UJA1169ATKZ - Mini HS-CAN SBC, 5V/3.3V LDO 250mA | NXP
MPN: UJA1169ATKZ ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.2 | $3.20 |
| 10 | $2.89 | $28.90 |
| 100 | $2.55 | $255.00 |
| 500 | $2.2 | $1,100.00 |
| 1,000 | $1.95 | $1,950.00 |
| 3,000 | $1.72 | $5,160.00 |
UJA1169ATKZ Overview
A System Basis Chip (SBC) is a category of automotive networking IC that combines a physical-layer transceiver with on-chip power, supervision, and diagnostic functions into a single die. Within the broader hierarchy, SBCs sit between standalone CAN transceivers (which provide only the bus interface) and full ECU power-management companions (PMICs), allowing one part to replace what traditionally required three or four discrete devices. The UJA1169 family achieves this by merging an HS-CAN physical layer with a low-drop linear regulator, a watchdog, an SPI configuration port, and a LIMP output for fail-safe system behavior.
Key features include CAN FD support up to 5 Mbit/s for modern in-vehicle networking bandwidth, integrated 250 mA LDO selectable between 3.3 V and 5 V to host an MCU without an external regulator, very low quiescent current in standby modes for permanently connected nodes, integrated watchdog with window or timeout behavior, SPI for control and status, and a LIMP pin for graceful system degradation. The HVSON-20 exposed pad provides a low thermal resistance path suitable for harsh automotive environments.
Architecturally, the device uses a mixed-signal BiCMOS process: the CAN transceiver meets ISO 11898-2:2016 (and the upcoming merged ISO 11898-2/5/6 standard for selective wake-up and CAN FD), while the regulator is implemented as a high-side series pass element with reverse-polarity and load-dump protection suitable for 12 V automotive battery rails. Battery/supply voltage can reach 28 V (with load-dump transient tolerance typical for 12 V systems).
Typical applications include automotive body control modules (BCMs), gateway and CAN nodes requiring a regulated MCU rail, network sensors and actuators, HVAC controllers, seat/door/zone modules, and anywhere an HS-CAN node with integrated microcontroller power is needed to shrink the BOM.
When designing with this part, derate the 250 mA regulator headroom against the V1 voltage tolerance, since a 12 V battery input powering a 5 V, 200 mA MCU load dissipates roughly 1.4 W in the package. Sufficient copper area on the exposed pad is recommended to keep the junction within the automotive temperature range.
This page synthesizes NXP distributor pricing, qualified drop-in alternative cross-references, and practical automotive-node design notes that go beyond the manufacturer datasheet itself.
Drop-in alternatives for UJA1169ATKZ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with UJA1169ATKZ (same form factor and footprint) — differing in Package, Watchdog, CAN Standard, Operating Temperature, Product Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
UJA1169ATK/XZ
✅ Drop-In📋 Reference alternative (not in catalog)
UJA1169ATK/FZ
✅ Drop-In📋 Reference alternative (not in catalog)
UJA1169ATK/X
✅ Drop-In📋 Reference alternative (not in catalog)
UJA1169ATK/F/3Z
✅ Drop-In✓ In Stock
$2.31 / Unit
View Datasheet →UJA1169ATK/X/F
✅ Drop-In📋 Reference alternative (not in catalog)
UJA1169ATKZ Specifications
| Product Type | CAN System Basis Chip (SBC) |
| CAN Standard | ISO 11898-2:2016 / SAE J2284-1 to -5 (HS-CAN) |
| CAN FD Data Rate | Up to 5 Mbit/s |
| Integrated Regulator (V1) | 5 V or 3.3 V selectable, 250 mA |
| Supply Voltage Range | 3 V to 28 V |
| Interface | SPI (Serial Peripheral Interface) |
| Watchdog | Integrated window/timeout watchdog |
| LIMP Output | Yes (fail-safe system indication) |
| Operating Temperature | -40C to +125C (automotive grade) |
| Package | 20-HVSON (3.5 x 5.5 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Quiescent Current | Very low (standby modes, see datasheet) |
| Bus Termination | Internal (split termination, integrated) |
| Reverse Battery Protection | Yes |
| Load-Dump Protection | Yes (automotive 12 V system transient) |
UJA1169ATKZ 20-hvson (3.5 x 5.5 mm) with exposed pad Pin Configuration Guide
Pin configuration for UJA1169ATKZ (20-hvson (3.5 x 5.5 mm) with exposed pad package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for UJA1169ATKZ.
