Rockchip

RK3308-CC - Quad-Core A35 1.3GHz AIoT Main Board | Rockchip

部品番号: RK3308-CC ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.3 GHz Speed
開始価格 $26.8 USD / 個
MOQ: 1 |
価格更新日: 2026-10-15
ボリューム価格
数量 単価 小計
1 $41.9 $41.90
10 $38.5 $385.00
100 $34.2 $3,420.00
500 $30.1 $15,050.00
1,000 $26.8 $26,800.00
ℹ️ すべての価格はUSDです

RK3308-CC 概要

The Rockchip RK3308-CC (ROC-RK3308-CC) is an AI+IoT open-source main board built around the Rockchip RK3308 64-bit Quad-Core ARM Cortex-A35 application processor running at up to 1.3 GHz, with an integrated high-performance audio CODEC and hardware Voice Activity Detection (VAD) engine. It pairs a compact 60 mm x 45 mm footprint with 256 MB / 512 MB / 1 GB DDR3 options and 4 GB / 8 GB / 16 GB eMMC storage options for cost-effective smart-audio product development.

An AIoT open-source main board (ROC form factor) is a credit-card-sized single-board computer built around an integrated application processor, designed to host AI/ML inference, microphone-array audio front-end, and IoT connectivity simultaneously - it is essentially the compute platform that turns a smart-speaker, voice-controlled appliance, or industrial gateway concept into a working prototype without requiring a custom baseboard. In the broader taxonomy it sits between a microcontroller development board and a Linux SBC, sharing the open-source Linux ecosystem of the latter while targeting power-constrained always-listening voice endpoints of the former.

Key features include four Cortex-A35 cores in a high-efficiency big.LITTLE-less cluster, dedicated microphone-array PDM/I2S interfaces capable of driving up to 6 digital MEMS microphones, integrated VAD for sub-1 W standby voice wake, and Linux/Android SDK support. The board exposes 1 USB 2.0 OTG, 1 USB 2.0 HOST, 1 SDIO 3.0, 1 SPI, 1 I2C, 1 UART debug console, 1 GbE via the RTL8211F PHY, and on-board 2.4 GHz Wi-Fi plus optional Bluetooth 4.2 via the RTL8723DS module.

The SoC uses TSMC 28 nm HPC process technology and Rockchip's third-generation power-management architecture, achieving deep-sleep current in the low single-digit mA range while keeping wake word latency under 100 ms. The Cortex-A35 core is the most power-efficient 64-bit ARM Cortex-A class implementation in this performance tier, and the embedded VAD removes the need for an external audio DSP in many voice-front-end designs.

Typical applications include smart speakers and soundbars with always-listening voice wake, AI voice-controlled appliances and white goods, six-microphone array conferencing systems, industrial voice-controlled HMIs, and Linux-based IoT gateways with on-board keyword spotting. Smart-audio OEMs in particular value the integrated CODEC plus VAD combination that simplifies BOM and shortens time-to-market.

When designing with this board, match the power-supply current capability to the peak Wi-Fi transmit budget, not just the SoC load, to avoid brownout during burst transmissions. Confirm microphone-array routing against the datasheet PDM/I2S pin map since the on-board 6-mic expansion is optional.

This page synthesizes distributor availability, drop-in alternatives, and practical design notes for the ROC-RK3308-CC open-source main board that are not aggregated in the official Rockchip RK3308 datasheet alone.

ドロップイン代替品: RK3308-CC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

クイック比較ツール — 並列比較する代替部品を選択:

ROC-RK3308B-CC-PLUS

✅ ドロップイン
📦 ROC 60 mm x 45 mm main board
same RK3308B die, same 60x45 mm ROC form factor, expanded RAM/Storage options

📋 参考代替品(カタログ未掲載)

Radxa rCore-RK3308

✅ ドロップイン
📦 Rockchip SoM 35 mm x 35 mm stamp
same RK3308 silicon, smaller 35x35 mm SoM form factor, integrated wireless - footprint differs from ROC

📋 参考代替品(カタログ未掲載)

DSOM-050

✅ ドロップイン
📦 System on Module (SoM) stamp
same RK3308 silicon, DK-SOM-050 form factor, paired with DDR3/DDR3L - footprint differs from ROC

📋 参考代替品(カタログ未掲載)

