STM32WBA5MMGH6TR - Cortex-M33 BLE 5.4/Thread/Zigbee Module | ST
部品番号: STM32WBA5MMGH6TR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $15.27 | $15.27 |
| 10 | $14.2 | $142.00 |
| 100 | $12.1 | $1,210.00 |
| 500 | $10.45 | $5,225.00 |
| 1,000 | $9.3 | $9,300.00 |
STM32WBA5MMGH6TR 概要
A wireless MCU module combines an application processor, memory, peripherals, and a certified RF subsystem in a single surface-mount land-grid package. In the broader hierarchy, the STM32WBA5MMGH6TR sits under MCU module -> Wireless SoC -> short-range transceiver, where the integrated Cortex-M33 host manages both application code and the radio link layer. This integration eliminates the need for an external radio co-processor, reduces BOM count, and shortens certification time for end products targeting Bluetooth LE, Thread, Zigbee, or Matter ecosystems.
Key features of the STM32WBA5MMGH6TR include 1 Mbyte of Flash, up to 100 MHz Cortex-M33 core with TrustZone, Bluetooth LE 5.4 certification-ready radio, integrated 2.4 GHz antenna matching network, and support for Thread/Zigbee via 802.15.4. The module exposes GPIO, I2C, SPI, USART, and ADC peripherals on the LGA pads. Security is enhanced by TrustZone isolation, secure boot, and hardware cryptographic accelerators. Ultra-low-power operation targets always-on battery-powered IoT endpoints.
Architecturally, the device pairs an applications Cortex-M33 core with a dedicated 2.4 GHz radio subsystem. The radio chain supports BLE 5.4 (Coded PHY/LE 2M), IEEE 802.15.4 O-QPSK, and proprietary modes. RF matching, balun, and antenna tuning are integrated, removing the need for external RF components. The 76-pin LGA exposes digital I/O, debug (SWD/JTAG), and RF test access, enabling both prototype bring-up and production assembly via standard SMT lines.
Typical applications include Bluetooth LE lighting, Matter-over-Thread smart-home devices, Zigbee sensors, BLE wearables, industrial wireless sensor nodes, and asset-tracking beacons. The combination of Cortex-M33 headroom with multi-protocol 2.4 GHz radio makes it well suited to gateways bridging Thread/Zigbee and BLE ecosystems.
When designing in the STM32WBA5MMGH6TR, follow ST's recommended PCB footprint and keep the antenna keep-out region clear of copper and plastic. Provide adequate decoupling near the supply pads and verify regulatory compliance for the end device in your target region.
This page synthesizes distributor pricing, drop-in STM32WBA module alternatives, and practical PCB/RF layout guidance not consolidated in the ST datasheet alone.
ドロップイン代替品: STM32WBA5MMGH6TR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
STM32WBA5MEGH6TR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
STM32WBA5MIGH6TR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
STM32WBA5CGH6TR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
STM32WBA6MMGH6TR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
STM32WBA5MMGH6
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
STM32WBA5MMGH6TR 仕様（メーカー公開）
| Core Architecture | Arm Cortex-M33 with TrustZone |
| Maximum Core Clock | 100 MHz |
| Flash Memory | 1 Mbyte |
| Wireless Protocols | Bluetooth LE 5.4, IEEE 802.15.4, Thread, Zigbee, Matter |
| Operating Frequency Band | 2.4 GHz (2.400 - 2.4835 GHz) |
| Antenna | Integrated, chip-style |
| パッケージ | LGA-76 (8 x 12.5 mm) |
| 実装タイプ | Surface Mount |
| Security | TrustZone, secure boot, hardware crypto accelerators |
| Certifications | Bluetooth SIG 5.4, FCC/IC/CE pre-certification (module-dependent) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
STM32WBA5MMGH6TR インターフェースとコネクタ
STM32WBA5MMGH6TR は、メーカーが公開している以下のインターフェースとコネクタを備えています: ワイヤレス。拡張ヘッダーのピン配置、コネクタのピン番号、電気的制限はメーカーのドキュメントで定義されています。
| ワイヤレス | Bluetooth LE 5.4, IEEE 802.15.4, Thread, Zigbee, Matter |
詳細は メーカー資料 をご参照ください（拡張ヘッダーのピン配置とコネクタのピン番号の詳細）。
主な用途
STM32WBA5MMGH6TR の用途: 6 件s: Matter-over-Thread Smart-Home Devices, Bluetooth LE Lighting and Controls, Zigbee Wireless Sensor Nodes, BLE Wearables and Fitness Bands, Industrial Wireless Sensor Networks, BLE Asset-Tracking Beacons.
Matter-over-Thread Smart-Home Devices
The STM32WBA5MMGH6TR's integrated 802.15.4 radio plus Cortex-M33 with TrustZone and 1 Mbyte Flash directly satisfies Matter-over-Thread end-node requirements in a single SMT module. According to the ST product brief, the integrated RF chain removes external balun/matching components, while TrustZone isolates commissioning credentials from application code. Place the part on a 4-layer PCB with a continuous RF ground pour and route the antenna keep-out region free of copper planes and plastic housing above the antenna pad.
おすすめ
Bluetooth LE Lighting and Controls
The STM32WBA5MMGH6TR's BLE 5.4 radio with Coded PHY long-range support and 100 MHz Cortex-M33 host enables responsive lighting-control firmware with reliable mobile-app pairing. According to the ST datasheet, the integrated RF chain delivers robust BLE connectivity in dense 2.4 GHz environments typical of commercial lighting installations. Drive the LED string with an external constant-current driver referenced to one of the module's PWM-capable timers; use hardware crypto for secure commissioning tokens.
