SPC5748GGK1MMJ6 - 32-bit Tri-Core MCU, 6MB Flash | NXP
部品番号: SPC5748GGK1MMJ6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $54.14 | $54.14 |
| 10 | $48.72 | $487.20 |
| 100 | $42.3 | $4,230.00 |
| 500 | $36.88 | $18,440.00 |
| 1,000 | $31.95 | $31,950.00 |
SPC5748GGK1MMJ6 概要
A microcontroller (MCU) is an integrated circuit containing one or more processor cores, memory (Flash, SRAM), and a rich set of on-chip peripherals such as timers, communication controllers, and analog blocks. The MPC574xB/C/G family sits in the powertrain/chassis and central body control segment of NXP's automotive portfolio, addressing gateway, industrial, and body domain controller use cases where high determinism and dual-core lockstep are required. The Tri-Core topology (one z2 + two z4) provides a clear partitioning scheme: the z2 acts as a peripheral/communication processor while the dual z4 cores can run in lockstep for safety-critical software isolation. According to NXP documentation, the family targets next-generation central body control and gateway ECUs requiring enhanced low-power operation and hardware security against ECU attacks.
Key features of the SPC5748GGK1MMJ6 include 6MB embedded Flash with EEPROM capability, multiple communication interfaces including CAN FD, two Ethernet MACs, LIN, FlexRay, and SPI/SCI/UART, an integrated VREG for single-rail supply, a Hardware Security Module (HSM) on certain cut revisions, and a Nexus Class 3+ debug interface on every core. The device also includes a Wake-Up Unit (WKPU), an enhanced Modular IO Subsystem (eMIOS), and dual ADC subsystems for parallel analog acquisition. Hardware-based functional safety support assists ASIL-D software decomposition by allowing lockstep operation, ECC on memories, and fault collection registers.
Typical applications for the SPC5748GGK1MMJ6 include automotive central body control modules, in-vehicle network gateways translating CAN/CAN-FD/Ethernet traffic, industrial safety controllers requiring ASIL-D decomposition, HVAC and lighting control modules, and chassis domain controllers on premium and electric vehicles. Compared to lower-end body MCUs, this part integrates sufficient compute and memory to consolidate multiple ECUs into a single domain controller, reducing wiring harness weight and software maintenance overhead.
When designing with this MCU, provision decoupling for the 1.2V core and 3.3V/5V I/O rails, follow NXP's MAPBGA-256 PCB layout recommendations including microvia stacking on the BGA break-out, and budget for the device's thermal dissipation at sustained 160MHz operation. Software initialization must configure the device cut revision (1N81M referenced in NXP community discussion) and enable any required HSM or Ethernet boot loader flows.
This page synthesizes distributor pricing snapshots, drop-in MPC574x alternatives, and practical design notes not aggregated in the manufacturer datasheet.
ドロップイン代替品: SPC5748GGK1MMJ6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: SPC5748GGK1MMJ6 （同一形状・フットプリント） — 相違点: Maximum Clock Frequency, Package, Program Memory Size, RoHS Status, Supply Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
SPC5748GSMMJ6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SPC5748GGK1MKU6
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
SPC5746BSK1MKU2
✅ ドロップイン✓ 在庫あり
$17.25 / 個
データシートを見る →SPC5642AF2MLU1
✅ ドロップイン✓ 在庫あり
$21.23 / 個
データシートを見る →SPC5644AF0MLU2
✅ ドロップイン✓ 在庫あり
$12.5 / 個
データシートを見る →SPC5748GGK1MMJ6 最大定格＆電気的特性
| Core Architecture | Power Architecture e200z2 + 2x e200z4 (Tri-Core) |
| データバス幅 | 32-bit |
| 最大クロック周波数 | 160 MHz (with z2 at 80 MHz in lockstep config) |
| Program Memory Size | 6 MB Flash |
| 動作温度範囲 | -40 C to +125 C |
| 電源電圧 | 5 V (with internal VREG for core) |
| Package Type | 256-MAPPBGA (17x17 mm) |
| 実装タイプ | Surface Mount |
| Automotive Qualification | AEC-Q100 |
| Ethernet | 2x 10/100 Mbps MACs |
| CAN | CAN FD supported |
| Debug Interface | Nexus Class 3+ (NDI per IEEE-ISTO 5001-2008) |
| Hardware Security Module | HSM (variant dependent) |
| RoHS ステータス | Compliant |
| Family | MPC574xB/C/G |
SPC5748GGK1MMJ6 256-mappbga (17x17 mm) ピン配置ガイド
SPC5748GGK1MMJ6 (256-mappbga (17x17 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: SPC5748GGK1MMJ6.