ROC-RK3399-PC

✅ ドロップイン
📦 ROC 60 mm x 45 mm main board
same ROC form factor, RK3399 hexa-core A72+A53 SoC, higher compute but same expansion pinout

📋 参考代替品(カタログ未掲載)

RK3308-CC 仕様(メーカー公開)

Processor Rockchip RK3308, 64-bit Quad-Core ARM Cortex-A35
Maximum CPU Frequency 1.3 GHz
Manufacturing Process 28 nm HPC
On-board RAM Options 256 MB / 512 MB / 1 GB DDR3
On-board Storage Options 4 GB / 8 GB / 16 GB eMMC
Integrated Audio CODEC Yes, high-performance stereo CODEC
Hardware VAD Yes, embedded Voice Activity Detection
Audio Interfaces PDM, I2S, microphone array up to 6 digital mics
USB Ports 1x USB 2.0 OTG, 1x USB 2.0 HOST
Network 1x 10/100/1000 Mbps Ethernet (RTL8211F), 2.4 GHz Wi-Fi
Bluetooth 4.2 (via RTL8723DS module, optional)
Expansion Interfaces SDIO 3.0, SPI, I2C, UART debug
Board Dimensions 60 mm x 45 mm (ROC form factor)
Operating System Support Linux, Android, Buildroot
Cooling Passive (no heatsink required)
RoHS ステータス Compliant

RK3308-CC インターフェースとコネクタ

RK3308-CC は、メーカーが公開している以下のインターフェースとコネクタを備えています: USB, Bluetooth。拡張ヘッダーのピン配置、コネクタのピン番号、電気的制限はメーカーのドキュメントで定義されています。

USB 1x USB 2.0 OTG, 1x USB 2.0 HOST
Bluetooth 4.2 (via RTL8723DS module, optional)

詳細は メーカー資料 をご参照ください(拡張ヘッダーのピン配置とコネクタのピン番号の詳細)。

電力・熱特性

冷却 Passive (no heatsink required)

メーカーが公開している RK3308-CC の電力入力および熱パラメータ。

主な用途

RK3308-CC の用途: 7 件s: Smart Speaker / Voice Assistant Endpoint, AI Voice-Controlled Appliance (White Goods), Six-Microphone Far-Field Conferencing System, Industrial Voice-Controlled HMI, Linux IoT Gateway with On-Device Wake Word, Smart Audio / Soundbar Processing Engine, Educational / Maker Voice-AI Development Board.

🔊

Smart Speaker / Voice Assistant Endpoint

The RK3308-CC is purpose-built for smart-speaker reference designs that need always-listening voice wake with offline keyword spotting. The Rockchip RK3308 SoC integrates a hardware VAD that watches the microphone-array input while the four Cortex-A35 cores stay parked at low frequency, reducing standby power well below 1 W while keeping wake-word latency under 100 ms. The integrated high-performance CODEC removes an external audio DAC from the BOM and the on-board 6-mic array expansion mates directly with the PDM/I2S pins, which is why smart-speaker OEMs seed designs on this board. Use the AK09911 / ICS-43432 digital MEMS mics from the Seeed Studio 6-mic array expansion for a drop-in front end.

🏠

AI Voice-Controlled Appliance (White Goods)

Voice-controlled washing machines, ovens, and HVAC controllers benefit from the RK3308-CC's combination of quad-core Cortex-A35 compute for on-device speech recognition, hardware VAD for sub-1 W standby, and ROC form factor that drops into existing appliance control boards. The 1.3 GHz Cortex-A35 cluster runs lightweight CNN/RNN wake-word and intent models locally, eliminating cloud-round-trip latency for command-response loops. Connect to the appliance's existing MCU over UART; the 1 GbE plus Wi-Fi/BT gives both wired backhaul and BLE provisioning paths for service technicians. Pair with Seeed Studio's PoE expansion if the appliance chassis is already wired for Ethernet.

🎙️

Six-Microphone Far-Field Conferencing System

Boardroom and huddle-space conference systems need beam-forming microphone arrays with on-board audio processing, exactly the workload the RK3308-CC was designed for. The four Cortex-A35 cores run beam-former, AEC, and noise-suppression algorithms in real time on the 6-mic PDM input, while the integrated CODEC handles line-echo cancellation paths. The gigabit Ethernet port streams the cleaned-up far-end signal directly to a USB-attached host PC for soft-client integration. Configure the system with the Seeed Studio 6-mic array board (12 tri-color LEDs + 5 keys) for mute/volume/zoom controls - this is the BOM recommended in the Mouser product overview.

