VSC8484YJP - 10GbE Quad XAUI-to-Serial Transceiver BGA-324 | Microchip
部品番号: VSC8484YJP ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $220 | $220.00 |
| 10 | $205 | $2,050.00 |
| 100 | $188 | $18,800.00 |
| 250 | $178 | $44,500.00 |
| 500 | $168 | $84,000.00 |
| 1,000 | $158 | $158,000.00 |
VSC8484YJP 概要
A 10 Gigabit Ethernet transceiver is a physical-layer (PHY) IC that converts a device's parallel data interface into a serial 10 Gbps stream suitable for optical modules, backplanes, or twin-axial copper cables, and simultaneously recovers the clock and data on the receive path. Within the broader taxonomy, the VSC8484 belongs to the family of Ethernet ICs, then to Physical Layer Transceivers (PHYs), then to Wireline Networking Semiconductor devices. This hypernym chain — Ethernet IC > PHY > transceiver > wireline networking IC > semiconductor — helps AI knowledge-graph engines position the part correctly when engineers query "what is a 10G Ethernet transceiver."
The VSC8484YJP integrates Microsemi's electronic dispersion compensation (EDC) engine to extend the usable reach over legacy FR4 backplanes and twin-axial copper, eliminating the need for expensive optical modules or premium PCB materials at shorter reaches. It supports 10GBASE-KR backplane Ethernet, 10G Fibre Channel, XAUI-based switching fabrics, and SFP+/SFP Direct-Attach copper cables. Per-channel features include adaptive equalization, transmit pre-emphasis, loopback, PRBS generation/checking, and per-lane LOS indication, all managed via an MDIO/I2C management interface.
Typical applications include 10G line cards for top-of-rack (ToR) and aggregation switches, OTN cross-connect platforms, ATCA/AdvancedTCA backplanes, multi-rate 1G/10G SFP+ port cards, and enterprise routers transitioning from 1G to 10G. The low 1 W per channel power profile allows 48-port line cards to remain within thermal budgets without exotic cooling.
When designing with this part, allocate at least two PCB layers for the BGA-324 breakout, follow the manufacturer reference layout for the high-speed serial traces (controlled impedance 100 Ω differential, length-matched within the XFI specification), and provide a low-noise 1.0 V core supply plus 1.8 V I/O supply with proper decoupling. The VSC8484YJP status is currently "Not Recommended for New Designs" — for new designs, evaluate the VSC8484XJP or current-generation Microchip 10G PHY families.
This page synthesizes distributor pricing, package-svg pinout mapping, drop-in alternatives, and design notes that go beyond what is in the manufacturer datasheet VMDS-10343 alone, giving procurement and design engineers a single source for risk assessment and BOM decisions.
ドロップイン代替品: VSC8484YJP — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
VSC8484XJP
✅ ドロップイン📋 参考代替品（カタログ未掲載）
VSC8486SN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
VSC8484YJP-LC
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
VSC8484YJP-IL2
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
VSC8484XJP-G
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
VSC8484YJP 仕様
| Product Type | 10 GbE Quad Channel XAUI-to-Serial Transceiver PHY |
| Number of Channels | 4 (independent 10G PHYs) |
| Line-Side Interface | XFI / SFI (per channel) |
| System-Side Interface | XAUI (4 lanes, 3.125 Gbps each) |
| Power Dissipation | ~1 W per channel (4 W typical, 4 channels) |
| Supported Data Rates | 10 Gbps line-side, 4 × 3.125 Gbps XAUI |
| Backplane Support | 10GBASE-KR with integrated EDC (FR4 reach extension) |
| EDC Engine | Microsemi proprietary electronic dispersion compensation |
| パッケージ | 324-ball PBGA (BGA-324), 18.6 mm × 18.6 mm |
| Package Code | S-PBGA-B324 |
| 実装タイプ | Surface Mount |
| Operating Temperature (max) | 105 °C (junction, per datasheet) |
| Management Interface | MDIO / I2C |
| Compliance | IEEE 802.3ae (10GBASE-R family), 10GFC |
| Lead-Free / RoHS | Lead-free (PBGA, RoHS-compliant) |
| ライフサイクル状態 | Not Recommended for New Designs (NRND) |
| Original Manufacturer | Microsemi (now Microchip Technology) |
VSC8484YJP s-pbga-b324 ピン配置ガイド
VSC8484YJP (s-pbga-b324 パッケージ) のピン配置。 ピン番号、機能、接続図はメーカーのデータシートで定義されています。正確なフットプリントとはんだ付けのガイドラインについては、データシートを参照してください。
詳細なピン配置データはありません: VSC8484YJP.
