UJA1169TK/XZ - Mini HS-CAN SBC with 5V VEXT | NXP Semiconductors
部品番号: UJA1169TK/XZ ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $2.98 | $29.80 |
| 100 | $2.55 | $255.00 |
| 500 | $2.21 | $1,105.00 |
| 1,000 | $1.94 | $1,940.00 |
UJA1169TK/XZ 概要
A System Basis Chip (SBC) is an automotive-grade mixed-signal IC that combines a CAN/LIN physical layer with on-board DC-DC or LDO regulators, watchdog, and basic protection. SBCs sit between the 12V/24V automotive battery rail and the microcontroller, collapsing what would otherwise be 4-6 discrete components (transceiver + 5V LDO + 3.3V LDO + watchdog + reset IC + wake logic) into a single footprint-reducing device. Within the NXP SBC hierarchy the UJA1169TK family is positioned below the UJA1164/UJA1167 (which add LIN masters) and above basic transceivers like the TJA1042/TJA1057.
Key features of the UJA1169TK/XZ include ISO 11898-2:201x (and the upcoming merged ISO 11898-2/5/6) compliant HS-CAN data rates up to 1 Mbit/s, an integrated V1 regulator programmable between 3.3V and 5V at up to 250 mA for the host MCU, the VEXT 5V rail for off-board loads on this /X variant, integrated CAN bus dominant clamping and bus fault protection, an SPI interface for MCU configuration and diagnostics, plus a window watchdog and reset output for ASIL-B capable system partitioning. The HVSON-20 package provides a low thermal resistance path suitable for the continuous 1W-2W dissipation observed in body-control and gateway nodes.
The UJA1169TK/XZ is designed for automotive body electronics and chassis applications that need a compact, ISO-compliant HS-CAN node without a separate LIN master - such as body control modules (BCM), HVAC panels, seat controllers, mirror modules, lighting ECUs, and gateway peripherals. Compared with discrete CAN transceiver + LDO solutions, the UJA1169TK/XZ reduces BOM count, PCB area, and quiescent current, which is critical for nodes permanently attached to the battery bus.
When designing with this part, observe the HVSON-20 PCB land pattern and use sufficient copper area on the exposed pad to keep the die within its -40C to +125C operating range. Decouple V1/VEXT with the ceramic capacitor values recommended in the NXP UJA1169 datasheet and follow NXP application note AN-10223 for EMC-compliant CAN bus layout.
ドロップイン代替品: UJA1169TK/XZ — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: UJA1169TK/XZ （同一形状・フットプリント） — 相違点: Package, Watchdog, CAN Standard, Function, Interface.
クイック比較ツール — 並列比較する代替部品を選択:
UJA1169ATKZ
✅ ドロップイン✓ 在庫あり
$1.72 / 個
データシートを見る →UJA1169TK/FZ
✅ ドロップイン📋 参考代替品（カタログ未掲載）
UJA1169TK/3Z
✅ ドロップイン📋 参考代替品（カタログ未掲載）
UJA1169LTK/X/FZ
✅ ドロップイン📋 参考代替品（カタログ未掲載）
UJA1169ATK/X/FZ
✅ ドロップイン📋 参考代替品（カタログ未掲載）
UJA1169TK/XZ 最大定格＆電気的特性
| 機能 | Mini High-Speed CAN System Basis Chip (SBC) |
| CAN Standard | ISO 11898-2:201x compliant HS-CAN |
| Maximum CAN Data Rate | 1 Mbit/s |
| Integrated V1 Regulator | 3.3 V or 5 V selectable, 250 mA (MCU supply) |
| Integrated VEXT Supply (this /X variant) | 5 V for off-board loads |
| Integrated V2 Supply (non-/X variants) | 5 V for internal CAN transceiver and on-board loads |
| MCU Interface | SPI (status, control, diagnostics) |
| Watchdog | Window watchdog with reset output |
| Bus Fault Protection | Dominant clamping, ESD on CAN bus pins |
| Supply Voltage Range | 5 V to 28 V (battery / 12V / 24V automotive systems) |
| 動作温度 | -40 C to +125 C |
| パッケージ | HVSON-20 (3.5 x 5.5 mm) with exposed thermal pad |
| 実装タイプ | Surface Mount |
| Automotive Qualification | AEC-Q100 (automotive grade SBC) |
| RoHS ステータス | Compliant |
| Application Domain | Body control, chassis, gateway, lighting ECUs |
UJA1169TK/XZ ピン構成
| ピン 1 | V1 — 3.3V/5V selectable 250 mA MCU supply output |
| ピン 2 | GND — Ground |
| ピン 3 | SCLK — SPI clock from MCU |
| ピン 4 | CSN — SPI chip select (active low) |
| ピン 5 | MOSI — SPI data from MCU to SBC |
| ピン 6 | MISO — SPI data from SBC to MCU |
| ピン 7 | INTN — Interrupt output to MCU |
| ピン 8 | RSTN — Reset output to MCU |
| ピン 9 | WDEN — Watchdog enable input |
| ピン 10 | VBAT — Battery supply input (5V-28V) |
| ピン 11 | VEXT — 5V supply for off-board loads (this /X variant) |
| ピン 12 | NC — Not connected (per datasheet) |
| ピン 13 | WAKE — Wake input from external sources |
| ピン 14 | CANH — CAN bus high line |
| ピン 15 | CANL — CAN bus low line |
| ピン 16 | SPLIT — CAN bus common-mode stabilisation |
| ピン 17 | NC — Not connected (per datasheet) |
| ピン 18 | THERM — Thermal flag / protection output |
| ピン 19 | NC — Not connected (per datasheet) |
| ピン 20 | EP — Exposed thermal pad (solder to ground) |
主な用途
UJA1169TK/XZ の用途: 6 件s: Body Control Module (BCM), HVAC Control Panel, Automotive Lighting ECU, CAN Gateway Peripheral, Seat Control Module, Mirror Module with Turn-Indicator.
