RTAX2000SL-1CGS624V - 2M-Gate Rad-Tolerant FPGA | Actel/Microchip
部品番号: RTAX2000SL-1CGS624V ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
RTAX2000SL-1CGS624V 概要
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation and single-event effects of the space environment, where commercial silicon would suffer latch-up, gate rupture, or bit-flip corruption. RTAX-S/SL devices sit at the top of the space FPGA hierarchy: FPGA -> radiation-tolerant FPGA -> space-flight digital logic IC -> semiconductor.
Key features include highly reliable nonvolatile antifuse technology that is live-at-power-up with no configuration boot time, true single-chip operation eliminating external configuration flash (a security and board-area advantage), and embedded SRAM blocks with built-in FIFO control and optional EDAC protection for memory reliability. Derived from the commercial Axcelerator family, the RTAX-SL architecture delivers high-performance system-level features such as segmentable clock regions and chip-wide highway routing.
Technically, the device is fabricated in CMOS with 21,504 CLB cells per Microchip USA data for the RTAX2000 series, supporting single-ended and differential I/O standards at 2.5V/3.3V banks and a 1.5V core supply. The S suffix on CGS624V denotes a space-grade screening flow, with the V suffix marking the qualification level and -1 the speed grade.
Typical applications include satellite payload data processing, spacecraft command and telemetry control, remote sensing image handling, launch-vehicle avionics, and downlink/signal-chain glue logic in low-Earth-orbit and deep-space missions where SEU immunity and TID tolerance are mission-critical.
Design consideration: RTAX-S/SL devices are one-time-programmable, so designers must prototype against reprogrammable equivalents and reserve I/O and capacity margin before committing the flight unit.
This page synthesizes distributor listings, drop-in same-footprint family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
ドロップイン代替品: RTAX2000SL-1CGS624V — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: RTAX2000SL-1CGS624V （同一形状・フットプリント） — 相違点: Package, Configuration, Technology, Radiation Tolerance, Embedded Memory.
クイック比較ツール — 並列比較する代替部品を選択:
RTAX2000SL-CGS624E
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX2000SL-1LG624V
✅ ドロップイン✓ 在庫あり
$9600 / 個
データシートを見る →RTAX2000S-1CG624PROTO
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX2000S-1CG624PROTO
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX250S-LG624V
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX250SL-CG624B
✅ ドロップイン✓ 在庫あり
$3950 / 個
データシートを見る →RTAX250S-1LG624B
✅ ドロップイン✓ 在庫あり
$2020 / 個
データシートを見る →RTAX2000SL-1CGS624V 最大定格＆電気的特性
| Equivalent System Gates | 2000000 |
| Logic Cells (CLBs) | 21504 |
| User I/Os (max, package dependent) | Up to 684 |
| Embedded Memory | Up to 540 kbits with optional EDAC |
| Total Ionizing Dose (TID) | 300 krad (functional), 200 krad (parametric) |
| SEU Rate | Less than 1E-10 errors per bit-day |
| Technology | Digital CMOS, antifuse nonvolatile |
| パッケージ | 624-ball ceramic CGA (CGS624) |
| Speed Grade | -1 |
| Quality / Screening Suffix | S (space flow), V suffix qualification level |
| Configuration | One-time programmable (OTP), live at power-up, single chip |
| Embedded SRAM Features | Built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| 実装タイプ | Surface Mount |
RTAX2000SL-1CGS624V 624-ball ceramic cga (cgs624) ピン配置ガイド
RTAX2000SL-1CGS624V (624-ball ceramic cga (cgs624) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: RTAX2000SL-1CGS624V.
詳細は データシート をご参照ください。
主な用途
RTAX2000SL-1CGS624V の用途: 6 件s: Satellite Payload Data Processing, Spacecraft Command and Telemetry Control, Remote Sensing and Imaging Instrumentation, Launch Vehicle Avionics, Deep-Space Probe Digital Logic, Space Communication and Signal Chains.
Satellite Payload Data Processing
The RTAX2000SL-1CGS624V fits payload data processing because its 2,000,000 system gates and 540 kbits of embedded SRAM with optional EDAC absorb DSP pipelines, packetizers, and compression engines that commercial FPGAs could perform only without radiation immunity. Its SEU rate below 1E-10 errors per bit-day means configuration and flip-flop corruption is effectively eliminated without heavy triple-module redundancy on the SL fabric, freeing gate capacity for useful logic. In a typical payload chain the device sits between sensor front ends and the telemetry downlink, implementing DDR-style data capture, framing, and EDAC-protected buffering in one chip, cutting board area and interfaces. Because the antifuse fabric is live at power-up, payload bring-up begins immediately after switch-on with no configuration delay, which matters during eclipse-powered operations.
おすすめ
Spacecraft Command and Telemetry Control
Spacecraft onboard control benefits directly from the RTAX2000SL-1CGS624V's live-at-power-up antifuse operation: housekeeping and safety logic begins executing the instant power is applied, with no boot sequence that could be interrupted by a single-event functional interrupt. With up to 684 user I/Os in the CGS624 ceramic package, one device consolidates UART/MIL-STD-style telemetry links, discrete command interfaces, and watchdog functions that would otherwise need multiple rad-tolerant ASSPs. The 300 krad functional TID tolerance covers multi-year LEO control-node missions, and the -1 speed grade easily meets tens-of-MHz command loops. Designers should implement EDAC on the embedded SRAM blocks used for telemetry buffering and use segmentable clock regions to isolate safety-critical domains from payload clocking, improving fault containment in the control path.
