STM32C531FBU6 - Cortex-M33 144MHz MCU | STMicroelectronics
部品番号: STM32C531FBU6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.1 | $3.10 |
| 10 | $2.79 | $27.90 |
| 100 | $2.48 | $248.00 |
| 500 | $2.17 | $1,085.00 |
| 1,000 | $1.86 | $1,860.00 |
STM32C531FBU6 概要
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory (flash and SRAM), and a rich set of peripherals on one die, sitting at the lowest level of the embedded-system hierarchy: semiconductor -> microcontroller -> embedded system. The STM32C5 series belongs to STMicroelectronics' mainstream STM32 family of Arm Cortex-M based 32-bit MCUs, positioned for cost-sensitive general-purpose designs.
Key features include the high-performance Cortex-M33 core executing from flash at 144 MHz, a single-precision floating-point unit (FPU) supporting all Arm single-precision data-processing instructions and data types, and the I3C interface - a backward-compatible successor to I2C that enables higher throughput and dynamic addressing. General-purpose 32-bit MCUs of this class are used in motor control, consumer appliances, IoT nodes, and industrial automation.
Technically, the STM32C53xxx family shares the same platform architecture, memory map, and peripheral set, which means code written for one flash density variant runs unmodified on another - a significant advantage for product families spanning multiple memory options. The FPU offloads floating-point math from software emulation, freeing CPU cycles for control loops and signal processing.
Typical applications include industrial sensors and actuators, home appliances, building automation, and USB/I3C-connected peripherals where 144 MHz headroom and hardware floating-point improve response time and precision.
Design consideration: verify the exact flash and RAM density of the F-grade variant against the ST datasheet before finalizing the linker script, and confirm UFQFPN-48 footprint thermal-pad soldering for ground integrity.
This page synthesizes verified distributor data, drop-in family alternatives, and practical design guidance not found in a single manufacturer document.
ドロップイン代替品: STM32C531FBU6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: STM32C531FBU6 （同一形状・フットプリント） — 相違点: Core, Core Architecture, FPU.
クイック比較ツール — 並列比較する代替部品を選択:
STM32C531CBU6
✅ ドロップイン✓ 在庫あり
$2.28 / 個
データシートを見る →STM32C531FBU6 最大定格＆電気的特性
| Core | Arm Cortex-M33 32-bit RISC with FPU |
| Core Architecture | Armv8-M mainline |
| Maximum CPU Frequency | 144 MHz |
| FPU | Single-precision, all Arm single-precision instructions and data types |
| Product Family | STM32C5 (STM32C53xxx general purpose) |
| パッケージ | 48-UFQFPN (7x7 mm) |
| 実装タイプ | Surface Mount |
| Interfaces | I3C (per ST product page) |
| Program Memory Type | FLASH |
STM32C531FBU6 48-ufqfpn (7x7 mm) ピン配置ガイド
STM32C531FBU6 (48-ufqfpn (7x7 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: STM32C531FBU6.
詳細は データシート をご参照ください。
主な用途
STM32C531FBU6 の用途: 6 件s: Industrial Motor Control, IoT Sensor Nodes, Home Appliances, USB and I3C Peripherals, Building Automation, Consumer Electronics and Wearables.
Industrial Motor Control
The STM32C531FBU6 fits industrial motor control because its 144 MHz Arm Cortex-M33 core with hardware single-precision FPU executes field-oriented control (FOC) arithmetic natively - per the STM32C53xxx datasheet, the FPU supports all Arm single-precision instructions and data types, eliminating fixed-point libraries from current and speed loops. In a typical drive, the MCU generates complementary PWM for the inverter stage, samples phase currents through its analog inputs, and closes the control loop at switching frequency rates that 144 MHz headroom comfortably supports. The 48-UFQFPN 7x7 mm package keeps gate-drive trace lengths short, reducing EMI and switching ringing on the PCB. The I3C and standard serial interfaces let the drive report diagnostics to a factory PLC without a second communication controller. Compared with an 8-bit or Cortex-M0 alternative, the FPU and pipeline depth cut loop jitter, improving torque smoothness in conveyor, pump, and fan applications.
おすすめ
IoT Sensor Nodes
For IoT sensor nodes, the STM32C531FBU6 offers a strong balance of compute and connectivity: the 144 MHz Cortex-M33 processes sensor fusion and filtering locally, while the integrated I3C interface - highlighted on the ST product page as a headline feature - connects multiple digital sensors over a two-wire bus with higher throughput and dynamic addressing than legacy I2C. I3C's in-band interrupt mechanism removes dedicated interrupt lines, simplifying the node PCB around the compact 48-UFQFPN 7x7 mm package. The FPU accelerates floating-point calibration math (offset, gain, temperature compensation) that dominates smart-sensor firmware. Designers should budget sleep-mode current carefully: STM32 low-power modes allow the node to spend most of its life between radio wakeups, and the mainstream STM32 ecosystem (CubeMX, CubeIDE, HAL) shortens firmware bring-up for combined I3C sensor plus UART-to-radio-link topologies typical in building automation and asset tracking.
おすすめ
Home Appliances
Home appliance control boards benefit from the STM32C531FBU6's mainstream positioning: the STM32C53xxx family is expressly a general-purpose, cost-sensitive line per the ST datasheet, yet its 144 MHz Cortex-M33 with FPU handles user-interface rendering, brushless fan control, and sensor acquisition concurrently. The 48-UFQFPN package (7x7 mm, 0.5 mm pitch) is hand-solderable for appliance service boards while remaining automated-assembly friendly. The I3C interface talks to capacitive-touch and environmental sensors on the front panel over two wires, and standard STM32 UART/SPI peripherals interface with displays and mains-isolated communication modules. Because all STM32C53xxx flash densities share the same pinout and register map, appliance makers can qualify one PCB and populate either the CBU6 (128 KB flash) or FBU6 depending on the model's feature set, reducing BOM complexity. Robust industrial-temperature operation and the mature STM32 HAL further de-risk long-life appliance firmware.
