SAFXE167F96F66LAC - 16-Bit XE166 MCU, 768KB Flash, 66MHz | Infineon
部品番号: SAFXE167F96F66LAC ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 500 | $24.4 | $12,200.00 |
| 1,000 | $21.1 | $21,100.00 |
SAFXE167F96F66LAC 概要
A microcontroller (MCU) is an integrated circuit that combines a CPU, memory (Flash/RAM), peripherals, and I/O on a single die to execute embedded control firmware. The XE166 family targets real-time industrial applications — motor control, power conversion, automotive body and chassis, and industrial automation. The 'Compact Line' subset of XE166 balances deterministic interrupt latency with peripherals aimed at field-oriented control (FOC) for motors.
Key features include 768 KB Flash for application code plus parameters, 80 KB SRAM for data and stack, a 66 MHz C166SV2 core delivering up to 66 MIPS with single-cycle MAC, an integrated A/D converter system with up to 16 channels, and on-chip oscillator/PLL supporting 3.0 V to 5.5 V single-supply operation. The part is qualified to industrial temperature range (-40 °C to +125 °C) and offers robust EMC for harsh environments.
Architecturally, the SAFXE167F96F66LAC implements a five-stage pipeline with hardware multiply-accumulate (MAC) units optimized for high-rate signal processing loops such as Park/Clarke transforms used in motor FOC. The peripheral co-processor (PCP) offloads DMA-style data movement from the core, while the peripheral control processor manages CAN/USART transactions without CPU intervention. The 1 MByte linear address space is mapped across the Flash and SRAM with wait-state configuration on the Flash interface for deterministic instruction fetch at full clock rate.
Typical applications include industrial motor drives (PMSM, BLDC, induction), servo controllers, renewable-energy inverters (solar, wind), automotive body and chassis ECUs, and industrial sensor/IoT edge nodes. The deterministic C166SV2 core is frequently paired with Infineon’s TLE9180 gate driver and Eice-ICE debugger for field-oriented motor control.
When designing, ensure the 5 V rail is decoupled locally with 100 nF plus 4.7 µF ceramic and follow Infineon’s PCB layout for the LQFP-EP exposed pad — the EP must be soldered to a 1 sq-inch ground plane for thermal relief at full peripheral load. Confirm Flash endurance (typ. 100 k cycles per sector) in your firmware update strategy.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet — a faster engineering reference than re-reading the 122-page XE167 user manual.
ドロップイン代替品: SAFXE167F96F66LAC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
SAF-XE167H-96F66LABES
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAF-XE167F-48F66LAC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XE167HM72F80LAAFXUMA1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAF-XE164HN-24F80LAA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAF-XE167G-48F66LAC
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
SAFXE167F96F66LAC 最大定格＆電気的特性
| Core Processor | C166SV2 (5-stage pipeline + MAC) |
| Core Size | 16-bit |
| CPU Clock Speed | 66 MHz |
| Instruction Set | C166 V2 + DSP-style MAC, CISC/RISC extensions |
| Program Flash | 768 KB |
| Data SRAM | 80 KB |
| Supply Voltage (VCC) | 3.0 V to 5.5 V (5 V nominal) |
| I/O Ports | 28 |
| Package Type | LQFP-144 with exposed pad (LQFP-EP, 20 x 20 mm) |
| 実装タイプ | Surface Mount (Gull-wing, HLFQFP) |
| 動作温度 | -40 °C to +125 °C (industrial) |
| Communication Interfaces | CAN, 2x USART, SSC (SPI-compatible), I2C, EBI/EMI |
| ADC | Up to 16 channels, 10-bit (data per XE167 family) |
| Timers | GPT12 capture/compare + PWM units |
| RoHS / Lead-free | Compliant (green plastic, lead-free finishes) |
SAFXE167F96F66LAC lqfp-144 with exposed pad (lqfp-ep, 20 x 20 mm) ピン配置ガイド
SAFXE167F96F66LAC (lqfp-144 with exposed pad (lqfp-ep, 20 x 20 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: SAFXE167F96F66LAC.
