SAK-TC275TP-64F200N - AURIX TC27xT 200MHz TriCore MCU | Infineon
部品番号: SAK-TC275TP-64F200N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $16.66 | $16.66 |
| 10 | $15.4 | $154.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $12.5 | $6,250.00 |
| 1,000 | $11.2 | $11,200.00 |
SAK-TC275TP-64F200N 概要
An AURIX TriCore microcontroller is a multi-core 32-bit MCU family from Infineon that combines RISC, DSP, and microcontroller processing elements on a single die. TriCore belongs to the broader automotive MCU category, sitting architecturally between conventional Cortex-M microcontrollers and higher-performance Cortex-R/A cores, with a strong emphasis on functional safety (ISO 26262) and real-time deterministic control. The TC27xT family specifically targets powertrain, chassis, brake, and steering domains requiring ASIL-D capable processing.
Key features include up to 200 MHz triple-TriCore operation, 4 MB on-chip Flash with ECC, 472 KB SRAM with ECC, four CAN nodes, up to 48 analog/digital input lines, a powerful Generic Timer Module (GTM), and hardware safety constructs such as lockstep cores and integrated Memory Protection Units. The device operates across -40C to +125C junction temperature and supports the PG-LQFP-176-22 thermal envelope suitable for under-hood installations.
Architecturally, the TC275TP separates application code and safety tasks onto dedicated cores with redundant execution paths. The on-chip Flash controller supports single-bank and dual-bank update strategies for OTA-capable ECUs, while embedded HSM and crypto accelerators (specific sub-features vary by part number) are integrated alongside the GTM and ADAS peripherals. The rich peripheral set - including SPI, ASCLIN, MSC, and PSI5 - is mapped to automotive sensor and actuator buses.
Typical applications include automotive electric power steering, brake-by-wire systems, suspension control, electronic stability programs, transmission ECUs, and industrial servo drives. The combination of triple-core throughput and ASIL-D capable lockstep architecture makes it a mainstream choice for chassis-domain ECUs in mid-range vehicles.
Designers should plan thermal dissipation on the LQFP-176 PCB pad layout and follow Infineon's hardware design guide regarding decoupling, oscillator routing, and ESD retention. Firmware should always enable ECC and watchdog services before any safety-relevant task activation.
This page synthesizes Infineon distributor pricing, drop-in AURIX alternatives, and practical layout notes not found in the standalone datasheet.
ドロップイン代替品: SAK-TC275TP-64F200N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
SAK-TC275TF-64F200N DC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAK-TC275TC-64F200N DC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAK-TC275T-64F200N DC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAK-TC275TC-64F200W CA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAK-TC275TP-64F200N AC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAK-TC277TP-64F200N DC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAK-TC264DA-40F200N AB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SAK-TC275TP-64F200N 最大定格＆電気的特性
| Architecture | TriCore (Triple 32-bit) |
| Clock Frequency (max) | 200 MHz |
| Program Memory (Flash) | 4 MB (4M x 8) |
| SRAM (incl. Cache) | 472 KB |
| Flash Memory Type | Embedded Flash with ECC |
| Core Count | 3 TriCore CPUs |
| CAN Nodes | 4 |
| A/D Input Lines | 48 |
| Package Type | PG-LQFP-176-22 (LQFP-176) |
| ピン数 | 176 |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +125C |
| RoHS ステータス | Compliant |
| Safety Standard | ISO 26262 capable (ASIL-D) |
| Family | AURIX TC27xT |
SAK-TC275TP-64F200N pg-lqfp-176-22 (lqfp-176) ピン配置ガイド
SAK-TC275TP-64F200N (pg-lqfp-176-22 (lqfp-176) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: SAK-TC275TP-64F200N.
詳細は データシート をご参照ください。
主な用途
SAK-TC275TP-64F200N の用途: 6 件s: Electric Power Steering (EPS), Brake-by-Wire Chassis Control, Active Suspension Domain Controller, Transmission Control Unit (TCU), Industrial Servo Drive, Agricultural and Off-Highway Vehicle ECU.
Electric Power Steering (EPS)
The SAK-TC275TP-64F200N DC's triple 200 MHz TriCore CPUs deliver the parallel throughput needed to run torque-vectoring control loops and ISO 26262 ASIL-D diagnostics simultaneously. With 472 KB SRAM and 4 MB ECC Flash, the device holds full EPS firmware plus safety library footprint without external memory. The integrated GTM provides the high-resolution PWM required for smooth torque assist, while four CAN nodes interface with the vehicle CAN-FD backbone. The PG-LQFP-176 footprint suits under-hood installation at -40C to +125C, making it a mainstream ECU platform for column-assist and rack-assist EPS designs.
おすすめ
Brake-by-Wire Chassis Control
Brake-by-wire ECUs require deterministic response and lockstep redundancy, both of which the SAK-TC275TP-64F200N DC provides via its three TriCore CPUs with built-in lockstep options. ASIL-D capable on-chip diagnostics pair with four CAN-FD channels to communicate pedal-position, wheel-speed, and hydraulic-actuator commands in real time. The 4 MB Flash supports dual-bank firmware update strategies mandated for fail-operational braking. Integrated ECC on Flash and SRAM guards against soft errors in the harsh -40C to +125C automotive thermal envelope, while the LQFP-176 package provides robust board-level mechanical stability for underbody mounting.
