STM32F765NIH7 - 216MHz Cortex-M7 2MB MCU | STMicroelectronics
部品番号: STM32F765NIH7 ✓ 生産中STM32F765NIH7 概要
A Cortex-M7 microcontroller is a 32-bit reduced-instruction-computing processor commonly used for real-time control, communications, audio, graphics, and industrial automation. In the product hierarchy, STM32F765NIH7 is a microcontroller, embedded processor, semiconductor, and programmable control device. The STM32F7 family combines a high-performance CPU core with dedicated Flash, SRAM, communication interfaces, timers, and analog peripherals within one integrated package.
The verified product information identifies an Arm Cortex-M7 core operating at up to 216 MHz, 2 MB of Flash organized as 2M x 8 bits, and a 216-TFBGA package. The manufacturer describes the STM32F765xx family as a high-performance 32-bit MCU with FPU and DSP capability. The 216 MHz operating point is useful for computationally intensive control loops, digital signal processing, human-machine interfaces, and connected industrial equipment. The large 2 MB Flash capacity provides room for substantial application code, firmware updates, and embedded assets.
The STM32F765NIH7 combines CPU performance with the integration expected from a mixed-signal embedded platform. Its Cortex-M7 architecture can accelerate code containing intensive arithmetic, filtering, and control operations, while integrated peripherals reduce the need for external interface devices. Because the supplied distributor and manufacturer excerpts do not enumerate the complete peripheral set, specific peripheral counts, SRAM capacity, operating-temperature limits, and maximum I/O specifications should be confirmed in the manufacturer datasheet before design release.
Typical uses include industrial automation, motor and motion control, communications equipment, audio and digital signal processing, test and measurement instruments, and high-end human-machine interfaces. In these systems, the 216 MHz core provides processing headroom for concurrent control and communication tasks, while the 2 MB Flash budget accommodates larger embedded applications. The 13 x 13 mm TFBGA package can support dense designs but demands careful PCB layout and assembly planning because its ball pitch and thermal characteristics differ from leaded packages.
Designers should prioritize the manufacturer's reference schematic, pin multiplexing guidance, decoupling requirements, clock configuration, and exposed-pad recommendations when laying out a new board. Because this exact 216-ball package is not represented in the available package-diagram library, no verified pin-level diagram is asserted here. Firmware, bootloader behavior, memory organization, and peripheral availability must also be checked against the exact STM32F765NIH7 ordering code and its applicable device datasheet.
This page consolidates verified manufacturer and distributor information, distinguishes confirmed specifications from fields requiring datasheet review, and explains the engineering trade-offs associated with a high-speed Cortex-M7 MCU in a compact 216-pin TFBGA. It also provides practical sourcing guidance and a conservative drop-in assessment rather than presenting unverified substitutes as direct replacements.
ドロップイン代替品: STM32F765NIH7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: STM32F765NIH7 （同一形状・フットプリント） — 相違点: CPU Core, Instruction Set, Product Type.
STM32F767NIH7
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →STM32F769NIH7
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
STM32F765NIH7 最大定格＆電気的特性
| Product Type | 32-bit microcontroller |
| CPU Core | Arm Cortex-M7 |
| Instruction Set | 32-bit RISC |
| Maximum CPU Frequency | 216 MHz |
| Internal Flash Memory | 2 MB (2M x 8 bits) |
| DSP Capability | DSP and FPU capability |
| Package Type | 216-TFBGA |
| Package Dimensions | 13 x 13 mm |
| Pin or Ball Count | 216 |
| 実装タイプ | Surface mount |
| 電源電圧 | 3.3 V |
| Performance | 462 DMIPS |
STM32F765NIH7 13 x 13 mm ピン配置ガイド
STM32F765NIH7 (13 x 13 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: STM32F765NIH7.
詳細は データシート をご参照ください。
主な用途
STM32F765NIH7 の用途: 6 件s: Industrial Automation Controllers, Motor and Motion Control, Audio and Digital Signal Processing, Communications Equipment, Test and Measurement Instruments, Human-Machine Interface Systems.
Industrial Automation Controllers
The STM32F765NIH7 fits industrial automation controllers that combine real-time sampling, communications, and supervisory control in one compact processor. Its Arm Cortex-M7 core operates up to 216 MHz, providing headroom for DSP-style calculations and multi-protocol handling, while 2 MB of Flash supports substantial application firmware. The 216-TFBGA package helps preserve board area in dense control systems, although it requires fine-pitch PCB construction, careful decoupling, and assembly validation. Designers should verify the exact peripheral mix, operating-temperature grade, and industrial EMC requirements against the manufacturer datasheet before releasing a production design.
おすすめ
Motor and Motion Control
The STM32F765NIH7 is appropriate for motor-control and motion-control systems that require faster control-loop execution than a basic MCU can provide. The 216 MHz Cortex-M7 core can execute DSP and FPU workloads while maintaining communication and supervisory tasks, and the 2 MB Flash capacity accommodates control algorithms and diagnostics. Its 216-ball package exposes more signal options than a small leaded MCU, but every motor-interface signal, timer channel, and power pin must be mapped from the official pinout. Firmware must also be validated for timing margins, fault handling, and safe output states during development.
