SKY66394-11 - 2000-2300 MHz High-Efficiency PA | Skyworks
部品番号: SKY66394-11 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $16.1 | $16,100.00 |
SKY66394-11 概要
An RF power amplifier (PA) is the final active stage in a wireless transmitter chain that boosts a low-level modulated signal to a transmit power level suitable for radiation by an antenna. PAs sit between the transceiver/transmitter IC and the front-end filter/antenna switch, within the broader category of RF & wireless front-end modules. For small-cell base stations, PAs must simultaneously deliver high linearity (low ACLR/EVM) for LTE/3GPP compliance and high efficiency to minimize power dissipation and thermal load in space-constrained, often outdoor or pole-mounted enclosures. The SKY66394-11 is engineered specifically for FDD and TDD 2G/3G/4G LTE small-cell infrastructure.
Key features include a wide instantaneous bandwidth of 300 MHz (2000 to 2300 MHz), high gain of approximately 36 dB, integrated active bias circuitry that compensates PA performance over temperature, voltage, and process variation, and full 50-ohm input/output matching that eliminates external matching components. The 5 x 5 mm MCM package integrates the active die, bias network, and matching networks to simplify PCB design and reduce board area in small-cell radio units.
The SKY66394-11 belongs to a pin-to-pin compatible PA family from Skyworks, with sibling parts covering other 3GPP bands. This enables a single PCB layout to be reused across multiple regional band variants, simplifying manufacturing and inventory. The integrated active biasing stabilizes quiescent current across temperature and supply variation, eliminating the need for external bias controllers.
Typical applications include 4G LTE small-cell base stations, picocell and femtocell radios, distributed antenna systems (DAS) repeaters, and Band 1 / Band 3 / Band 4 / n38 / n40 / n41 (subset) FDD and TDD cellular infrastructure. It is also suitable for industrial 2.3 GHz wireless backhaul links.
When designing with this part, provide adequate heatsinking through PCB copper pours to manage thermal dissipation at high output power. Use a regulated 5V supply for VCC and follow the reference layout in the datasheet closely to preserve the integrated matching network performance. Reference impedance is 50 ohms on both RF ports.
This page synthesizes distributor pricing, pin-compatible same-family alternatives (such as SKY66395-11 and SKY66396-11), and practical RF layout guidance not found in the manufacturer datasheet alone, giving the engineer a single decision-ready reference for 2.0-2.3 GHz small-cell PA selection.
ドロップイン代替品: SKY66394-11 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
SKY66395-11
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SKY66396-11
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SKY66397-11
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SKY66398-11
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SKY66399-11
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SKY66394-11 最大定格＆電気的特性
| 機能 | RF Power Amplifier |
| Frequency Range | 2000 MHz to 2300 MHz |
| Operating Mode | FDD and TDD 2G/3G/4G LTE |
| Application | Small-cell base station |
| Package Type | 16-MCM (5 x 5 mm) |
| Supply Voltage (VCC) | 5 V (typical) |
| Input Matching | Integrated, 50 ohm |
| Output Matching | Integrated, 50 ohm |
| Bias Circuitry | Integrated active bias |
| 動作温度範囲 | -40C to +85C |
| Bandwidth | 300 MHz instantaneous |
| Family Compatibility | Pin-to-pin with other 3GPP-band SKY66x family PAs |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| MSLレベル | 3 |
SKY66394-11 16-mcm (5 x 5 mm) ピン配置ガイド
SKY66394-11 (16-mcm (5 x 5 mm) パッケージ) のピン配置。 このアナログコンポーネントは、入力、出力、および電源ピンを備えています。オフセットナル、補償、イネーブルピンの設定については、メーカーのデータシートを参照してください。信号調整やアンプ回路に最適です。
詳細なピン配置データはありません: SKY66394-11.
詳細は データシート をご参照ください。
主な用途
SKY66394-11 の用途: 6 件s: 4G LTE Small-Cell Base Station, Picocell and Femtocell Radio, Distributed Antenna System (DAS) Repeater, TDD LTE Small-Cell Radio Unit, Industrial 2.3 GHz Wireless Backhaul, Multi-Band Small-Cell Reference Platform.
4G LTE Small-Cell Base Station
The SKY66394-11 is purpose-built for 4G LTE small-cell base stations operating across 2.0-2.3 GHz, covering 3GPP Band 1 (UL/DL), Band 3, Band 4, and Band 10. With integrated input/output matching to 50 ohms and active bias compensation over temperature and supply variation, the part removes the need for external matching networks and bias controllers that would otherwise inflate PCB area. Placed in the TX chain between the transceiver/upconverter and the duplexer/filter, it delivers the linearity (ACLR) required for LTE spectrum-emission masks while maintaining high DC-RF efficiency to keep small-cell thermal envelopes manageable.
おすすめ
Picocell and Femtocell Radio
Indoor picocell and femtocell deployments in the 2.0-2.3 GHz range benefit from the SKY66394-11's compact 5 x 5 mm MCM footprint and integrated biasing. Per the Skyworks datasheet, the active biasing circuitry compensates PA performance over temperature, voltage, and process variation - critical for consumer-deployed small cells in uncontrolled thermal environments such as office ceilings or residential wall mounts. The integrated 50-ohm matching shortens design cycles for small OEMs that lack extensive RF-matching expertise.
おすすめ
Distributed Antenna System (DAS) Repeater
DAS head-end and remote units operating in 3GPP bands within 2.0-2.3 GHz use the SKY66394-11 as a high-linearity PA stage in the downlink path. The 300 MHz instantaneous bandwidth supports multiband repeater designs without band-specific retuning. According to the Skyworks datasheet, the integrated matching simplifies the RF bill of materials in cost-sensitive DAS products where every dollar of BOM matters. The wide operating temperature range (-40C to +85C) supports outdoor-mounted repeater enclosures.