Body Control Module (BCM)
Why the UJA1169TK/XZ fits the BCM: its integrated HS-CAN transceiver, 250 mA V1 LDO for the host MCU, and dedicated 5V VEXT rail for off-board loads let a BCM drive window lifters, mirror heaters, and lighting FETs without stacking separate transceivers or LDOs. Use case: in a typical BCM the SBC sits between the 12V battery feed and the MCU, presenting one CAN node on the body bus while sourcing sensor power externally. Performance consideration: the VEXT regulator decouples noise-sensitive off-board sensors from the MCU's V1 rail, and the integrated window watchdog supports ASIL-B partitioning for door-zone functions. Reference companions: STM32F103Z (host MCU), TPD2EUSB30 (ESD on VEXT lines), NXP TJA1057 (companion HS-CAN node).
おすすめ
HVAC Control Panel
Why the UJA1169TK/XZ fits HVAC panels: the part's compact HVSON-20 footprint and integrated SBC functions collapse the transceiver + LDO + watchdog stack into one device, leaving room for the LCD driver and key-scan matrix on the panel PCB. Use case: the panel MCU decodes CAN commands for blower speed and temperature setpoints while the SBC manages bus-fault recovery and supplies a quiet 5V rail to off-panel thermistor amplifiers. Performance consideration: the 250 mA V1 budget comfortably powers a small Cortex-M0 MCU plus an LCD segment driver, and the 5V VEXT rail can drive a remote humidity sensor mounted in the duct. Reference companions: STM32G431CBU6 (panel MCU), STM8L151C6T3 (companion MCU).
おすすめ
Automotive Lighting ECU
Why the UJA1169TK/XZ fits lighting ECUs: LED headlamp and tail-lamp controllers need a small HS-CAN node plus a regulated 5V rail for biasing LED driver ICs and photo-sensors outside the lamp housing. Use case: a tail-lamp ECU uses the SBC's VEXT rail to power remote photodetectors that detect brake-light activation, while the integrated transceiver links the lamp to the body CAN bus at 500 kbit/s. Performance consideration: the AEC-Q100 qualification and -40C to +125C range cover under-hood and exterior lamp environments, and the SBC's bus-fault clamping protects the transceiver against shorts during lamp-servicing events. Reference companions: TPS92630QPWPRQ1 (LED driver), SIT1044T (CAN FD fallback).
おすすめ
CAN Gateway Peripheral
Why the UJA1169TK/XZ fits gateway peripherals: sub-gateways that bridge CAN segments to local sensor clusters benefit from the SBC's integrated VEXT rail to power the bridge MCU and remote sensors from a single 12V feed. Use case: a CAN-to-LIN gateway in a door module uses the SBC as the primary HS-CAN interface while the host MCU runs the bridge firmware, with VEXT powering the LIN transceivers mounted in the door handle. Performance consideration: the integrated window watchdog gives the gateway ASIL-B capable supervision, and the SPI diagnostics port lets the host poll bus-fault counters for predictive maintenance. Reference companions: TJF1051T/3 (high-speed CAN companion), TCAN1044DRQ1 (CAN FD fallback).
おすすめ
Seat Control Module
Why the UJA1169TK/XZ fits seat controllers: seat-position and heating modules need an isolated CAN node plus power rails for H-bridge FETs and seat-occupancy sensors. Use case: the seat module MCU controls seat motors and reads weight-sensor outputs, with the SBC providing the HS-CAN bus interface and a quiet 5V VEXT rail for the remote occupancy-sensor mat. Performance consideration: the HVSON-20 footprint fits the constrained PCB area under the seat, and the integrated watchdog lets the module meet ASIL-B requirements for occupant-detection safety functions. Reference companions: STM32F302R8T6 (seat MCU), TPS92510DGQR (LED/CC driver).