詳細は データシート をご参照ください。
主な用途
SPC5748GGK1MMJ6 の用途: 6 件s: Automotive Central Body Control Module, In-Vehicle Network Gateway, Chassis Domain Controller (Premium/EV), Industrial Functional Safety Controller, HVAC and Climate Control Module, Vehicle Lighting Controller (Matrix LED).
Automotive Central Body Control Module
The SPC5748GGK1MMJ6 consolidates body-domain functions (interior lighting, wipers, door modules, climate fan control) into a single ECU through its tri-core 80MHz/160MHz architecture and 6MB Flash. The two Ethernet MACs enable backbone connectivity to other domain ECUs, while CAN FD handles legacy and modern body networks without external transceivers. With AEC-Q100 Grade-1 qualification and -40C to +125C operation, the device meets under-dash thermal envelopes on a single 5V supply (internal VREG generates the 1.2V core rail). Compared to multi-ECU body architectures, this part saves ~$8-12 BOM per node by absorbing gateway and BCM roles.
おすすめ
In-Vehicle Network Gateway
As an automotive gateway, the SPC5748GGK1MMJ6's dual 10/100 Ethernet ports plus CAN FD controllers allow simultaneous translation between CAN/CAN-FD subnets, FlexRay chassis bus, and Ethernet backbone. The 6MB Flash holds AUTOSAR Classic base, communication stack, network management, and diagnostic (UDS/KWP2000) binaries with room for OTA staging. The tri-core topology assigns the z2 to fast-path routing and the dual z4 cores to application/safety layers. This gateway typically replaces 2-3 discrete ECUs in zonal architectures.
おすすめ
Chassis Domain Controller (Premium/EV)
For chassis control on premium and electric vehicles, the SPC5748GGK1MMJ6's e200z4 cores can run in lockstep to satisfy ASIL-D decomposition for brake-by-wire and steering sub-systems. The 160MHz compute headroom processes sensor fusion from chassis IMU/steering sensors while the integrated ADC subsystems sample pedal and wheel-speed signals deterministically. The 6MB Flash absorbs safety-validated chassis software with on-board secure boot; functional safety features (ECC, fault collection, windowed watchdog) shorten ISO 26262 qualification effort.
おすすめ
Industrial Functional Safety Controller
Outside automotive, the SPC5748GGK1MMJ6 fits SIL-3 industrial controllers (robotics safety PLCs, redundant servo drives) thanks to tri-core lockstep, the WKPU controller for safe wake-from-sleep, and 6MB Flash accommodating IEC 61508 certified firmware plus ladder/SIL libraries. The -40C to +125C envelope supports cabinet-free mounting near motors and hydraulics, while dual Ethernet enables PROFINET or EtherCAT master/slave configurations. AEC-Q100 qualification adds an extra margin for harsh industrial environments beyond typical consumer-grade MCU ratings.
おすすめ
HVAC and Climate Control Module
Premium HVAC modules use the SPC5748GGK1MMJ6 to manage mixed-temperature zones, blower speeds, seat heating/cooling matrices, and particulate-matter sensors. The integrated ADC and eMIOS timers deliver the PWM channels needed for blower/actuator drives without external timer ICs, while the dual Ethernet ports bridge into the vehicle backbone for OTA HVAC calibration updates. The 6MB Flash stores vehicle-specific trim-level configuration and personality profiles per seat/zone.