🏭

Industrial Voice-Controlled HMI

Factory-floor and warehouse voice-HMI panels let operators request inventory, log incidents, and query machine status hands-free while wearing gloves - a use case where the RK3308-CC's industrial temperature tolerance, on-board gigabit Ethernet, and quiet passive cooling (no fan needed) fit well. The hardware VAD keeps the panel in sub-1 W standby continuously, and the four Cortex-A35 cores wake in under 100 ms to run speech-to-intent on the Linux SDK. Connect to the PLC over RS-485 via the UART debug port with a transceiver, and to the factory network over the on-board GbE. The ROC form factor allows a unified baseboard design across multiple SKUs.

🌐

Linux IoT Gateway with On-Device Wake Word

Edge IoT gateways aggregate sensor data and bridge local protocols (Zigbee, BLE, Modbus, RS-485) into MQTT/HTTPS cloud uplinks, often also accepting voice commands from operators. The RK3308-CC fits the gateway role with its 1 GbE Ethernet, 2.4 GHz Wi-Fi, optional Bluetooth 4.2, and the Cortex-A35 cluster that runs Linux containers (Docker via Buildroot). Adding on-device wake-word detection on the hardware VAD avoids streaming raw audio to the cloud, addressing privacy and bandwidth concerns common in deployments. Edge ML inference (anomaly detection, simple NLP) runs locally while the cloud only sees the structured intent payload.

🎧

Smart Audio / Soundbar Processing Engine

Soundbars and smart audio amplifiers that need multi-channel decoding, DRC, and room-correction algorithms benefit from the RK3308-CC's high-performance stereo CODEC and quad-core compute headroom. Drive the on-board CODEC from HDMI ARC or optical S/PDIF inputs (via companion transceiver MPNs on the expansion header), and run post-processing on the Cortex-A35 cores at sub-50 ms latency. Pin-compatibility with the ROC form factor means audio OEMs can re-use the same carrier board across the soundbar SKU and the smart-speaker SKU, simplifying manufacturing. The 1 GB DDR3 variant is recommended for room-correction filter tables in premium SKU designs.

🎓

Educational / Maker Voice-AI Development Board

Universities, makerspaces, and bootcamps teaching voice-AI and embedded Linux use the RK3308-CC as a development platform because it combines a real Linux environment (full kernel, Buildroot, mainline support) with audio-array interfaces at a price point accessible to students. The ROC form factor plus 6-mic array expansion makes lecture-hall demos reproducible, while Linux/Android SDK support lets the same board cover both firmware (real-time audio) and application-layer (intent recognition) coursework. The T-Chip / Seeed Studio open-source repositories provide schematics, Gerbers, and reference Buildroot configs that students can fork for capstone projects.

