RM550V-GL - 5G Sub-6GHz M.2 Module 3.2Gbps | Quectel
部品番号: RM550V-GL ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $305 | $3,050.00 |
| 100 | $288 | $28,800.00 |
| 500 | $272 | $136,000.00 |
| 1,000 | $255 | $255,000.00 |
RM550V-GL 概要
An M.2 cellular module is a surface-mount wireless modem that plugs into a standardized M.2 socket on a host board, providing 5G/LTE connectivity without integrating the radio chain into the host design. Within the wireless product hierarchy, it sits under cellular modems, which in turn belong to RF modules and, more broadly, wireless communication components. The M.2 Key B connector standard allows designers to swap connectivity modules across product generations with minimal PCB redesign.
Key features of the RM550V-GL include compliance with 3GPP Release 17, support for both 5G NSA and SA operating modes, up to 3 downlink component carriers with 200 MHz NR bandwidth, and multi-mode fallback to LTE Cat 20 (DL) / Cat 18 (UL) and UMTS WCDMA. This ensures the module maintains connectivity in areas without 5G coverage, a critical requirement for global-market IoT deployments.
Technically, the module is built on the Qualcomm Snapdragon X72 platform, one of the most advanced 5G modem RF systems available, supporting global Sub-6 GHz bands. Control is performed via standard AT commands, simplifying integration with host processors running Linux, Android, or RTOS firmware. Community resources also document PCIe RC mode operation with custom firmware for advanced embedded routing applications.
Typical applications include industrial IoT gateways, eMBB (enhanced Mobile Broadband) devices such as 5G CPE routers, smart agriculture terminals, and remote monitoring systems, where its high throughput and low latency directly improve data-intensive workloads like video streaming and cloud telemetry.
A key design consideration is that the RM550V-GL is currently in the ES1 (Engineering Sample 1) phase according to community documentation, so production designs should plan firmware validation and anticipate commercial-release updates. Verify thermal design for sustained 3.2 Gbps throughput.
This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, providing unique engineering value for module selection and second-source planning.
ドロップイン代替品: RM550V-GL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
RM520N-GL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
RM530N-GL
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
RM521F-GL
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
RM500Q-GL
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
RM551E-GL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
RM550V-GL 仕様（メーカー公開）
| Product Type | 5G NR Sub-6 GHz M.2 Module |
| Form Factor | M.2 (Key B) |
| Dimensions | 30.0 x 52.0 x 2.3 mm |
| 3GPP Release | Release 17 |
| Modem Platform | Qualcomm X72 |
| 5G SA Peak Data Rate (DL) | 2.4 Gbps |
| 5G SA Peak Data Rate (UL) | 900 Mbps |
| 5G NSA Peak Data Rate (DL) | 3.2 Gbps |
| 5G NSA Peak Data Rate (UL) | 600 Mbps |
| Operating Modes | 5G NSA / 5G SA / LTE / WCDMA |
| LTE Fallback | LTE Cat 20 (DL) / Cat 18 (UL) |
| NR Bandwidth | Up to 200 MHz |
| Downlink Component Carriers | Up to 3 |
| Target Market | Global (Sub-6 GHz) |
| Control Interface | AT Commands |
| Target Applications | IoT / eMBB |
| Development Phase | ES1 (Engineering Sample 1) |
RM550V-GL インターフェースとコネクタ
RM550V-GL について、メーカーが公開しているインターフェース一覧はありません。コネクタとヘッダーの詳細については、メーカーのドキュメントを参照してください。
詳細は メーカー資料 をご参照ください（拡張ヘッダーのピン配置とコネクタのピン番号の詳細）。
主な用途
RM550V-GL の用途: 6 件s: 5G CPE Routers and eMBB Gateways, Industrial IoT Gateways, Smart Agriculture and Remote Monitoring, Automotive and Fleet Telematics, Embedded Networking and OpenWRT Routers, Video Surveillance and Security Backhaul.