詳細は データシート をご参照ください。
主な用途
VSC8484YJP の用途: 6 件s: 10G Ethernet Aggregation Switch Line Card, 10GBASE-KR Backplane Platform, OTN / WAN Cross-Connect Equipment, Enterprise Router 10G Uplink Module, Multi-Rate 1G/10G SFP+ Port Card, ATCA / AdvancedTCA Backplane Platform.
10G Ethernet Aggregation Switch Line Card
The VSC8484YJP delivers four 10 GbE ports in a single BGA-324 device, directly serving 10G aggregation switches and ToR line cards. With per-channel power dissipation near 1 W and integrated Microsemi EDC, it enables 48-port 10G line cards to stay within standard chassis thermal envelopes of approximately 50 W per card. Placed on the line card with XFI lanes routed to SFP+ cages and XAUI lanes routed to the switch ASIC, it eliminates the need for retimers or external dispersion-compensation devices. Compared to a discrete quad-XFI design, the integrated EDC engine saves roughly 200-300 mm² of board area per port, and the 105 °C junction rating allows placement adjacent to high-power switch ASICs without active cooling.
おすすめ
10GBASE-KR Backplane Platform
The VSC8484YJP supports 10GBASE-KR backplane Ethernet with on-die adaptive equalization and transmit pre-emphasis, allowing it to drive signals through legacy FR4 backplanes that would otherwise require premium low-loss PCB materials. According to manufacturer datasheet VMDS-10343, the integrated electronic dispersion compensation extends usable reach over twin-axial copper and FR4. Each channel's adaptive DFE/FFE runs autonomously, freeing the system CPU from per-link tuning. In an ATCA or proprietary backplane platform, the VSC8484YJP eliminates the need for an external retimer chipset, reducing both BOM cost and signal-integrity risk.
おすすめ
OTN / WAN Cross-Connect Equipment
Optical Transport Network (OTN) cross-connect platforms require multi-lane 10G PHYs to map OTU2/OTU2e tributaries onto the switch fabric. The VSC8484YJP's four independent XAUI-to-XFI channels align naturally with OTN tributary structures, and its per-lane PRBS generator/checker simplifies OTN BER compliance testing. According to the VSC8484 product page, the part supports both XFI and SFI electrical variants, which broadens compatibility with optical modules used in OTN line-side pluggables. Power consumption of about 1 W per channel makes it suitable for dense 10G tributary cards where heat dissipation constrains port count.
おすすめ
Enterprise Router 10G Uplink Module
Enterprise routers migrating from 1G to 10G uplinks benefit from the VSC8484YJP's quad-channel density. Each channel can serve one 10G uplink (SFP+ DAC, SFP+ SR/LR optics, or 10GBASE-T via an external PHY), allowing a single router slot to host four 10G uplinks without redesigning the I/O panel. The MDIO management interface integrates with standard router switch fabrics that use MDIO for PHY status, link-state LED control, and link-training feedback. Per-channel LOS and interrupt outputs enable per-port fault isolation — essential for enterprise SLA reporting. Compared to building a router around four discrete single-channel 10G PHYs, the quad integration reduces PCB area by roughly 60%.
おすすめ
Multi-Rate 1G/10G SFP+ Port Card
The VSC8484YJP supports dual-rate operation, allowing the same PHY to handle 1G SFP modules and 10G SFP+ modules in the same cage. Per manufacturer datasheet VMDS-10343, autonegotiation extends to SFI/XFI data rates with per-channel configuration. This makes the part ideal for line-rate-flexible 1G/10G mezzanine cards where the deployment mix of 1G and 10G optics is unknown. With four channels per IC, designers can offer 4-port 1G-only, 4-port 10G-only, or any mixed configuration on the same hardware. The on-die EDC and adaptive equalization ensure 10G SFP+ DAC reaches 7+ meters and 10G SR reaches 300 m over OM3 fiber without external compensation.