おすすめ製品の概要

ROC-RK3308B-CC-PLUS Same silicon, expanded RAM/Storage variant 使用用途: Smart Speaker / Voice Assistant Endpoint, AI Voice-Controlled Appliance (White Goods), Six-Microphone Far-Field Conferencing System, Industrial Voice-Controlled HMI, Smart Audio / Soundbar Processing Engine, Educational / Maker Voice-AI Development Board DSOM-050 SoM alternative for custom baseboards 使用用途: Smart Speaker / Voice Assistant Endpoint, Six-Microphone Far-Field Conferencing System, Linux IoT Gateway with On-Device Wake Word, Educational / Maker Voice-AI Development Board Radxa rCore-RK3308 Compact SoM for space-constrained chassis 使用用途: AI Voice-Controlled Appliance (White Goods), Linux IoT Gateway with On-Device Wake Word ROC-RK3399-PC Higher compute tier for vision+voice fusion HMI 使用用途: Industrial Voice-Controlled HMI, Smart Audio / Soundbar Processing Engine
What is the RK3308-CC?
The RK3308-CC (commercial designation ROC-RK3308-CC) is an AI+IoT open-source main board manufactured by Rockchip and distributed in the T-Chip / Firefly / Seeed Studio ecosystem. It integrates the Rockchip RK3308 Quad-Core Cortex-A35 application processor running up to 1.3 GHz with a high-performance audio CODEC and Voice Activity Detection (VAD) hardware block, making it a ready-to-program platform for smart speakers, voice-controlled appliances, and Linux IoT gateways.
What is the maximum CPU frequency of the RK3308-CC?
The integrated Rockchip RK3308 SoC runs its 64-bit Quad-Core Cortex-A35 cluster at up to 1.3 GHz. According to the Rockchip RK3308 datasheet V1.1, this is the maximum sustained frequency across all four cores; in typical always-listening voice applications the cores park at a low frequency with the hardware VAD handling wake-word detection to stay within a sub-1 W power envelope.
How much RAM and storage does the RK3308-CC support?
The RK3308-CC ships in three RAM configurations (256 MB, 512 MB, and 1 GB DDR3) and three eMMC storage options (4 GB, 8 GB, and 16 GB) sourced through the Seeed Studio / Firefly distribution channel. This range covers typical smart-audio designs from entry-level voice remotes (256 MB / 4 GB) up to Linux gateway builds running on-device speech recognition (1 GB / 16 GB).
Does the RK3308-CC support microphone arrays?
Yes - the RK3308-CC supports far-field microphone arrays via its PDM/I2S interfaces and can be configured with the six-microphone array expansion board. Mouser documentation for the part confirms support for boards configured with 6 digital MEMS microphones plus 12 tri-color LEDs and 5 keys, satisfying the BOM for far-field smart-speaker reference designs.
Where can I buy the RK3308-CC?
The RK3308-CC is available for purchase from Seeed Studio, Firefly Store, Mouser Electronics, and Distrelec (Distrelec product number 102110237). Seeed Studio offers the bare main board; Mouser / Distrelec carry the same SKU with full traceability documentation; pricing as of 2026-10-15 starts at approximately $41.90 in single-unit quantities at the Seeed Studio Web store.
What is the price of the RK3308-CC?
The RK3308-CC street price is approximately $41.90 per unit in single-piece quantities, with tier breaks at $38.50 (10-piece), $34.20 (100-piece), $30.10 (500-piece), and $26.80 (1000-piece) as of 2026-10-15. The 6-mic array expansion board and PoE add-on board are sold separately; check the Seeed Studio Web store for current authorized distributor pricing and active promotional bundles.
What is the lead time for the RK3308-CC?
Standard lead time for the RK3308-CC is in-stock at Seeed Studio with 3-7 business day delivery to most countries, and 2-4 weeks from Mouser and Distrelec depending on regional warehouse selection as of 2026-10-15. Volume orders above 1000 pieces should be quoted directly to Seeed Studio / Firefly for production scheduling.
Is the RK3308-CC in stock at authorized distributors?
Yes - as of 2026-10-15 the RK3308-CC is reported in stock on the Seeed Studio Web store at single-unit quantities and on Distrelec under part number 102110237. Mouser listing status should be confirmed at the time of order since their stock of open-source SBCs rotates frequently with allocation events.
What is the difference between the RK3308-CC and the ROC-RK3308B-CC-PLUS?
The RK3308-CC uses the base Rockchip RK3308 silicon and ships with the standard 60 mm x 45 mm ROC form factor, while the ROC-RK3308B-CC-PLUS uses the RK3308B variant with expanded RAM and storage options and additional onboard peripherals per Firefly documentation. Both share the same Cortex-A35 quad-core architecture and software SDK, so firmware is largely portable between the two boards.
Where can I download the RK3308 datasheet?
The official Rockchip RK3308 datasheet V1.1 is hosted as a PDF on rockchip.fr (https://rockchip.fr/RK3308%20datasheet%20V1.1.pdf) and is also mirrored at datasheets.com and datasheet4u.com. The Firefly wiki (wiki.t-firefly.com/en/ROC-RK3308-CC/) provides the board-level manual with the SoC datasheet cross-references.
What are the key specifications of the RK3308-CC that engineers should know?
The RK3308-CC integrates a 64-bit Quad-Core Cortex-A35 application processor at up to 1.3 GHz, a hardware VAD engine, a high-performance stereo CODEC, PDM/I2S microphone-array interfaces supporting up to 6 digital mics, DDR3 RAM up to 1 GB, eMMC up to 16 GB, gigabit Ethernet, 2.4 GHz Wi-Fi, Bluetooth 4.2, and a ROC form-factor pinout exposing SDIO, SPI, I2C, and UART - summarized from the Rockchip RK3308 datasheet V1.1 and Seeed Studio hardware documentation.
Can I replace an RK3308-CC with another board?
There is no single drop-in replacement for the RK3308-CC because it is a complete ROC form-factor main board, not a bare IC; however, the Radxa rCore-RK3308 SoM (35 mm x 35 mm stamp form factor) and the Dusun DSOM-050 (DK-SOM-050 form factor) both use the same RK3308/RK3308B silicon and share the upstream Linux kernel support, making them near drop-in alternatives for products where the ROC pinout is not a hard constraint. Verify memory, storage, and connectivity requirements before substituting.
What is the best Rockchip alternative for the RK3308-CC?
The closest same-brand (Rockchip) alternative in the same Quad-Core Cortex-A35 generation is the ROC-RK3308B-CC-PLUS, which uses the RK3308B die revision with expanded RAM/storage options while keeping the 60 mm x 45 mm ROC form factor. For higher compute headroom in the same software family, the Rockchip RV1126 SoM and Rockchip RK3562 SoM represent generation upgrades that are not pin-compatible but share the Linux SDK and Buildroot workflow.
Does the RK3308-CC support PoE?
Yes - the RK3308-CC supports Power over Ethernet through the optional PoE expansion board listed in the Firefly / Seeed Studio accessories catalog, which stacks onto the main board's headers. With PoE plus the 6-microphone array expansion, a single Ethernet drop can deliver both data and power to a far-field voice capture node, simplifying ceiling-mount installations.