5G CPE Routers and eMBB Gateways
The RM550V-GL fits 5G customer-premises equipment and enhanced Mobile Broadband gateways because its 3.2 Gbps NSA downlink and 2.4 Gbps SA downlink rival fiber-class wired broadband, while 3 downlink component carriers and 200 MHz NR bandwidth sustain high aggregate throughput. In a CPE design the module mounts on the M.2 Key B socket of the main board, connects to four external Sub-6 GHz antennas, and exposes data via USB or PCIe to the router SoC. The LTE Cat 20/Cat 18 fallback keeps the link alive where 5G coverage is absent, and Release 17 power features reduce idle consumption. Thermal design for sustained multi-gigabit transfer is the main consideration.
おすすめ
Industrial IoT Gateways
Industrial gateways aggregate sensor, PLC, and video telemetry and backhaul it to cloud platforms, and the RM550V-GL's combination of gigabit-class 5G throughput, global Sub-6 GHz band coverage, and standard AT command control makes it a strong fit. The M.2 Key B module mounts directly on the gateway PCB, allowing the same board design to serve multiple regions by swapping module variants. Its Release 17 feature set improves network slicing and power efficiency relevant to always-on industrial deployments. Because factory environments impose -40 to +85 C thermal demands in some cases, verify the module's operating temperature class in the preliminary datasheet before finalizing the enclosure design.
おすすめ
Smart Agriculture and Remote Monitoring
Remote agricultural and infrastructure monitoring sites often lack wired broadband, so the RM550V-GL's 5G Sub-6 GHz connectivity with LTE and WCDMA fallback provides reliable backhaul for camera feeds, weather stations, and soil-sensor networks. Peak rates of 2.4 Gbps DL / 900 Mbps UL (SA) support high-resolution imagery upload, while low idle power from Release 17 optimizations extends solar-battery budgets. The module is controlled via AT commands from a low-cost host MCU, and the 30.0 x 52.0 x 2.3 mm M.2 package fits compact weatherproof enclosures. Deployments should validate carrier band support per region given the global 'GL' variant's broad but not universal band list.
おすすめ
Automotive and Fleet Telematics
Fleet telematics units increasingly stream dashcam video and diagnostic data over cellular, and the RM550V-GL's 900 Mbps SA uplink and 3 downlink component carriers handle multi-camera uplink loads that saturate LTE modules. The M.2 Key B socket allows one telematics PCB to carry 4G or 5G SKUs, cutting development cost across product tiers as noted in Quectel's compatibility notes for the RM500Q, RM520N, and RM550V series. AT command control integrates easily with vehicle MCUs, and LTE Cat 20/Cat 18 fallback maintains connectivity outside 5G corridors. Automotive-grade qualification should be confirmed separately, as the ES1-phase module targets IoT/eMBB rather than AEC-Q100 applications.
おすすめ
Embedded Networking and OpenWRT Routers
Advanced embedded router platforms based on OpenWRT and PCIe RC mode benefit from the RM550V-GL's Qualcomm X72 platform. Community documentation (cellular-modem-wiki, QuecManager project) lists the RM550V-GL as supported in PCIe host mode with appropriate firmware, enabling native PCIe attachment to ARM-based routers instead of USB, which improves latency and throughput management. The standard M.2 Key B slot on many industrial SBCs and Wi-Fi routers accepts the module directly. Engineers should note the ES1-phase firmware caveats documented by the community and plan for iamromulan's RM550V-GL firmware where PCIe RC mode is required, and retest with commercial firmware at release.