おすすめ
Zigbee Wireless Sensor Nodes
The STM32WBA5MMGH6TR's 802.15.4 radio plus 1 Mbyte Flash comfortably hosts the Zigbee 3.0 cluster library plus custom sensor firmware on a Cortex-M33 core. According to the ST product brief, the integrated module simplifies Zigbee certification by reusing the pre-certified 2.4 GHz chain. Read sensors over I2C or SPI; the module's low-power Run and Stop modes extend battery life for years on a single CR2032 in periodic-reporting sensors.
おすすめ
BLE Wearables and Fitness Bands
The STM32WBA5MMGH6TR's low-power Cortex-M33 host, BLE 5.4 radio, and small 8 x 12.5 mm LGA module make it suitable for wearables where PCB area and battery life are constrained. According to ST's low-power data, the module's deep-sleep currents and fast wake-up enable always-on heart-rate or step-counting while staying within wearable power budgets. Pair with an analog front-end over SPI; use the integrated crypto for secure BLE pairing.
おすすめ
Industrial Wireless Sensor Networks
The STM32WBA5MMGH6TR's Cortex-M33 host with TrustZone plus 802.15.4 radio enables industrial-grade wireless nodes where secure firmware updates and reliable mesh connectivity are required. According to the ST datasheet, the industrial-temp-grade variants support harsh-environment deployment with secure boot ensuring only signed firmware runs on the device. Use Thread or Zigbee mesh to extend range across factory floors; route diagnostics over UART to a host PLC.
おすすめ
BLE Asset-Tracking Beacons
The STM32WBA5MMGH6TR's BLE 5.4 advertising extensions, low-power modes, and integrated antenna make it well suited to battery-powered asset-tracking beacons with multi-year coin-cell lifetimes. According to the ST datasheet, the module's deep-sleep current and fast advertising-mode wake-up minimize average consumption for periodic beacon transmissions. Configure non-connectible filters plus Eddystone or proprietary payloads; reuse the same PCB across SKUs with different firmware loads.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: STM32WBA5MMGH6TR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | STM32WBA5MEGH6TR | STM32WBA5MIGH6TR | STM32WBA5CGH6TR | STM32WBA6MMGH6TR | STM32WBA5MMGH6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | LGA-76 (8 x 12.5 mm) | LGA-76 (8 x 12.5 mm) - same | LGA-76 (8 x 12.5 mm) - same | LGA-76 (8 x 12.5 mm) - same | LGA-76 (8 x 12.5 mm) - same | LGA-76 (8 x 12.5 mm) - same |
| Core | Cortex-M33 100 MHz | Cortex-M33 100 MHz | Cortex-M33 100 MHz | Cortex-M33 100 MHz | Cortex-M33 (WBA6) | Cortex-M33 100 MHz |
| Flash Memory | 1 Mbyte | 512 Kbyte (-50%) | 1 Mbyte | 1 Mbyte | 1 Mbyte | 1 Mbyte |
| Wireless Protocols | BLE 5.4, 802.15.4, Thread, Zigbee | BLE 5.4, 802.15.4, Thread, Zigbee | BLE 5.4, 802.15.4, Thread, Zigbee | BLE 5.4 only | BLE 5.4, 802.15.4, Thread, Zigbee | BLE 5.4, 802.15.4, Thread, Zigbee |
| TrustZone Security | Yes | Yes | Yes | Yes | Yes | Yes |
| Temperature Grade | Extended (consumer) | Extended (consumer) | Industrial (-40 to +85 C) | Extended (consumer) | Extended (consumer) | Extended (consumer) |
| Packaging Form | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tray |
主な差別化要因
- Multi-protocol 2.4 GHz radio with Cortex-M33 TrustZone host （vs ESP32-S3-MINI-1)
- 1 Mbyte Flash for full BLE+Thread/Zigbee stacks （vs STM32WBA5MEGH6TR)
- Integrated antenna matching and pre-certified RF chain （vs Discrete MCU + nRF52840)
- LGA-76 footprint shared across the WBA5 family （vs STM32WB series modules)
設計ノート
Keep the antenna keep-out region directly above the LGA module completely free of copper planes, traces, and plastic components on every PCB layer. According to the ST datasheet antenna layout section, an unobstructed antenna keep-out zone of typically 5 mm x 8 mm is required to maintain the module's pre-qualified RF performance and FCC/IC/CE compliance. Estimated: ground the keep-out boundary with a continuous ground pour on the layer directly beneath the LGA footprint.
Provide local decoupling on every VDD pad with a 100 nF ceramic capacitor placed within 1 mm of each supply pin and a bulk 10 uF capacitor near the module's main VDD. According to the ST datasheet power-tree, the 2.4 GHz radio's TX bursts draw short peak currents that couple into the digital rails; without local decoupling these bursts create spurious emissions and degrade BLE/802.15.4 link margin.
The LGA-76 module's thermal performance depends primarily on the PCB ground pour connected to the central GND balls. According to the ST datasheet thermal section, the module's theta_JA of approximately 30 C/S on a 4-layer board with a 50 x 50 mm copper ground pour keeps the junction-to-ambient rise within 30 C at typical TX currents. Avoid placing heat sources directly above the antenna keep-out region.
Do not route digital signals under the antenna keep-out zone, and do not place tall components near the antenna pad that could detune the integrated antenna. According to the ST reference design checklist, common RF failures in production originate from keep-out encroachment, missing ground stitching vias around the LGA perimeter, or solder voids under the central thermal/ground balls. Inspect the LGA solder joints via X-ray after reflow.
コンプライアンス情報
RoHS and lead-free compliance per distributor listings. Bluetooth SIG 5.4 and FCC/IC/CE module-level pre-certification depend on the end-product configuration; consult ST's certification documents for the exact regulatory IDs that travel with the module.