詳細は データシート をご参照ください。
主な用途
SAFXE167F96F66LAC の用途: 6 件s: Industrial Motor Control (FOC), Servo Drive & Robotics, Solar / Renewable Inverter Control, Automotive Body & Chassis ECU, Industrial PLC & I/O Module, Smart Sensor Hub / IoT Edge.
Industrial Motor Control (FOC)
The Infineon SAFXE167F96F66LAC fits field-oriented control of PMSM, BLDC and AC induction motors because its C166SV2 core executes single-cycle multiply-accumulate and Park/Clarke transforms while an integrated PCP offloads ADC conversions and PWM updates. At 66 MHz it completes one fast-loop iteration (sample, transform, modulate, update PWM) in well under 10 µs, and the 16 ADC channels handle three-phase current plus DC-bus sensing. The 768 KB Flash stores vector-control firmware plus drive parameters, while 80 KB SRAM absorbs per-cycle work buffers. Pair it with Infineon Eice-ICE for in-circuit debug during motor bring-up, and use the exposed pad as a thermal relief path at 1 W dissipation.
おすすめ
Servo Drive & Robotics
For multi-axis servo drives the SAFXE167F96F66LAC serves as either the main controller or per-axis processor. Its 5 V tolerance and -40 to +125 °C industrial qualification let it sit close to IGBT modules on the back panel. With 80 KB SRAM, multiple CAN nodes can be polled per millisecond; the 768 KB Flash fits real-time EtherCAT or CANopen stacks with margin for trajectory generator code. The deterministic C166 interrupt latency (about 7 cycles) is suitable for velocity-loop timing in servo systems. Add an external Infineon TLE7259-3 CAN transceiver for industrial network connectivity and use the LQFP-EP exposed pad as a primary heat-spreader.
おすすめ
Solar / Renewable Inverter Control
Photovoltaic and small-wind inverters use the SAFXE167F96F66LAC to execute MPPT algorithms, grid-sync PLL loops, and inverter modulation. The 66 MHz core combined with five-stage pipeline and MAC units runs a 16 kHz control loop with cubic MPPT in roughly 30% of available cycle budget, leaving headroom for grid-monitoring firmware. The 768 KB Flash stores grid-code variants (e.g., VDE-AR-N 4105, IEEE 1547) as selectable tables, while 80 KB SRAM buffers ADC scans per PWM cycle. Wide 3.0–5.5 V supply tolerance matches auxiliary rails from 24 V auxiliary supplies. The exposed-pad LQFP-144 layout survives 20-year inverter service-life requirements in outdoor cabinets.
おすすめ
Automotive Body & Chassis ECU
Body-control modules benefit from the SAFXE167F96F66LAC's CAN support, 5 V analog-mixed-signal integration, and industrial AEC-equivalent environmental robustness. Although the part is industrial-grade (not AEC-Q100 itself), it is used in 24 V truck ECUs and chassis subsystems where -40 °C to +125 °C operation is mandatory. The C166SV2 core runs CANopen and J1939 stacks alongside body-control logic. Its 28 I/O ports tie directly to 5 V automotive sensor inputs without level shifters, reducing BOM. The 768 KB Flash accommodates extensive diagnostic services (UDS, DTC lookup tables) and the 80 KB SRAM reserves room for event-buffer records.
おすすめ
Industrial PLC & I/O Module
Distributed PLCs and remote I/O modules use the SAFXE167F96F66LAC to scan 16 channels of analog or digital I/O, handle serial side-protocols (Modbus, IO-Link), and forward data over CAN or RS-485. The 16-bit ADC with 16 channels is well-matched to standard 4–20 mA loops and 0–10 V analog inputs, and the deterministic C166 core guarantees scan-time uniformity across 100+ modules. With 768 KB Flash, the IEC 61131-3 runtime plus user-application memory fits comfortably, and the 80 KB SRAM handles cyclic process images. The LQFP-144 with exposed pad accepts both through-air and forced-air cabinet cooling.
