STM32F745VEH6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics
部品番号: STM32F745VEH6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $21.9092 | $21.91 |
| 10 | $21.9092 | $219.09 |
| 100 | $21.9092 | $2,190.92 |
| 500 | $21.9092 | $10,954.60 |
| 1,000 | $21.9092 | $21,909.20 |
STM32F745VEH6 概要
What is an Arm Cortex-M7 microcontroller? A Cortex-M7 MCU is a 32-bit RISC processor designed for embedded systems, industrial equipment, communications infrastructure, and real-time control. The STM32F7 family pairs that processor core with integrated memory, communication peripherals, timers, and GPIO. Its hardware floating-point unit supports efficient control and signal-processing workloads without requiring a separate DSP for many applications.
The verified device data identifies a 216 MHz maximum operating frequency and 512 KB of Flash organized as 512K x 8 bits. The STM32F745VE family is manufactured in a 100-TFBGA, 8 x 8 mm package. This dense package supports a broad pin-oriented interface in a compact land pattern but requires careful escape routing and multilayer PCB planning.
Key engineering considerations include power-supply design, clock distribution, decoupling, boot configuration, peripheral connectivity, and thermal performance. Because the supplied verified results do not state RAM capacity, operating-voltage range, GPIO count, ADC performance, Ethernet support, or package dimensions beyond the 8 x 8 mm descriptor, those values must be confirmed in the official STM32F745VE documentation before schematic or PCB release.
Typical uses include industrial automation, motor and motion control, communications equipment, audio and DSP-assisted control, test and measurement systems, and connected industrial products. The Cortex-M7 performance class is suitable when an application benefits from deterministic real-time execution combined with a broad peripheral ecosystem.
For a new design, use the manufacturer product page and datasheet to verify electrical limits, alternate-function assignments, pin multiplexing, memory map, and package tolerances. Treat distributor listings as commercial references and the official STMicroelectronics documentation as the authority for design decisions.
This page consolidates verified distributor specifications, official-product sourcing, package details, and engineering cautions for STM32F745VEH6 procurement and early design planning. It distinguishes confirmed facts from parameters that still require verification.
ドロップイン代替品: STM32F745VEH6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: STM32F745VEH6 （同一形状・フットプリント） — 相違点: Flash Memory, Instruction Set, Package, Product Type.
クイック比較ツール — 並列比較する代替部品を選択:
STM32H725VGH3
✅ ドロップイン📋 参考代替品（カタログ未掲載）
STM32H723VGH6
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →STM32F765VGH6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
STM32F745VEH6 最大定格＆電気的特性
| Product Type | 32-bit microcontroller |
| Processor Core | Arm Cortex-M7 |
| Instruction Set | 32-bit RISC |
| Maximum CPU Frequency | 216 MHz |
| Flash Memory | 512 KB |
| Flash Organization | 512K x 8 bits |
| パッケージ | 100-TFBGA, 8 x 8 mm |
| Ball Count | 100 balls |
| Core Architecture | Arm Cortex-M7 high-performance core |
| Series | STM32F7 |
| RoHS ステータス | Yes |
| Reach Compliance | Compliant |
| ライフサイクル状態 | Active |
STM32F745VEH6 100-tfbga, 8 x 8 mm ピン配置ガイド
STM32F745VEH6 (100-tfbga, 8 x 8 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: STM32F745VEH6.
詳細は データシート をご参照ください。
主な用途
STM32F745VEH6 の用途: 6 件s: Industrial Automation Controllers, Motor and Motion Control, Communications Equipment, Audio and DSP-Assisted Control, Test and Measurement Systems, Connected Embedded Products.
Industrial Automation Controllers
The STM32F745VEH6 fits industrial automation prototypes that need a high-performance 32-bit Cortex-M7 core operating at up to 216 MHz while retaining the STM32F7 software ecosystem. Its 512 KB of Flash provides a defined code-storage baseline, although RAM and peripheral details must be confirmed before final sizing. In a controller, the MCU could supervise sensors, execute control logic, and coordinate communications. The 100-TFBGA package saves board area but demands multilayer escape routing, verified ball mapping, and careful power decoupling. Final qualification should compare timer resources, analog inputs, industrial temperature limits, and long-term availability against the exact application requirements.
おすすめ
Motor and Motion Control
The STM32F745VEH6 is a candidate for digital motor and motion-control systems because its Cortex-M7 core operates up to 216 MHz and can handle real-time control tasks efficiently. The supplied data does not list timer channels, PWM resolution, encoder interfaces, or operating-temperature limits, so those functions must be verified in the STM32F745VE documentation. A practical design would use the MCU for current sampling, control-loop execution, fault handling, and communication with a power stage. The compact 100-TFBGA package helps reduce controller size, but high-current routing, analog isolation, thermal management, and ground-plane design remain board-level responsibilities.