おすすめ
Audio and Digital Signal Processing
The STM32F765NIH7 can serve in audio and digital-signal-processing equipment where filtering, mixing, modulation, or other arithmetic must run alongside control functions. Its 216 MHz Cortex-M7 core provides DSP and FPU capability, while 2 MB of Flash allows room for substantial algorithms and audio-control firmware. The device is better suited to processing-intensive signal paths than to simple volume-control tasks. Designers should confirm the required audio peripherals, external memory interface, clocking plan, and low-latency peripheral routing in the datasheet; the 216-TFBGA layout also needs short, controlled routing to minimize signal-integrity problems.
おすすめ
Communications Equipment
The STM32F765NIH7 is suitable for communication equipment requiring real-time protocol handling and application-level processing in a single embedded controller. At up to 216 MHz with DSP capability, it can divide processing between framing, buffering, user-interface logic, and diagnostics, while 2 MB of Flash accommodates application code and protocol tables. Its high pin count provides access to multiple communication peripherals, but the designer must select the required USART, SPI, Ethernet, USB, or other interfaces from the exact device configuration. Board-level signal integrity, impedance control, isolation, and firmware timing should be validated together rather than treating the MCU as a generic replacement.
おすすめ
Test and Measurement Instruments
The STM32F765NIH7 fits test and measurement instruments that combine responsive front-end control with communications, display logic, and data processing. The 216 MHz Cortex-M7 performance provides useful throughput for calibration, signal reconstruction, filtering, and control, and 2 MB of Flash supports embedded operating code. The dense 216-TFBGA package is valuable in compact portable instruments but increases PCB and assembly complexity compared with a leaded package. Precise analog conversion, trigger timing, reference designators, and synchronization should be developed from manufacturer reference material. The verified excerpts do not specify every peripheral, so engineers must confirm required converter and timer resources directly.
おすすめ
Human-Machine Interface Systems
The STM32F765NIH7 supports human-machine interface systems that combine graphics or display updates, touch input, communications, and application logic. Its 216 MHz Cortex-M7 core and 2 MB Flash give designers more code and computation capacity than a basic embedded controller, allowing meaningful local processing instead of continuous host dependence. The 216-pin package can support dense mixed-signal and interface connections, although routing to display interfaces and touch controllers must follow the exact pin mux. Keep high-speed display and touch traces short, provide multiple decoupling paths, and validate the final stack-up. The verified data does not define a specific LCD controller, so interface suitability must be confirmed from the datasheet.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: STM32F765NIH7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | STM32F767NIH7 | STM32F769NIH7 |
|---|---|---|---|
| Product Type | 32-bit Arm Cortex-M7 microcontroller | 32-bit Arm Cortex-M7 microcontroller | 32-bit Arm Cortex-M7 microcontroller |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 216-TFBGA (13 x 13 mm) | 216-TFBGA (13 x 13 mm) | 216-TFBGA (13 x 13 mm) |
| Maximum CPU Frequency | 216 MHz | Up to 216 MHz | Up to 216 MHz |
| CPU Core | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 |
| DSP and FPU Capability | DSP and FPU capability | DSP and FPU capability | DSP and FPU capability |
主な差別化要因
- Exact verified STM32F765 ordering-code identity （vs STM32F767NIH7)
- Confirmed 216 MHz performance class （vs STM32F769NIH7)
- 2 MB internal Flash confirmed for the target （vs STM32F767NIH7)
- Dense 216-ball integration （vs STM32F769NIH7)
設計ノート
Treat the 216-TFBGA as a fine-pitch, assembly-sensitive design. Use the manufacturer land pattern and a PCB stack-up that supports the specified escape routing, place input and output decoupling capacitors directly beside their assigned supply pins, and provide a continuous low-impedance ground reference beneath the device. Review ball assignments and alternate functions against the exact orderable part before routing; the family datasheet is the controlling document.
Plan the supply network around the MCU's exact voltage and current requirements from the datasheet. The distributor information identifies a 3.3 V part, but it does not provide the complete voltage tolerance, regulator, or current budget. Use local bulk and high-frequency decoupling, control return-current paths, and verify startup sequencing across all externally powered interfaces. Do not infer power limits from the family marketing description alone.
Estimate power dissipation from the actual operating voltage, core activity, clock rate, and enabled peripherals rather than using the maximum 216 MHz frequency as a steady-state assumption. The supplied excerpts do not provide the junction-temperature limit or package thermal resistance, so obtain those values from the manufacturer datasheet. Validate thermal performance in the final enclosure and with production-representative PCB copper and airflow.
Route high-speed clocks and communication interfaces as controlled-impedance signals with short returns and avoid splitting ground planes beneath the MCU. Keep crystal and clock circuitry compact, isolate noisy switching nodes, and follow the manufacturer's reference layout for analog and digital interfaces. Because the complete pin map was not available in the verified excerpts, signal assignment must be completed from the official STM32F765BI family datasheet.
Do not treat another STM32F7 Cortex-M7 device as interchangeable merely because it uses a similar package. Verify every ball assignment, alternate function, supply pin, reset connection, boot configuration, clock mapping, memory configuration, and peripheral population. A footprint fit is not enough: code, bootloader, peripheral behavior, and timing must also be validated before using any alternative ordering code.
コンプライアンス情報
The supplied manufacturer and distributor excerpts do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than being inferred from general STMicroelectronics practices.