Refer to the datasheet for full pin configuration.
Typical Applications
UJA1169ATKZ is suitable for 6 applications: Automotive Body Control Module (BCM), Automotive CAN Network Sensor Node, HVAC and Climate Control Module, Door/Seat/Zone Module with HS-CAN Link, CAN-LIN Gateway Edge Node, Industrial CAN-Node with 24 V Bus.
Automotive Body Control Module (BCM)
The UJA1169ATKZ is well suited to BCM and zonal controller applications because it collapses an HS-CAN physical layer, a microcontroller voltage rail, and a hardware watchdog into one 3.5 x 5.5 mm HVSON-20 footprint - directly reducing PCB area at the body-domain ECU where space is at a premium. Its CAN FD support up to 5 Mbit/s lets it carry modern automotive Ethernet gateway traffic alongside classic CAN, while the integrated 5 V/3.3 V 250 mA regulator powers the host MCU without an external LDO. The 12 V battery input supports the full 3 V to 28 V VBAT range including load-dump conditions, and the watchdog plus LIMP output enable the fail-safe behavior expected in ISO 262ASIL-A/B body functions.
Recommended
Automotive CAN Network Sensor Node
Sensor and actuator nodes (parking sensors, temperature, humidity, occupant-detection, chassis sensors) benefit from the UJA1169ATKZ's combination of small HVSON-20 package, very low standby quiescent current, and integrated LDO so that only one IC provides bus interface plus supply. CAN FD allows the node to publish richer diagnostic payloads in a single frame, and the SPI port lets the host MCU reconfigure modes or read fault flags without extra glue logic. The exposed pad keeps die temperature in spec even in sealed underbody modules where ambient can exceed +100C, and the integrated reverse-battery/load-dump protection means no external series FET is needed on the 12 V input.
Recommended
HVAC and Climate Control Module
HVAC head units and climate-control slaves are migrating onto the automotive CAN FD backbone, and the UJA1169ATKZ delivers a compact, automotive-qualified transceiver + 250 mA MCU rail in one 20-pin HVSON package. The 5 V default V1 is convenient for legacy HVAC MCUs, while SPI lets the HVAC controller enter low-power Sleep mode between user interactions, dropping total node quiescent current into the uA range. The watchdog ensures that an MCU firmware hang does not leave a blower or compressor stuck on, triggering a LIMP event that lets the rest of the network remain operational.
Recommended
Door/Seat/Zone Module with HS-CAN Link
Door, seat, and zone modules typically connect to the body CAN backbone with a single CAN node plus a small MCU - exactly the footprint the UJA1169ATKZ is designed to serve. The integrated 250 mA LDO feeds the local MCU and a few discrete loads (LIN bridge, half-bridge drivers), while the CAN FD link (5 Mbit/s) carries mirror-adjust, seat-position memory, and lighting commands in real time. Reverse-battery and load-dump protection on the VBAT pin is essential because the harness behind a door is exposed; the UJA1169ATKZ provides that protection on-chip.
Recommended
CAN-LIN Gateway Edge Node
A CAN-LIN gateway needs an HS-CAN physical interface, a small MCU, and - because it is typically placed close to the battery - direct 12 V operation with protection. The UJA1169ATKZ provides exactly that combination: HS-CAN FD at 5 Mbit/s, an integrated 250 mA 5 V/3.3 V regulator for the gateway MCU, watchdog, and LIMP, all in a single 3.5 x 5.5 mm exposed-pad HVSON-20 package. The VBAT input tolerates 28 V load-dump events, so a separate TVS-only protection stage is typically sufficient.
Recommended
Industrial CAN-Node with 24 V Bus
Although primarily specified for 12 V automotive rails, the UJA1169ATKZ's 3 V to 28 V supply range covers many 24 V industrial CAN buses as well (factory automation, building HVAC, sub-station auxiliary). The integrated 5 V / 3.3 V, 250 mA regulator eliminates the need for a separate 24 V -> 5 V DC-DC, and the CAN FD 5 Mbit/s line rate makes the part suitable for modern industrial communication stacks that prefer FD over classic CAN. The SPI control port lets a host PLC or industrial MCU configure the transceiver without adding an IO expander.