おすすめ
Vehicle Lighting Controller (Matrix LED)
Adaptive driving beam and matrix-LED lighting modules use the SPC5748GGK1MMJ6 to drive 100+ pixel LEDs per headlamp with sub-millisecond reconfiguration. The tri-core compute provides adequate headroom for camera-input object detection hand-off while the z2 handles the CAN-FD command channel from the ADAS ECU. 6MB Flash stores the LED current calibration table, GSR regulatory lookups, and camera-to-LED mapping for global headlamp platforms.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: SPC5748GGK1MMJ6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | SPC5748GSMMJ6 | SPC5748GGK1MKU6 | SPC5746BSK1MKU2 | SPC5642AF2MLU1 | SPC5644AF0MLU2 |
|---|---|---|---|---|---|---|
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA - same family | 256-MAPBGA - same family | 256-MAPBGA - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Tri-Core e200z2 + 2x e200z4 | Tri-Core e200z2 + 2x e200z4 - same | Tri-Core e200z2 + 2x e200z4 - same | Dual-Core e200z4 | Dual-Core e200z4 (MPC56) | Dual-Core e200z4 (MPC56) |
| Maximum Clock Frequency | 160 MHz (z4) / 80 MHz (z2) | 160 MHz / 80 MHz - same | 160 MHz / 80 MHz - same | 160 MHz - same | 80 MHz | 120 MHz |
| Program Memory (Flash) | 6 MB | 6 MB - same | 6 MB - same | 3 MB (-50%) | 2 MB (-67%) | 3 MB (-50%) |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same |
| Ethernet | 2x 10/100 Mbps MAC | 1x Ethernet (HSM takes place) | 2x 10/100 MAC - same | 1-2x 10/100 MAC | 1x 10/100 MAC | 1x 10/100 MAC |
| Automotive Grade | AEC-Q100 Grade-1 | AEC-Q100 - same | AEC-Q100 - same | AEC-Q100 - same | AEC-Q100 - same | AEC-Q100 - same |
主な差別化要因
- Highest density 6MB Flash in MPC574x family （vs SPC5746BSK1MKU2)
- Tri-Core with dual Ethernet for gateway consolidation （vs SPC5642AF2MLU1)
- CAN FD and dual Ethernet on GK1 cut （vs SPC5748GSMMJ6)
設計ノート
Estimated: At sustained 160MHz operation with both z4 cores active, junction temperature can rise 25-35C above ambient without heatsinking. The 256-MAPBGA package has theta_JA around 15-20 C/W on a 4-layer JEDEC-compliant PCB. Place thermal vias in a 3x3 grid under the BGA central thermal pad and stitch power/ground planes to spread heat. For under-dash modules with ambient up to +85C, derate clock frequency or migrate to a part with heat-spreader pad.
MAPBGA-256 with 1.0 mm pitch requires laser-drilled microvias for fan-out. Follow NXP application note AN4830 for land pattern, solder mask defined (SMD) vs non-solder mask defined (NSMD) pad preference, and via-in-pad recommendations. Place a continuous ground plane on layer 2 directly under the BGA and stitch power planes on layer 3; route high-speed Ethernet differential pairs (MII/RMII) with 100-ohm differential impedance and length matching under 5 mil tolerance. Allow at least 4mm keep-out around the BGA for X-ray inspection.
Do not assume all SPC57 cuts share identical pinout; per NXP community thread 636177, the GK1 (with CAN FD and 2nd Ethernet) vs the GK1/H (with HSM) variants differ in peripheral multiplexing. Verify your code does not rely on a peripheral absent in your cut. Also confirm the boot-assist pins (FAB, BOOTCFG) match your chosen boot source (Flash, UART, CAN) prior to locking the PCB; failure to do so results in unrecoverable bricks on first power-up.
Estimated: The internal VREG expects a 5V nominal input; design the external bulk decoupling with 22uF X7R plus 100nF X7R low-ESR ceramic on each VDD/VSS pair. Add a 4.7uF tantalum or polymer cap on the VREG output (VDD_HV_IO) to absorb load transients during core wake events. Per NXP recommendations, do not share the VREG bulk capacitor with analog supply domains to prevent switching-noise coupling into ADC samples.
コンプライアンス情報
AEC-Q100 Grade-1 qualified per NXP product page. RoHS and REACH compliant per datasheets.com part record. Lead-free and halogen-free BGA terminations.
