RTAX250S-1LG624V - 250K-Gate Rad-Tolerant FPGA 1.5V | Microchip
部品番号: RTAX250S-1LG624V ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
RTAX250S-1LG624V 概要
A radiation-tolerant FPGA is a programmable logic device qualified for space-flight environments, where exposure to heavy ions and protons causes single-event upsets (SEUs) in commercial silicon. The RTAX-S family sits at the top of the programmable logic hierarchy for spacecraft: FPGA -> radiation-tolerant FPGA -> space electronics. Unlike SRAM-based FPGAs, the RTAX-S family uses antifuse programmability, giving a true single-chip form factor, live-at-power-up operation, and inherent resistance to configuration upset.
Key features include 250K equivalent gates, 4224 logic cells, low static power consumption, and single-chip operation without external boot PROM. The -1 speed grade covers standard space-flight performance, and the V-suffix leaded ceramic column package supports reliable solder attachment on aerospace PCBs.
Architecturally, the RTAX250S builds on Actel's Axcelerator fabric with Sea-of-Modules logic, embedded SRAM blocks, and clock-management resources, providing deterministic timing for flight software-defined logic. Designs are developed with Microchip (Microsemi/Lattice-style) Libero design software and can be prototyped on commercial Axcelerator devices per application note AC170.
Typical applications include satellite payload processing, spacecraft bus control, launch-vehicle avionics, and instrumentation for deep-space missions, where SEU tolerance and live-at-power-up behavior are mandatory.
Design consideration: because the LG624 ceramic package uses columns rather than balls, follow the manufacturer's reflow profile for column grid arrays and verify board-level outgassing requirements.
This page synthesizes distributor availability, drop-in alternatives, and engineering design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: RTAX250S-1LG624V — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: RTAX250S-1LG624V （同一形状・フットプリント） — 相違点: Package, Configuration, Equivalent System Gates, Radiation Tolerance, Programming Technology.
クイック比較ツール — 並列比較する代替部品を選択:
RTAX250S-LG624V
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX250S-1LG624B
✅ ドロップイン✓ 在庫あり
$2020 / 個
データシートを見る →RTAX250S-CG624E
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX2000S-1LG624V
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX2000SL-1LG624V
✅ ドロップイン✓ 在庫あり
$9600 / 個
データシートを見る →RTAX250S-1LG624V 最大定格＆電気的特性
| Family | RTAX-S Radiation-Tolerant FPGA |
| Equivalent Gate Count | 250000 gates |
| Configurable Logic Blocks (CLBs) | 2816 |
| Logic Cells | 4224 |
| I/Os | 248 |
| Core Supply Voltage | 1.5 V nominal |
| Speed Grade | -1 |
| パッケージ | CGA624 (LG624), 624-column ceramic column grid array |
| Package Suffix | V (leaded column finish) |
| 動作温度 | -55C to +125C |
| Technology | CMOS, antifuse programmable |
| Configuration | Live at power-up, single chip, no boot PROM |
| 実装タイプ | Surface Mount |
| ライフサイクル状態 | Active |
RTAX250S-1LG624V v (leaded column finish) ピン配置ガイド
RTAX250S-1LG624V (v (leaded column finish) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: RTAX250S-1LG624V.
詳細は データシート をご参照ください。
主な用途
RTAX250S-1LG624V の用途: 6 件s: Satellite Payload Data Processing, Spacecraft Bus Control, Launch Vehicle Avionics, Deep-Space Instrument Interfacing, Prototyping with Commercial Axcelerator Devices, Radiation-Tolerant Signal Processing Modules.
Satellite Payload Data Processing
The RTAX250S-1LG624V fits satellite payload processing chains where 250K gates of deterministic, radiation-tolerant logic handle sensor data formatting, compression, and telemetry framing. Its antifuse fabric is live at power-up, eliminating configuration latency and the SEU-driven configuration-scrubbing overhead demanded by SRAM FPGAs, while the -55C to +125C rating covers orbital thermal cycles. Deployed between payload sensors and downlink modules on a 1.5V core rail, it provides glue logic, FIFOs, and protocol bridging with low static power, a critical budget line on power-limited smallsat and ESPA-class buses. Timing is fixed after Libero place-and-route, simplifying flight-design sign-off.
おすすめ
Spacecraft Bus Control
For spacecraft command and data handling (C&DH), the RTAX250S-1LG624V implements MIL-STD-style bus interfaces, watch-dog logic, mode control, and power-switch sequencing in a single live-at-power-up chip. The 248 user I/Os in the CGA624 package connect CCSDS-format UARTs, discrete commands, and housekeeping ADCs, while 2816 CLBs absorb control-plane state machines that must survive heavy-ion hits through triple-module redundancy coded at the RTL level. Its 1.5V core keeps static power low during eclipse operations, and the ceramic CGA package withstands launch vibration and thermal cycling from -55C to +125C without solder fatigue typical of plastic packages.
おすすめ
Launch Vehicle Avionics
Launch avionics demand logic that is functional within microseconds of power application; the RTAX250S-1LG624V's antifuse configuration is hard-wired, making it live at power-up with no boot PROM and no configuration-readback vulnerability. The 4224 logic cells implement flight-event sequencing, redundant-voting circuits, and telemetry encoders, while 248 I/Os interface inertial sensors and range-safety discretes. The -55C to +125C operating range and ceramic column package suit ascent vibration and aerothermal gradients. Because the fabric is not SRAM-based, configuration upsets are not a failure mode, reducing fault-management complexity in safety-critical flight software timelines.
