and graphics controller add an estimated 0.4 W when fully active. No external heatsink is required for typical industrial operating temperatures, but the thermal pad must be soldered to a continuous ground plane with stitched thermal vias.
Always configure the PPS (Peripheral Pin Select) registers before enabling peripherals - the default GPIO mapping differs from the legacy PIC32MX series and many example ports will not work without explicit PPS configuration. The DDR2 controller requires a 50% duty-cycle clock from the internal PLL; route the DDR2 clock with matched length and isolate it from analog ADC traces to avoid coupling. Failure to follow the IBIS-validated DDR2 timing margins is the most common cause of graphical-artifact bugs on first prototypes.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. Industrial (-I) temperature grade only; for AEC-Q100 automotive qualification, contact Microchip for the AEC-Q100 screening option.