エンジニアリング参考データ: RK3308-CC — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the RK3308-CC when designing a smart-audio or voice-AI product that needs always-listening wake word with sub-1 W standby, six-microphone far-field array support, and a Linux software ecosystem for on-device speech recognition. Pick the ROC-RK3308B-CC-PLUS when you need the same silicon but with larger eMMC and more RAM for premium audio SKUs. Pick the Radxa rCore-RK3308 when your enclosure requires a 35 mm x 35 mm stamp SoM rather than a full main board, and you are willing to design a custom carrier. Move to the ROC-RK3399-PC only when you need Cortex-A72 compute headroom for on-device deep-learning inference and can drop the hardware VAD advantage. Confirm Wi-Fi/BT module SKU and storage size at order time since these vary across distributors.

代替品との比較

パラメータ この製品 ROC-RK3308B-CC-PLUS Radxa rCore-RK3308 DSOM-050 ROC-RK3399-PC
Brand Rockchip (T-Chip / Seeed Studio main board) Rockchip (Firefly main board) Radxa (SoM) Dusun IoT (SoM) Rockchip (main board, higher tier)
Form Factor ROC 60 mm x 45 mm main board ROC 60 mm x 45 mm main board SoM 35 mm x 35 mm SoM stamp ROC 60 mm x 45 mm main board
SoC Rockchip RK3308 Quad-Core Cortex-A35 @ 1.3 GHz Rockchip RK3308B Quad-Core Cortex-A35 @ 1.3 GHz Rockchip RK3308B Quad-Core Cortex-A35 @ 1.3 GHz Rockchip RK3308 Quad-Core Cortex-A35 @ 1.3 GHz Rockchip RK3399 Dual A72 + Quad A53
Hardware VAD Yes (embedded Voice Activity Detection) Yes Yes Yes No (higher tier, VAD via software)
Maximum RAM 1 GB DDR3 1 GB DDR3 Up to 512 MB DDR3 (varies by SKU) DDR3 / DDR3L (varies by SKU) Up to 4 GB LPDDR4
Wi-Fi 2.4 GHz (on-board) 2.4 GHz (on-board) 2.4 GHz integrated Optional via carrier board 2.4/5 GHz (on-board)
Gigabit Ethernet Yes (RTL8211F) Yes Yes (on dev baseboard) Via carrier Yes (RTL8211F)
Integrated Audio CODEC Yes (high-performance stereo) Yes Yes Yes Yes
Target Application Smart audio / voice-AI / IoT gateways Same / expanded storage Embedded SoM / general IoT General IoT SoM Higher-tier SBC / multimedia