おすすめ
Deep-Space Instrument Interfacing
Science instruments on deep-space probes use the RTAX250S-1LG624V to concentrate detector readout, implement CRC-protected data paths, and buffer frames before downlink. The 250K-gate budget accommodates ADC framing, digital filtering, and compression pre-processing, and the deterministic antifuse timing supports fixed-latency acquisition windows required for interferometric payloads. At 1.5V nominal core with low static draw, it respects the strict energy budgets of radioisotope-powered missions, and the -55C to +125C rating, combined with RTAX-S radiation tolerance, sustains multi-year operation through Jupiter-scale radiation environments when designers apply TMR and EDAC as specified in Microchip flight-design guidance.
おすすめ
Prototyping with Commercial Axcelerator Devices
Microchip application note AC170 defines the sanctioned path for prototyping RTAX250S designs: the Libero flow targets the equivalent commercial Axcelerator device, and Microsemi extender boards map the commercial package footprint to the RTAX-S CGA624 land pattern. Engineers validate RTL, timing constraints, and I/O assignments on fast-turn commercial silicon before committing flight units, which matters because antifuse FPGAs are one-time programmable and cannot be reworked. This workflow cuts flight-silicon respins and derisks timing closure at the -1 speed grade, then the identical design database is recompiled for the RTAX250S-1LG624V with flight-library cells.
おすすめ
Radiation-Tolerant Signal Processing Modules
Spaceborne software-defined radio and imaging modules use the RTAX250S-1LG624V as the baseband engine: its embedded resources implement filters, numerically controlled oscillators, and channel framing within 250K gates, feeding DAC/ADC front ends across the 248 I/O bank. The high PSRR of the surrounding 1.5V space power chain plus the FPGA's low static power keep the noise floor acceptable for sensitive receivers. The CGA624 ceramic package supports hermetic module assembly, and single-chip live-at-power-up operation removes configuration storage from the reliability chain. Designers typically pair it with rad-tolerant memory and regulators from Microchip's space portfolio.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: RTAX250S-1LG624V — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | RTAX250S-LG624V | RTAX250S-1LG624B | RTAX250S-CG624E | RTAX2000S-1LG624V | RTAX2000SL-1LG624V |
|---|---|---|---|---|---|---|
| Package | CGA624 (LG624), 624-column ceramic | CGA624 (LG624) - same | CGA624 (LG624) - same | CGA624 (CG624) - same footprint | CGA624 (LG624) - same | CGA624 (LG624) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Speed Grade | -1 | standard (no -1 suffix) | -1 | standard (no -1 suffix) | -1 | -1 |
| Architecture / Family | RTAX-S antifuse, rad-tolerant, live at power-up | RTAX-S antifuse | RTAX-S antifuse | RTAX-S antifuse | RTAX-S antifuse (RTAX2000S family) | RTAX-SL enhanced antifuse |
主な差別化要因
- Antifuse, live-at-power-up fabric （vs RTAX2000S-1LG624V)
- Same die availability across flow suffixes （vs RTAX250S-1LG624B)
- Lower-density alternative to RTAX-SL family （vs RTAX250SL-CG624B)
設計ノート
RTAX-S antifuse FPGAs are one-time programmable: unlike SRAM FPGAs there is no rework path after programming, so complete RTL code review, constrained-timing closure, and simulation sign-off in Libero before submitting flight units. Use application note AC170 to validate the design on a commercial Axcelerator device with Microsemi extender boards mapped to the CGA624 footprint before burning flight silicon. Also confirm the exact screening/flow suffix (V vs B vs E) required by your program's parts-screening specification when ordering, since these variants are not interchangeable on flight programs.
The 1.5V core supply must meet the RTAX-S datasheet power-up sequencing and ramp-rate requirements; because the device is live at power-up, I/O pin states during rail ramp should be reviewed against attached circuitry to prevent unintended actuation of flight hardware. Estimated: budget core current per the datasheet power estimator output for your utilization (not a fixed datasheet figure), and include margin for -55C cold-start conditions where current draw and timing shift. Decouple the 1.5V rail and I/O bank rails with low-ESR ceramics placed at the CGA624 via field per the datasheet layout guidance.
The LG624 ceramic column grid array uses solder columns, not balls: follow the manufacturer CGA reflow profile and support layout rules, and verify column coplanarity handling in your assembly process. Provide a sufficient via array under the CGA624 land pattern for the 1.5V and I/O bank returns, and follow the datasheet signal-integrity guidance for 248 I/Os in flight wiring harnesses. For SEU mitigation, implement triple-module redundancy and EDAC at the RTL level as recommended in Microchip flight design guidance, since antifuse fabric tolerates upsets in registers but not logic upsets without architectural mitigation.
コンプライアンス情報
Space-grade ceramic-package components are typically outside commercial RoHS/REACH scope; verify per-part compliance documentation from Microchip for your program. AEC-Q100 is not applicable to this space-qualified product family.