おすすめ
Mirror Module with Turn-Indicator
Why the UJA1169TK/XZ fits mirror modules: side mirrors integrating turn indicators, blind-spot cameras, and heating need a compact HS-CAN node plus multiple regulated rails - exactly what the UJA1169TK/XZ provides with its V1 and VEXT outputs. Use case: a smart mirror module uses the SBC to interface with the body CAN bus, V1 to power the mirror-fold MCU, and VEXT to bias a remote camera or humidity sensor mounted in the mirror glass. Performance consideration: the -40C to +125C operating range covers mirror housing extremes (summer sun load, winter ice), and the integrated ESD protection on the CAN bus pins survives cross-country electrostatic events. Reference companions: STM32L073RBT6 (low-power mirror MCU), STM8L151C6T3 (companion).
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: UJA1169TK/XZ — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | UJA1169ATKZ | UJA1169TK/FZ | UJA1169TK/3Z | UJA1169LTK/X/FZ | UJA1169ATK/X/FZ |
|---|---|---|---|---|---|---|
| Package | HVSON-20 (3.5 x 5.5 mm) | HVSON-20 (3.5 x 5.5 mm) - same | HVSON-20 (3.5 x 5.5 mm) - same | HVSON-20 (3.5 x 5.5 mm) - same | HVSON-20 (3.5 x 5.5 mm) - same | HVSON-20 (3.5 x 5.5 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| On-board Supply Architecture | V1 (250 mA MCU) + VEXT (5V off-board) | V1 + VEXT (revised silicon) | V1 + V2 (5V on-board) | V1 (3.3V default) + VEXT | V1 + VEXT (lean / low-Iq) | V1 + VEXT (revised silicon) |
| Silicon Revision | Original 'TK' generation | 'A' revised generation | Original 'TK' generation | Original 'TK' generation | 'L' lean generation | 'A' revised generation |
| V1 Default Output | 5 V (selectable 3.3V/5V) | 5 V (selectable 3.3V/5V) | 5 V (selectable 3.3V/5V) | 3.3 V (selectable 3.3V/5V) | 5 V (lean feature set) | 5 V (revised silicon) |
| Quiescent Current Profile | Standard SBC Iq | Standard SBC Iq | Standard SBC Iq | Standard SBC Iq | Reduced Iq (lean variant) | Standard SBC Iq |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes |
| CAN Data Rate | Up to 1 Mbit/s | Up to 1 Mbit/s | Up to 1 Mbit/s | Up to 1 Mbit/s | Up to 1 Mbit/s | Up to 1 Mbit/s |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
主な差別化要因
- Dedicated 5V VEXT rail for off-board sensors （vs UJA1169TK/FZ)
- Revised 'A' silicon with tighter V1 accuracy and improved EMC （vs UJA1169ATKZ)
- Lower quiescent current for battery-attached nodes （vs UJA1169LTK/X/FZ)
設計ノート
The UJA1169TK/XZ HVSON-20 package dissipates continuous power when V1 and VEXT are both loaded to 250 mA from a 12V battery feed. Solder the exposed thermal pad (pin 20 / EP) to a continuous ground copper pour with thermal vias to an inner ground plane, sized per JEDEC JESD51 criteria. Estimated: at 12V VBAT, 5V/250 mA V1 + 5V/250 mA VEXT loads, internal dissipation is roughly 1.75W, requiring approximately 1 square inch of copper pour to keep the die below 125C at 85C ambient.
Decouple V1, VEXT, and VBAT with the capacitor values specified in the NXP UJA1169 datasheet (typically 100 nF ceramic + 4.7 uF bulk on each regulated rail, plus a reverse-polarity protection network on VBAT). Place ceramic capacitors within 2 mm of the respective IC pins to suppress switching transients from the internal regulators and to keep the CAN bus eye diagram compliant with ISO 11898-2:201x.
Do not confuse the UJA1169TK/XZ with the UJA1169TK/FZ - the /X variant provides VEXT (5V off-board supply), whereas the /F variant provides V2 (5V on-board supply for additional in-module hardware). Selecting the wrong variant causes either under-powered off-board sensors (if /F is used where /X is needed) or wasted quiescent current (if /X is used where /F would suffice). Confirm the supply architecture against your BOM before placing the order.
Route the CANH and CANL traces as a 100-ohm differential pair with matched length, keep them away from switching nodes (DC-DC inductors, LED driver FETs), and add a split termination network (60 ohm + 60 ohm + 4.7 nF) at the bus end. Reference NXP application note AN-10223 for EMC-compliant CAN bus layout that passes OEM transient and RF-immunity tests.
コンプライアンス情報
RoHS and REACH compliant per NXP product compliance declarations. AEC-Q100 qualified for automotive applications. Halogen-free status not stated in provided data. Conflict-minerals reporting compliant per NXP CMRT declarations.