おすすめ
Remote Sensing and Imaging Instrumentation
Earth-observation and scientific instruments require deterministic, radiation-tolerant digital back ends, and the RTAX2000SL-1CGS624V addresses this with 2M gates of CMOS fabric and 540 kbits of EDAC-capable embedded memory suitable for line buffers and FIFO stages feeding image compression or lossless packetization. The built-in FIFO control logic in the embedded SRAM reduces glue logic and simplifies timing closure for high-rate pixel streams. The chip-wide highway routing and segmentable clocks let designers dedicate a clean clock region to the sensor readout path while image processing runs in adjacent regions, easing signal-integrity and jitter management. The 624-ball ceramic CGA provides the mechanical robustness and thermal path needed for launch vibration and on-orbit thermal cycling that would challenge plastic-packaged commercial FPGAs.
おすすめ
Launch Vehicle Avionics
Launch environments combine intense vibration, high dose-rate events during ascent through radiation belts, and short but unforgiving mission timelines. The RTAX2000SL-1CGS624V's ceramic column grid array package withstands launch mechanical stress, while antifuse configuration cannot lose its bitstream under shock, and SEU rates below 1E-10 errors per bit-day protect guidance, sequencing, and flight-termination interface logic. The 200 krad parametric and 300 krad functional TID tolerance provides margin for brief but intense exposure profiles typical of ascent trajectories. Designers typically use the device for redundant-comparator voting, telemetry encoding, and safety interlocks where determinism is mandatory. A key consideration is one-time programmability: the flight unit must be fully verified in simulation and on prototyping hardware, such as the Aldec/Microchip adaptor flow, before programming.
おすすめ
Deep-Space Probe Digital Logic
Deep-space missions encounter cumulative TID levels and galactic cosmic ray flux far beyond LEO conditions, making the RTAX2000SL-1CGS624V's combination of 300 krad functional TID tolerance and sub-1E-10 SEU-per-bit-day antifuse configuration appropriate for probe subsystems such as instrument controllers, autonomy engines, and communication framing logic. Because solar-powered reconfiguration is impossible at interplanetary distances, the inability of antifuse configuration to corrupt is a decisive advantage over SRAM-based space FPGAs that rely on external configuration scrubbing. The 2M-gate capacity supports science-data preprocessing that reduces downlink bandwidth requirements, directly saving mission communications power. Thermal design should account for the ceramic package's junction-to-case path, bonding the CGA to a radiative thermal chassis for reliable heat removal across the mission.
おすすめ
Space Communication and Signal Chains
Transmitter and receiver baseband processing is a natural fit for the RTAX2000SL-1CGS624V: the 2M-gate fabric implements modulators, scramblers, Viterbi or LDPC-adjacent framing functions, and CCSDS-compliant packet assembly, while the up-to-684 I/Os interface ADC/DAC converters and the RF control chain at 2.5V/3.3V bank levels. Segmentable clock regions allow the modulation clock domain to be isolated from housekeeping logic, simplifying jitter budgets on the DAC interface. The 540 kbit embedded SRAM with FIFO control supports elastic buffering between the baseband and formatter clocks without external memory, improving reliability in vacuum environments where commercial DDR memories are impractical. Designers should budget for the -1 speed grade timing when planning symbol rates, and use the EDAC option on any SRAM storing link-state tables.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: RTAX2000SL-1CGS624V — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | RTAX2000SL-CGS624E | RTAX2000SL-1LG624V | RTAX250SL-CG624B |
|---|---|---|---|---|
| Package | 624-ball ceramic CGA (CGS624) | CG624 - same | LG624 - same 624-ball footprint | CG624 - same |
| Brand | Actel (Microchip Technology) | Microchip Technology | Microchip Technology | Microchip Technology |
| Screening / Qualification | S / V (space flow) | E flow | V flow | B flow |
| SEU-Hardened Fabric | Yes (SL) | Yes (SL) | Yes (SL) | Yes (SL, RTAX250 family) |
主な差別化要因
- 2M-gate SL fabric with SEU-hardened flip-flops （vs RTAX2000S-1CG624PROTO)
- Higher flight screening flow （vs RTAX2000SL-CGS624E)
- Double the logic capacity of RTAX250SL in the same footprint （vs RTAX250SL-CG624B)
設計ノート
RTAX-S/SL devices are one-time programmable: the antifuse fabric cannot be reconfigured after programming. Use the Microchip/Aldec prototyping flow (ProASIC3E-based adaptor board with EDIF netlist and pinout converter, per the RTAX-S/SL datasheet prototyping application note) to validate the complete design before committing a flight unit. Reserve 20-30% I/O and logic margin in the 2M-gate device because late payload changes cannot be absorbed after the flight part is programmed.
RTAX2000SL uses a 1.5V-class core supply with separate I/O bank rails; verify exact rail values and sequencing against the RTAX-S/SL datasheet power tables for the CG624 package before designing the power tree. Since the device is live at power-up, ensure input decoupling and inrush control allow clean rail ramp so the always-on configuration and I/O logic initializes correctly at the moment of battery or solar-array switch-on.
The 624-ball ceramic column grid array requires precise land pattern per the datasheet CG624 package drawing and controlled reflow due to the solder-column construction. Provide a solid ground plane under the device, dedicate thermal vias or a heatslug interface to the ceramic body per Microchip's space hardware guidelines, and assign I/O banks in Libero so that 2.5V/3.3V bank voltages match your interface standards before routing.
コンプライアンス情報
Compliance data not stated in retrieved distributor snippets for this space-grade ceramic-package part; obtain Microchip environmental certificates for the exact MPN. Space-grade ceramic CGA parts often carry RoHS exemptions for high-lead solder columns.