おすすめ
Active Suspension Domain Controller
Active suspension systems need precise multi-axis damper control, which the SAK-TC275TP-64F200N DC addresses through its GTM timer module and 200 MHz CPU clock. Triple-core architecture lets one CPU handle damper actuation, another process vehicle-state estimation, and a third run diagnostic and communication tasks - all within strict latency bounds. The device's 472 KB SRAM accommodates complex ride-model computation while 4 MB Flash stores calibration data per vehicle variant. ISO 26262 ASIL-D capability supports fail-operational behavior required for semi-autonomous damper control, and PG-LQFP-176 ruggedizes the design for high-vibration suspension mounting.
おすすめ
Transmission Control Unit (TCU)
Modern TCUs run gear-shift optimization, torque-management, and clutch-overshoot prevention algorithms in parallel - workloads perfectly matched to the SAK-TC275TP-64F200N DC's triple-TriCore layout. Four CAN-FD nodes and SPI interfaces connect to gearbox sensors, solenoid drivers, and hybrid-domain controllers without external bus expanders. The on-chip 472 KB SRAM holds gear-state and torque tables, while 4 MB Flash retains CVT/AT/DCT calibration maps across model years. Lockstep cores plus ECC memory satisfy ISO 26262 ASIL-D requirements that major OEMs demand for shift-by-wire transmission designs.
おすすめ
Industrial Servo Drive
Outside automotive, the SAK-TC275TP-64F200N DC also powers high-end industrial servo drives where multi-axis coordination and real-time EtherCAT or CANopen stack execution are required. The triple 200 MHz core cluster can simultaneously execute the fieldbus stack, current/torque control loops, and machine-state PLC logic. With 48 A/D input lines and GTM timer channels, the MCU easily handles motor-feedback sampling and PWM generation in a single package. The PG-LQFP-176 footprint provides sufficient thermal headroom for industrial cabinet installations, and on-chip ECC memory ensures long-term reliability in 24/7 factory automation environments.
おすすめ
Agricultural and Off-Highway Vehicle ECU
Off-highway ECUs for tractors, harvesters, and construction machinery must combine ASIL-D capable control with rich IO expansion - both delivered by the SAK-TC275TP-64F200N DC in a PG-LQFP-176 envelope. The device tolerates -40C to +125C and high-vibration environments while running sensor-fusion algorithms across 48 analog inputs and four CAN buses. ASIL-D lockstep and ECC deliver the safety integrity needed for autonomous tractor lift/steer systems that must comply with ISO 25119 AgPL. The 4 MB Flash stores geo-fence datasets and telemetry logs even in remote deployments where over-the-air updates arrive infrequently.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: SAK-TC275TP-64F200N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | SAK-TC275TF-64F200N DC | SAK-TC275TC-64F200N DC | SAK-TC275T-64F200N DC |
|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | PG-LQFP-176-22 | PG-LQFP-176-22 - same | PG-LQFP-176-22 - same | PG-LQFP-176-22 - same |
| Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 4 MB | 4 MB | 4 MB | 4 MB |
| SRAM | 472 KB | 472 KB | 472 KB | 472 KB |
| Core Count | 3 TriCore | 3 TriCore | 3 TriCore | 3 TriCore |
| CAN Nodes | 4 | 4 | 4 | 4 |
| GTM Module | Yes (full) | Yes (full) | Yes (limited) | No |
| Automotive Qualified | Yes (AEC-Q100, ASIL-D) | Yes (AEC-Q100, ASIL-D) | Yes (AEC-Q100) | Yes (AEC-Q100) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
主な差別化要因
- Generic Timer Module (GTM) integrated for high-resolution PWM （vs SAK-TC275T-64F200N DC)
- ASIL-D capable with lockstep triple-core （vs SAK-TC264DA-40F200N AB)
- 4 MB Flash and 472 KB SRAM for full ASIL-D firmware （vs SAK-TC275TC-64F200N DC)
設計ノート
Estimated: at 200 MHz triple-core operation with all peripherals enabled, the SAK-TC275TP-64F200N DC may draw 1.2-1.8 W. The PG-LQFP-176-22 package has a typical theta_JA near 25-30 C/W on a 2-layer JEDEC test board; a 4-layer PCB with continuous ground plane is recommended for chassis ECUs. Always include thermal vias beneath the exposed die-attach pad and validate with a thermocouple in worst-case HVAC loop.
Place decoupling capacitors for each VDDP/VDDC pair within 3 mm of their respective pins. Use 100 nF X7R for high-frequency decoupling plus 4.7 uF bulk on each main supply rail. Keep the 40 MHz crystal or external oscillator traces short and guarded, and route the JTAG/DAP signals away from switching power traces. For EMI-sensitive designs, place a common-mode choke on the CAN bus stub close to the connector.
Do not skip configuring the ECC and lockstep services at startup; failure to do so forfeits ASIL-D capability and may produce silent data corruption. Always validate the boot ROM checksum before jumping to user firmware. When migrating between TP, TF, T, and TC suffixes, verify peripheral pin mapping because GTM and PSI5 routing differs across variants - dropping firmware between revisions can cause undetected pin mismatches.
The LQFP-176 footprint requires hand-routing on inner layers below 0.8 mm pitch. Use buried vias or blind-via stacks on the central cross-hatched thermal pad to maximize heat extraction. Maintain 50 ohm single-ended impedance on the CAN-FD bus and 90 ohm differential on FlexRay. Place ESD diodes close to off-board connectors to survive ISO 7637-2 pulse testing on 12V automotive power nets.
コンプライアンス情報
Qualified to AEC-Q100 and ISO 26262 ASIL-D. RoHS and lead-free per Infineon product declaration. Supply voltage not disclosed in scraped search snippets - marked [DATA_NEEDED].