おすすめ
Communications Equipment
The STM32F745VEH6 can serve as the control processor in communications equipment where a 216 MHz Cortex-M7 core and 512 KB of Flash are useful for protocol handling, supervision, and real-time control. The verified results do not confirm Ethernet, USB, CAN, serial-interface, or radio functionality, so the selected communications peripheral must be checked in the official STM32F745VE documentation. In a gateway or embedded network controller, the device would sit between a physical interface and higher-level application logic. Its 100-TFBGA footprint supports compact hardware but requires verified differential-pair routing, impedance control, and clean separation between sensitive communications paths and switching circuitry.
おすすめ
Audio and DSP-Assisted Control
The Cortex-M7 processing capability of the STM32F745VEH6 makes it relevant for audio front ends and DSP-assisted embedded control, where real-time sampling, filtering, and control must be coordinated. The verified data identifies the processor architecture and maximum frequency but does not specify audio interfaces, DACs, ADCs, DMA channels, or memory bandwidth. Designers should therefore confirm the exact peripheral set before selecting it for a signal-chain role. The 100-TFBGA package can support compact multi-function boards, while analog and digital sections should be partitioned carefully. Power, clock jitter, grounding, and signal-integrity layout can materially affect audio performance and must be validated with the official electrical and application guidance.
おすすめ
Test and Measurement Systems
The STM32F745VEH6 is relevant to compact test and measurement systems that need deterministic embedded processing, local control, and a high-performance core at up to 216 MHz. Its 512 KB of Flash can support firmware, calibration logic, and protocol handling, although RAM and external-interface requirements are not specified in the verified search data. A measurement instrument could use the MCU for sensor conditioning control, data acquisition sequencing, display management, and USB or Ethernet connectivity. The dense 100-TFBGA package reduces footprint but requires accurate ball assignment, multilayer escape routing, and careful analog-versus-digital partitioning. Confirm ADC, timer, DAC, communication, and operating-temperature specifications against the official manufacturer documentation before architecture approval.
おすすめ
Connected Embedded Products
The STM32F745VEH6 can serve as the central MCU in connected embedded products where a 216 MHz Cortex-M7 core provides room for application logic, communications, and control tasks. The confirmed 512 KB Flash capacity is a useful baseline for firmware planning, but developers must check the unverified RAM capacity and the exact peripheral complement before selecting it. A practical product architecture would divide boot code, real-time control, communications middleware, and application services while monitoring memory and CPU margins. The compact 100-TFBGA package helps minimize PCB area, but it also increases assembly and inspection complexity. Validate package tolerances, thermal performance, supply requirements, and production sourcing before committing to volume manufacturing.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: STM32F745VEH6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | STM32H725VGH3 | STM32H723VGH6 | STM32F765VGH6 |
|---|---|---|---|---|
| Package | 100-TFBGA, 8 x 8 mm | 100-TFBGA | 100-TFBGA | 100-TFBGA |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Pin Compatibility | Target device; 100-TFBGA | Same package class; pin-to-pin compatibility not established | Same package class; pin-to-pin compatibility not established | Same package class; pin-to-pin compatibility not established |
| Lifecycle Status | Active | Active | Active | Active |
主な差別化要因
- Confirmed STM32F745VE family positioning （vs STM32H725VGH3)
- Confirmed 512 KB Flash baseline （vs STM32H723VGH6)
- Exact package and package-size identification （vs STM32F765VGH6)
設計ノート
Do not release the power tree from distributor summaries alone. Verify the STM32F745VEH6 operating-voltage range, internal-regulator requirements, power-up sequence, decoupling values, and maximum current from the official STMicroelectronics documentation. The verified results confirm a 3.3 V-class commercial listing but do not provide the complete electrical limits. Reserve local bulk and high-frequency decoupling directly at the device supply balls, and confirm ground-reference requirements in the package stack-up.
Treat the 100-TFBGA package as a high-density escape-routing problem. Use the official ball map and land pattern, maintain the manufacturer’s pad and solder-mask definitions, and route power, clock, and sensitive signals before committing to a board outline. Check via-in-pad, microvia, and thermal-via requirements against the assembly capability. The 8 x 8 mm body does not mean the finished board requires only an 8 x 8 mm footprint.
Validate clock and communication paths with the final stack-up. If the design uses high-speed serial links, establish target impedance, insertion-loss, return-path continuity, and connector or transceiver requirements rather than relying on the 216 MHz CPU frequency alone. Keep the MCU’s power and clock return paths continuous, separate noisy switching nodes from analog or communication inputs, and use the official pin alternate-function matrix before assigning every ball.
The supplied data does not provide junction-to-ambient or junction-to-case thermal resistance for this exact 100-TFBGA device, so do not infer thermal performance from package size alone. Estimate total dissipation from the actual clock, I/O, analog, and memory activity using the official electrical characteristics, then validate the PCB and enclosure with thermal analysis and instrumentation. Provide thermal-via and copper spreading only as supported by the manufacturer’s package guidance.
コンプライアンス情報
The supplied comparison data identifies RoHS as Yes and REACH as compliant. The target is not identified as an automotive-qualified AEC-Q100 device, and lead-free, halogen-free, and conflict-minerals status were not supplied.