おすすめ
TDD LTE Small-Cell Radio Unit
TDD LTE deployments (Band 34, Band 38, Band 39, Band 40) within the 2.0-2.3 GHz segment of the SKY66394-11's range leverage the same hardware as FDD designs, simplifying inventory for OEMs serving both modes. The integrated active bias supports rapid TX/RX switching required by TDD operation. Per the Skyworks datasheet, the device is qualified for both FDD and TDD modes, and the pin-to-pin family compatibility allows one PCB to support either mode by swapping firmware and the PA sibling.
おすすめ
Industrial 2.3 GHz Wireless Backhaul
Point-to-point and point-to-multipoint wireless backhaul links in the 2.3 GHz band can use the SKY66394-11 as a high-linearity final PA in the transmitter chain. The 50-ohm RF ports connect directly to a bandpass filter and antenna, simplifying the RF front-end design for industrial backhaul OEMs. The wide operating temperature range (-40C to +85C) supports outdoor tower-mounted radios where ambient temperatures vary seasonally. Per the datasheet, the integrated bias maintains stable output power across the industrial temperature envelope.
おすすめ
Multi-Band Small-Cell Reference Platform
OEMs designing a single small-cell PCB that ships into multiple regional markets benefit from the SKY66394-11's pin-to-pin family compatibility. The PCB is laid out once, and the appropriate band-specific PA (SKY66394-11 for low/mid bands, SKY66395-11 / SKY66396-11 for higher bands) is stuffed during regional SKU assembly. Per the Skyworks datasheet, the entire family shares identical footprint, pinout, and bias interfaces. This reduces qualification cycles and inventory SKU count while preserving per-band RF performance.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: SKY66394-11 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | SKY66395-11 | SKY66396-11 | SKY66397-11 | SKY66398-11 | SKY66399-11 |
|---|---|---|---|---|---|---|
| Brand | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions |
| Package | 16-MCM (5x5 mm) | 16-MCM (5x5 mm) - same | 16-MCM (5x5 mm) - same | 16-MCM (5x5 mm) - same | 16-MCM (5x5 mm) - same | 16-MCM (5x5 mm) - same |
| Pin-to-Pin Compatible | Yes | Yes | Yes | Yes | Yes | Yes |
| Function | RF Power Amplifier (Small-Cell) | RF Power Amplifier (Small-Cell) | RF Power Amplifier (Small-Cell) | RF Power Amplifier (Small-Cell) | RF Power Amplifier (Small-Cell) | RF Power Amplifier (Small-Cell) |
| Operating Mode | FDD / TDD 2G/3G/4G LTE | FDD / TDD 2G/3G/4G LTE | FDD / TDD 2G/3G/4G LTE | FDD / TDD 2G/3G/4G LTE | FDD / TDD 2G/3G/4G LTE | FDD / TDD 2G/3G/4G LTE |
| Frequency Band Segment | 2000-2300 MHz | Different 3GPP band (within family) | Different 3GPP band (within family) | Different 3GPP band (within family) | Different 3GPP band (within family) | Different 3GPP band (within family) |
| Integrated Matching | Yes (50 ohm input/output) | Yes | Yes | Yes | Yes | Yes |
| Integrated Active Bias | Yes | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Pin-to-pin compatible family for all 3GPP bands （vs SKY66395-11)
- Integrated input/output matching eliminates external RF components （vs Discrete small-cell PA designs)
- Integrated active bias compensation over temperature and process （vs PAs requiring external bias controllers)
設計ノート
At full LTE output power, the SKY66394-11 dissipates significant DC power as heat. Per the datasheet, the 16-MCM 5 x 5 mm package must be soldered to a sufficiently large PCB copper pour (recommended footprint pattern in datasheet) to keep the die temperature within the -40C to +85C operating range. For continuous high-duty-cycle TDD operation, thermal vias under the package thermal pad are recommended to spread heat into inner PCB copper layers. Insufficient thermal dissipation is a common cause of output power droop and reduced linearity in deployed small-cell units.
The SKY66394-11 integrates the RF matching networks, but the input/output traces to the upstream transceiver and downstream filter must be 50-ohm controlled-impedance (typically grounded coplanar waveguide on the top PCB layer) with reference ground unbroken beneath the trace. Per the Skyworks reference layout in the datasheet, keep RF traces as short as possible and place the DC decoupling capacitors as close as practical to the VCC and bias pins. The exposed thermal pad must be soldered to the PCB ground pour with an array of thermal vias for heat extraction.
Use a regulated low-noise 5 V supply for VCC to minimize conducted noise coupling into the RF chain. Decouple the supply rail with a 10 uF bulk capacitor plus 0.1 uF and 1 nF ceramic capacitors placed close to the VCC pins. The SKY66394-11 has internal active bias regulation, but ripple on VCC directly degrades ACLR performance and may show as discrete spurs in the output spectrum. Avoid routing noisy digital lines near the VCC trace.
Estimated: substituting the SKY66394-11 with a non-family PA without verifying pinout compatibility is a frequent error - always confirm the candidate is in the Skyworks pin-to-pin compatible family (SKY66395-11 / SKY66396-11 / etc.) before PCB layout finalization. Also avoid operating the part without adequate heatsinking at high output power, as thermal shutdown or accelerated aging can result. Finally, do not bypass the integrated matching networks with external components - they are tuned for the integrated die and external additions will detune the match.
コンプライアンス情報
RoHS and lead-free per Skyworks product page. AEC-Q100 is not applicable as this is an RF PA, not an automotive-qualified IC. Halogen-free status not explicitly stated in the verified data.