おすすめ
Smart Sensor Hub / IoT Edge
Industrial IoT edge nodes based on the SAFXE167F96F66LAC perform local pre-processing of vibration, temperature and pressure signals before forwarding to a higher-level gateway. The MAC unit accelerates vibration FFT/Goertzel analysis directly on the MCU, while 768 KB Flash stores multiple time-domain and frequency-domain feature extractors. SSC (SPI) and I2C connect to external MEMS sensors, and the CAN node provides fieldbus connectivity to upstream PLCs. The wide-supply tolerance handles 24 V industrial rails without an extra DC-DC stage. Combined with an external TLE7259 CAN transceiver, it forms a complete Industrial IoT edge sensor node.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: SAFXE167F96F66LAC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | SAF-XE167H-96F66LABES | SAF-XE167F-48F66LAC | XE167HM72F80LAAFXUMA1 | SAF-XE164HN-24F80LAA |
|---|---|---|---|---|---|
| Package | LQFP-144 with exposed pad (HLFQFP, 20x20 mm) | LQFP-144 with exposed pad (same) | LQFP-144 with exposed pad (same) | LQFP-144 with exposed pad (same) | LQFP-144 with exposed pad (same) |
| Brand | Infineon | Infineon (same) | Infineon (same) | Infineon (same) | Infineon (same) |
| Core / Architecture | C166SV2 16-bit + MAC, 66 MHz | C166SV2 16-bit + MAC, 66 MHz | C166SV2 16-bit + MAC, 66 MHz | C166SV2 16-bit + MAC, 80 MHz | C166V2 16-bit, 80 MHz |
| Program Flash | 768 KB | 768 KB (same) | 384 KB (-50%) | 576 KB (-25%) | 192 KB (-75%) |
| Operating Frequency | 66 MHz | 66 MHz | 66 MHz | 80 MHz | 80 MHz |
| Supply Voltage | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V |
| Family / Sub-line | XE167 Compact (F-line) | XE167 Compact (H-line) | XE167 Compact (F-line, lower Flash) | XE167 Compact (M-line, 80 MHz) | XE164 (different sub-family) |
| Lifecycle Status | Active | Active | Active | Active | Obsolete (per octopart.ca) |
主な差別化要因
- Highest Flash density in the F-line at 66 MHz （vs SAF-XE167F-48F66LAC)
- Broader industrial peripheral mix than XE164 sub-family （vs SAF-XE164HN-24F80LAA)
- Mature long-life product line with extended Infineon support （vs SAF-XE167H-96F66LABES)
- Balanced Flash/clock ratio for motor control loops （vs XE167HM72F80LAAFXUMA1)
設計ノート
Solder the LQFP-EP exposed pad to a contiguous 1 in² copper pour on top and bottom layers stitched with at least nine thermal vias (0.3 mm drill, 1 mm pitch). At 66 MHz with full peripheral activity the die approaches 1.0–1.2 W dissipation; without the EP plane the junction-to-air thermal resistance exceeds the rated 24 K/W. The exposed pad is the primary thermal relief path and must be electrically tied to GND via this plane.
Place 100 nF X7R 0603 ceramic bypass capacitors as close as possible to each VCC/VDDC pin pair (one cap per pair, within 2 mm trace length), plus a single 4.7 µF X5R bulk capacitor near the IC. The analog AVCC pins benefit from separate filtering: 10 µH ferrite bead in series followed by 100 nF + 2.2 µF decoupling. Keep ADC reference traces away from PWM and CAN switching nets.
Do not confuse the F68 / 96 / 48 Flash-size code with the F-line family; the F68 = 512 KB and F96 = 768 KB while F48 = 384 KB. Mixing these in a port pin assignment leads to incorrect Flash bank mapping. Verify against your firmware linker script. Also, the XE167/XE164 sub-families differ in ADC channel count and peripheral map — a PCB-revision change between them requires re-validation of analog front-end pin assignments.
When routing the external oscillator (XTAL1/XTAL2) keep traces short (<10 mm) and surrounded by a ground guard ring. Source the crystal with matched-load capacitance per datasheet formula C_L = (C1 × C2)/(C1 + C2) + C_stray. Add a 1 MΩ feedback resistor across XTAL1/XTAL2 if the oscillator fails to start at cold temperatures; this is a common production floor failure.
コンプライアンス情報
Green plastic LQFP-144 package per Infineon ordering suffix AC. Industrial temperature grade only — not AEC-Q100 qualified. REACH SVHC statement available on Infineon product page.