Recommended
Recommended Products Summary
Engineering reference data for UJA1169ATKZ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | UJA1169ATK/XZ | UJA1169ATK/FZ | UJA1169ATK/X | UJA1169ATK/F/3Z | UJA1169ATK/X/F |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 20-HVSON (3.5 x 5.5 mm) Exposed Pad | 20-HVSON (3.5 x 5.5 mm) Exposed Pad - same | 20-HVSON (3.5 x 5.5 mm) Exposed Pad - same | 20-HVSON (3.5 x 5.5 mm) Exposed Pad - same | 20-HVSON (3.5 x 5.5 mm) Exposed Pad - same | 20-HVSON (3.5 x 5.5 mm) Exposed Pad - same |
| CAN Standard | ISO 11898-2:2016 / SAE J2284-1 to -5 | ISO 11898-2:2016 / SAE J2284-1 to -5 | ISO 11898-2:2016 / SAE J2284-1 to -5 | ISO 11898-2:2016 / SAE J2284-1 to -5 | ISO 11898-2:2016 / SAE J2284-1 to -5 | ISO 11898-2:2016 / SAE J2284-1 to -5 |
| CAN FD Data Rate | 5 Mbit/s | 5 Mbit/s | 5 Mbit/s | 5 Mbit/s | 5 Mbit/s | 5 Mbit/s |
| Integrated LDO (V1) | 5 V or 3.3 V selectable, 250 mA | 5 V fixed, 250 mA | V1 variant, 250 mA | V1 variant, 250 mA | V1 variant, 250 mA | V1 variant, 250 mA |
| Supply Voltage Range | 3 V to 28 V | 3 V to 28 V | 3 V to 28 V | 3 V to 28 V | 3 V to 28 V | 3 V to 28 V |
| SPI Control | Yes | Yes | Yes | Yes | Yes | Yes |
| Watchdog | Integrated (window/timeout) | Integrated | Integrated | Integrated | Integrated | Integrated |
| LIMP Output | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Selectable 5 V / 3.3 V 250 mA LDO on the same die (vs UJA1169ATK/XZ)
- Single HVSON-20 footprint consolidates transceiver + LDO + watchdog + SPI (vs Discrete TJA1042 + 250 mA LDO + external watchdog supervisor)
- Reverse-battery and load-dump protection on-chip (vs Discrete HVSON-20 CAN SBC without integrated VBAT protection)
Design Notes
Estimated thermal check: at VBAT = 12 V and V1 = 5 V driving 200 mA to the host MCU, the UJA1169ATKZ dissipates (12 V - 5 V) x 0.2 A = 1.4 W internally. The HVSON-20 exposed-pad theta_JA (see datasheet) for a 1 oz 4-layer FR4 board with the pad soldered is typically in the 30-45 C/W range, so junction rise is roughly 42-63 C above ambient. At a +85 C underhood ambient this pushes Tj near +150 C. Ensure the exposed pad has at least 100 mm² of uninterrupted top-layer copper tied to GND, and consider stitching vias to inner planes.
Place the V1 decoupling capacitor (>= 1 uF low-ESR ceramic per datasheet recommendation) within 2 mm of the V1 pin to minimize the LDO's loop inductance during load steps. Keep CANH and CANL as a 100 ohm differential pair matched to within 0.5 mm, and route them away from switching nodes such as the V1 regulator input or any DC-DC on the same PCB. Use a 60 ohm characteristic impedance if the bus leaves the board on a harness.
Do not assume V1 is selected automatically - on the UJA1169ATKZ the regulator output voltage (5 V or 3.3 V) is set by SPI configuration or an external latching pin; a missing SPI write leaves the LDO at its default value, which differs between ATKZ, TK/XZ and TK/FZ variants. Also note that LIMP is open-drain, so an external pull-up is required on the host side - omitting this masks watchdog events. Finally, do not enable the watchdog before the MCU's SPI peripheral is fully configured, or the first service window will be missed and LIMP will assert during normal startup.
Compliance Information
Automotive qualified for body and chassis applications per NXP UJA1169 product family page. RoHS and REACH compliant per distributor listings.