おすすめ
USB and I3C Peripherals
Peripheral and dongle designs that bridge I3C device buses to USB or other host interfaces are a natural fit for the STM32C531FBU6. ST's product pages list I3C as a defining feature of the STM32C531 line, and the 144 MHz Cortex-M33 provides sufficient throughput to translate packets between an I3C dynamic-address sensor bus and a higher-speed host link with low latency. The single-precision FPU accelerates data-formatting tasks such as scaling and calibration when forwarding sensor streams. In a typical topology, the MCU's I3C controller or target port faces the sensor cluster while UART/SPI faces the bridge, and the compact 48-UFQFPN 7x7 mm footprint suits dongle-class PCBs. When prototyping, engineers can validate I3C dynamic addressing and in-band interrupts on the CBU6 board-level build and migrate to the FBU6 as protocol stack size grows - both share the same pinout per the STM32C53xxx datasheet.
おすすめ
Building Automation
In building automation nodes - occupancy sensors, damper controllers, HVAC zone modules - the STM32C531FBU6 provides the processing margin to run protocol stacks (BACnet/Modbus layers over UART or RS-485 transceivers) while concurrently managing local control loops. The 144 MHz Cortex-M33 with FPU executes PID compensation in floating point, and the I3C interface aggregates multiple environmental sensors over a short two-wire bus inside the node, cutting harness cost versus point-to-point wiring. The general-purpose STM32C53xxx family per the ST datasheet is explicitly positioned for such mainstream industrial and building products, with the 48-UFQFPN package offering a good density-to-solderability compromise for control-board manufacturing. Because the CBU6 variant is a pin-identical, lower-flash drop-in, integrators can standardize on one layout across sensor-only nodes (CBU6) and controller nodes (FBU6), simplifying certification and spare-part inventory.
おすすめ
Consumer Electronics and Wearables
Consumer electronics sub-systems - remote controls, small displays, chargers, wearable hubs - use the STM32C531FBU6 where a mainstream MCU must deliver modern core performance at consumer price points. The 144 MHz Cortex-M33 with FPU outperforms older Cortex-M0/M3 mainstream parts in UI responsiveness and DSP-lite tasks such as touch filtering or audio cue generation, while the I3C interface on the ST product page spec connects next-generation I3C sensors as well as legacy I2C peripherals. The 48-UFQFPN 7x7 mm, 0.5 mm-pitch package balances board density with yield in mass production. Firmware development benefits from the shared STM32C53xxx ecosystem: CubeMX-generated init code and HAL drivers run identically across the family, and teams can develop on the widely stocked CBU6 (128 KB flash) then switch to the FBU6 for feature-rich SKUs without PCB respin, since all family variants share the same pinout and peripheral map per the datasheet.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: STM32C531FBU6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | STM32C531CBU6 |
|---|---|---|
| Package | 48-UFQFPN (7x7 mm) | 48-UFQFPN (7x7 mm) - same |
| Brand | STMicroelectronics | STMicroelectronics - same |
| Core | Arm Cortex-M33 with FPU, 32-bit | Arm Cortex-M33 with FPU, 32-bit |
| Max Frequency | 144 MHz | 144 MHz |
| Flash | F grade (higher family density per ST numbering) | 128 KB |
| I3C Interface | Yes | Yes |
| Pin Compatibility | Reference (48-UFQFPN) | Pin-to-pin compatible |
主な差別化要因
- Higher flash density in the same footprint （vs STM32C531CBU6)
- I3C interface as a family headline feature （vs STM32C531CBU6)
- 144 MHz Cortex-M33 with hardware FPU at mainstream cost （vs STM32C531CBU6)
設計ノート
The 48-UFQFPN package has an exposed pad that must be soldered to a ground pour for both thermal dissipation and signal-return integrity. Use a 3x3 or 4x4 via array (0.3 mm vias) in the exposed-pad land pattern connected to the internal ground plane, per standard ST UFQFPN layout recommendations. The 0.5 mm pin pitch requires solder-mask-defined pads within the datasheet tolerance; verify stencil aperture design (typically 90% coverage) with your assembly house before production.
Decouple each VDD pin with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor per supply domain, following the power supply scheme in the STM32C53xxx datasheet. Keep the VDDA/analog supply filtered (ferrite bead plus 1 uF + 10 nF) when using ADC channels, because digital switching noise on VDDA directly degrades ADC effective resolution at 144 MHz operation.
Do not assume flash/RAM density from the family datasheet alone - confirm the exact F-grade memory sizes from the ST product page or ordering-info section before fixing the linker script, since the STM32C53xxx family spans multiple densities with the same footprint. Also note that the FBU6 (UFQFPN) and FBT6 (LQFP) variants are NOT footprint-compatible despite the same pin count; order the correct package suffix. Estimated: plan I3C bus pull-ups per the I3C spec (typ. 1 kOhm range) rather than reusing I2C 4.7 kOhm values.
コンプライアンス情報
Compliance statuses not explicitly stated in the provided web data; obtain the official ST material declaration from the st.com product page before use in regulated markets. Mainstream ST MCUs are typically RoHS-compliant but this was not verified for the FBU6 suffix.