主な差別化要因

  • Integrated hardware VAD keeps standby power under 1 W with sub-100 ms wake latency (vs ROC-RK3399-PC)
  • Open-source ROC form factor with verified 6-mic array and PoE expansion ecosystem (vs Radxa rCore-RK3308)
  • Linux mainline kernel and Buildroot support out of the box (vs DSOM-050)

設計ノート

The RK3308-CC board power input is typically 5 V via the USB Type-C OTG port; budget at least 2 A peak to cover Wi-Fi transmit bursts plus the Cortex-A35 cores, since simultaneous Wi-Fi TX at 1 Mbps and full CPU load can pull 1.3-1.5 A steady with transient peaks exceeding 2 A. Use the optional PoE expansion board for ceiling-mount installations where AC power is impractical - the PoE input is 802.3af-compatible (Class 3, ~13 W budget). Estimated worst-case input current based on RK3308 SoC power + Wi-Fi radio + GbE PHY operation; consult the Firefly Wiki main board schematic for the exact regulator current limits before finalizing the BOM.

The RK3308-CC ships with passive cooling only and uses the ROC form factor's PCB copper pour as the primary heat spreader for the RK3308 SoC. In enclosed plastic enclosures with restricted airflow, add a small adhesive heatsink on the RK3308 package and ensure the enclosure vents allow natural convection; in fan-less metal chassis, derate ambient to 50 C maximum. The Cortex-A35 quad-core at 1.3 GHz dissipates well under 3 W continuous, so thermal failures are rare - they typically indicate an upstream regulator failure, not overheating. Verify with a temperature probe at SoC package after 30 minutes of stress test.

When integrating the RK3308-CC into a custom product, the on-board 6-mic array expansion connector carries PDM clock + data lines with strict length matching of ±0.5 mm - keep the routing from the expansion connector to the SoC as short as possible and avoid stubs. The GbE signals run to the RTL8211F PHY; the 1000BASE-T differential pairs must maintain 100 ohm differential impedance. Place the optional Wi-Fi/BT antenna at least 5 mm away from any metal enclosure wall and clear of the 6-mic array to avoid RF interference with the MEMS microphone clocks. These notes are estimated practical guidance derived from the ROC pinout and standard ROC form-factor reference designs.

Do not mix up the USB 2.0 OTG (device mode firmware flashing) and USB 2.0 HOST (Type-A peripheral) ports during bring-up - the OTG port is the one used for flashing via Rockchip's rkdevelop tool. The on-board RTL8723DS Bluetooth module is optional, so verify it is populated before relying on BLE provisioning. Finally, ensure the eMMC firmware image includes the correct device-tree blob for the on-board RTL8211F GbE PHY, otherwise the kernel will fall back to the internal MAC and the GbE port will be dead at first boot.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Unknown

RoHS compliance per Seeed Studio product page. Not AEC-Q100 qualified (consumer IoT board, not automotive). Lead-free manufacturing; halogen-free and conflict-mineral declarations not explicitly stated on verified sources.

データ検証日: 2026-10-15 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

RK3308-CC datasheet Rockchip RK3308 development board ROC-RK3308-CC specifications quad-core Cortex-A35 AIoT board RK3308 smart speaker reference design 6 microphone array board Rockchip RK3308 vs RK3399 RK3308-CC drop-in replacement buy RK3308-CC online where to download RK3308 datasheet PDF AIoT open source main board Rockchip RK3308-CC price stock Mouser hardware VAD voice activity detection Rockchip low power voice wake word Linux SBC Seeed Studio ROC-RK3308-CC distributor

関連部品&用語

Rockchip RK3308 RK3308B RK3308-CC ROC-RK3308-CC ROC-RK3308B-CC-PLUS Radxa rCore-RK3308 DSOM-050 Dusun IoT ARM Cortex-A35 64-bit ARM processor application processor Voice Activity Detection VAD audio CODEC PDM microphone interface I2S DDR3 eMMC Linux Buildroot Android ROC form factor USB 2.0 OTG RTL8211F RTL8723DS Wi-Fi 2.4 GHz Bluetooth 4.2 Gigabit Ethernet PoE TSMC 28 nm HPC RoHS smart speaker voice assistant AIoT single board computer SBC system on module SoM Mouser Electronics Seeed Studio Firefly
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