おすすめ
Video Surveillance and Security Backhaul
Wireless security cameras and NVR sites require sustained uplink bandwidth for multi-stream 4K video, and the RM550V-GL's 900 Mbps SA uplink comfortably carries several simultaneous high-bitrate streams, while its 3.2 Gbps downlink supports cloud AI analytics ingest. Mounted in the NVR's M.2 Key B slot, the module replaces fixed-line backhaul for construction sites, temporary events, and rural perimeters where cabling is impractical. WCDMA and LTE Cat 20/Cat 18 fallback keep streams alive during 5G outages. Designers should provision antenna placement for Sub-6 GHz diversity and budget thermal headroom, as sustained uplink load raises module temperature in sealed enclosures.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: RM550V-GL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | RM520N-GL | RM530N-GL | RM521F-GL | RM500Q-GL | RM551E-GL |
|---|---|---|---|---|---|---|
| Package | M.2 (Key B) 30.0 x 52.0 x 2.3 mm | M.2 (Key B) 30.0 x 52.0 x 2.3 mm - same | M.2 (Key B) 30.0 x 52.0 x 2.3 mm - same | M.2 (Key B) 30.0 x 52.0 x 2.3 mm - same | M.2 (Key B) 30.0 x 52.0 x 2.3 mm - same | M.2 (Key B) 30.0 x 52.0 x 2.3 mm - same |
| Brand | Quectel | Quectel | Quectel | Quectel | Quectel | Quectel |
| 3GPP Release | Release 17 | Release 16 | Release 15/16 | Release 16 | Release 15 | Release 17 |
| Modem Platform | Qualcomm X72 | Qualcomm X62/X65 class | Qualcomm X62 | Qualcomm X62/X65 class | Qualcomm X55 | Qualcomm X72 |
| LTE Fallback | LTE Cat 20 (DL) / Cat 18 (UL) | LTE Cat 20 / Cat 18 class | LTE Cat 20 / Cat 18 class | LTE Cat 20 / Cat 18 class | LTE Cat 19 class | LTE Cat 20 / Cat 18 class |
| Lifecycle Phase | ES1 (Engineering Sample 1) | Mass production | Mass production | Mass production | Mass production | Preliminary (same doc as RM550V-GL) |
| Target Market | Global (Sub-6 GHz) | Global | Global | Global | Global | Global (variant-specific) |
主な差別化要因
- Latest-generation Qualcomm X72 modem platform （vs RM520N-GL)
- Highest SA uplink in the M.2 family reviewed （vs RM500Q-GL)
- Trade-off: pre-production maturity （vs RM530N-GL)
設計ノート
The RM550V-GL is documented by the community cellular-modem-wiki as being in ES1 (Engineering Sample 1) phase. This means firmware, band certifications, and AT command behavior may change before commercial release. Production designs should isolate the module on the M.2 socket (enabling later module swaps), avoid locking carrier certifications to ES1 test results, and subscribe to Quectel release notes. PCIe RC mode currently requires specific community firmware per QuecManager project notes; design the host to support USB 3.x as a fallback data path.
Sustained multi-gigabit operation (up to 3.2 Gbps NSA DL) generates significant heat in the 30.0 x 52.0 x 2.3 mm M.2 package. Estimated: at typical 5G active power of 3-5 W for X72-class modems, a sealed CPE enclosure without airflow can push the module surface well above 60 C. Attach a thermal pad from the module's shield can to the enclosure or a heatsink, follow Quectel's M.2 hardware design guide for keep-out and airflow, and verify thermal shutdown behavior at maximum throughput in the worst-case ambient temperature.
M.2 Key B modules use four antenna ports (ANT0-ANT3) for 4x4 Sub-6 GHz MIMO. Route each antenna line as 50-ohm controlled impedance with the module's reference design, and keep RF traces away from switching regulators and USB 3.x differential pairs to avoid desense. Provide at least 0.4 mm clearance under the module and honor the M.2 socket keep-out for component height. Place the USIM (if using the external SIM interface from the M.2 pins) with ESD protection close to the connector.
コンプライアンス情報
Compliance data not present in the provided web sources; confirm via the Quectel preliminary specification document and Quectel's official compliance declarations. The module targets IoT/eMBB, not automotive AEC-Q100.