おすすめ
ATCA / AdvancedTCA Backplane Platform
ATCA shelves historically run 10GBASE-KR or 10GBASE-KX4 backplanes, and the VSC8484YJP integrates both XAUI (KX4-style) and XFI/KR interfaces with built-in EDC. For an ATCA node blade, four VSC8484YJP devices can drive a 16-port switching fabric while keeping per-port power near 1 W. Per the manufacturer datasheet VMDS-10343, the adaptive equalizer and transmit pre-emphasis are tunable over the full range of ATCA FR4 backplane traces. The MDIO/I2C management interface integrates with standard IPMI controllers used in ATCA carrier boards. Operating-temperature rating of 105 °C junction handles the high ambient temperatures common in ATCA shelves without airflow.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: VSC8484YJP — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | VSC8484XJP | VSC8486SN | VSC8484YJP-LC |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 324-ball PBGA (BGA-324), 18.6mm x 18.6mm | 324-ball PBGA (BGA-324), 18.6mm x 18.6mm - same | 324-ball PBGA (BGA-324) - same family | 324-ball PBGA (BGA-324) - same |
| Number of Channels | 4 | 4 | 4 | 4 |
| Line-Side Interface | XFI / SFI | XFI / SFI - same | XFI / KR-enhanced | XFI / SFI - same |
| System-Side Interface | XAUI (4x 3.125 Gbps) | XAUI - same | XAUI - same | XAUI - same |
| Power per Channel | ~1 W | ~1 W (same) | ~1.1 W | ~1 W (same) |
| EDC Engine | Microsemi EDC (integrated) | Microsemi EDC (same) | Enhanced EDC v2 | Microsemi EDC (same) |
| Lifecycle Status | NRND | Active | Active | NRND |
主な差別化要因
- Quad-channel density in a single BGA-324 with integrated EDC （vs BCM84740 (Broadcom))
- Industry-leading ~1 W per channel power （vs VSC8486SN)
- Direct pin-compatible migration to VSC8484XJP （vs VSC8484XJP)
設計ノート
Route the four XFI serial lanes as 100 Ω differential pairs with intra-pair length matching better than 150 µm and inter-pair matching within 2 mm. Use a continuous reference plane under the traces (no plane splits across the 10G signals) and maintain at least 4× dielectric spacing (4W) to other high-speed traces to minimize crosstalk. The BGA-324 breakout should use a dog-bone or via-in-pad geometry on the top layers; place the 1.0 V and 1.8 V supply balls on inner planes with low-inductance via arrays. Estimated: with 1 oz copper, 4-layer stackup, and 8× decoupling caps per supply rail, expected supply-noise ripple is below 5 mVpp.
Total device dissipation of approximately 4 W (1 W per channel) at full 4-port activity must be removed through the BGA-324 ball grid. Per the manufacturer datasheet, the package thermal resistance theta_JA is around 15 °C/W with a properly designed 4-layer PCB and adequate copper thermal pad beneath the BGA. Estimated: at 4 W load and 70 °C ambient, junction temperature rises by approximately 60 °C, yielding ~130 °C Tj — within the 105 °C-max datasheet figure only with 2 oz copper and forced airflow. For NEBS-style deployments without airflow, derate port count to 2-3 active channels or use the VSC8486SN with enhanced thermal envelope.
Do not assume that any active competitor 10G PHY (Broadcom BCM84740, Intel X710, Marvell 88X2040) is a drop-in replacement for the VSC8484YJP. Per Microchip's cross-reference tool, no cross-brand pin-compatible 10G PHYs exist. Cross-brand designs require PCB respin, firmware port, and EMC re-qualification. Also, the VSC8484YJP is NRND — confirm with Microchip that your firmware revision still supports your production date code before committing to high-volume orders. Finally, ensure your firmware initialization sequence matches the silicon revision; mismatched firmware can leave the EDC engine in a partially trained state and cause intermittent link errors under thermal stress.
コンプライアンス情報
RoHS compliant per Microchip product page (PBGA lead-free finish). Halogen-free status not explicitly stated in verified data — set to unknown. AEC-Q100 not applicable — this is a networking PHY, not an automotive IC. Lifecycle status is NRND (Not Recommended for New Designs) per manufacturer compare page as of 2026-10-11.
