XC3S400-4FG456C - 400K Spartan-3 FPGA | AMD Xilinx
部品番号: XC3S400-4FG456C ✗ 生産終了XC3S400-4FG456C 概要
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. The XC3S400 belongs to the Spartan-3 FPGA hierarchy, which combines configurable logic, block RAM, programmable I/O, and dedicated arithmetic resources on one device. This position between fixed-function ASICs and microcontrollers makes it suitable when a design needs hardware-level parallelism, flexible interfaces, or product-specific logic that would be expensive to implement in silicon.
The -4 designator identifies a Spartan-3 performance grade, while FG456 identifies the 456-ball fine-pitch BGA package and C identifies the commercial temperature designation. The 456-BBGA footprint supports a high pin count and dense board routing, making the device appropriate for industrial control, communications, instrumentation, embedded processing, and legacy platform designs that already use the Spartan-3 package. Its large I/O count can reduce the need for external interface logic when connecting the FPGA to buses, converters, memories, and control signals.
The device includes 294,912 logic cells and 8,064 bits of dedicated block RAM. These resources allow parallel datapaths, state machines, protocol handling, data acquisition, and control functions to be implemented concurrently rather than executed sequentially by a general-purpose processor. Programming is performed through the Xilinx configuration flow, while the final configuration determines which interconnect and logic resources are active.
Designers should preserve the exact 456-BBGA land pattern, power architecture, decoupling strategy, configuration interface, and I/O constraints when replacing another programmable device. Because this package contains many fine-pitch balls, assembly and inspection require qualified PCB manufacturing processes and appropriate BGA assembly capability. Any modernization should begin with a pin, configuration, I/O-standard, and timing comparison rather than assuming that a newer FPGA is automatically interchangeable.
This product page combines the device identity, verified ordering information, package details, same-family replacement candidates, and practical implementation guidance. It supports faster sourcing decisions while keeping the distinction clear between exact package-compatible options and newer devices that require redesign.
The Request a Quote form on this page is the appropriate route for current commercial terms, lead time, and availability. Engineers should also consult the Spartan-3 DS099 family data sheet and the exact device ordering information before releasing a new PCB layout.
ドロップイン代替品: XC3S400-4FG456C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
XC3S400A-4FGG456C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC3S400-4FGG456I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC3S400-5FGG456C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC3S400-2FGG456C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC3S400-1FGG456C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC3S400-4FG456C 最大定格＆電気的特性
| Device Type | Spartan-3 field-programmable gate array (FPGA) |
| System Gates | 400000 gates |
| Logic Cells | 294912 cells |
| Dedicated Block RAM | 8064 bits |
| User I/O | 264 I/O |
| Core Supply Voltage | 1.2 V |
| パッケージ | 456-BBGA |
| Package Type | Fine-pitch ball grid array (FBGA) |
| FPGA Family | Spartan-3 |
| Performance Grade | -4 |
| Temperature Designation | C, commercial grade |
| 実装タイプ | Surface mount |
XC3S400-4FG456C fine-pitch ball grid array (fbga) ピン配置ガイド
XC3S400-4FG456C (fine-pitch ball grid array (fbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC3S400-4FG456C.
詳細は データシート をご参照ください。
主な用途
XC3S400-4FG456C の用途: 6 件s: Industrial Control and Automation, Communications Interface and Protocol Bridging, Data Acquisition and Signal Conditioning, Embedded Instrumentation and Test Equipment, Network Appliance and Interface Consolidation, Digital Storage and Bus Conversion.
Industrial Control and Automation
The XC3S400-4FG456C fits industrial control systems that require deterministic parallel logic, broad I/O access, and local state machines. Its 294,912 logic cells can implement sequencing, interlocks, motion-control interfaces, and machine-safety monitoring, while 264 I/O sites reduce the need for external buffers. The 456-BBGA package is appropriate for multilayer control boards, although the commercial C-grade temperature limit must be checked against the enclosure environment.
おすすめ
Communications Interface and Protocol Bridging
The XC3S400-4FG456C is suitable for fixed-format protocol converters, test interfaces, and communications aggregation where several channels must be processed in parallel. The available 400,000 system gates and 264 I/O sites allow independent transmit and receive datapaths to coexist with framing logic, while dedicated block RAM supports buffering. Engineers should define clock domains, I/O standards, and source-synchronous timing before assigning pins in the 456-BBGA footprint.
おすすめ
Data Acquisition and Signal Conditioning
The XC3S400-4FG456C can implement parallel acquisition, digital filtering, calibration, and control logic around external converters. Its parallel logic resources allow multiple channels to be sampled and processed concurrently, while the 264 I/O sites provide substantial connectivity for converter data, control signals, and status indicators. The design must include careful clocking, impedance matching, grounding, and separation between analog and digital sections to avoid degrading acquired data.
おすすめ
Embedded Instrumentation and Test Equipment
The XC3S400-4FG456C supports instrumentation front ends that combine programmable stimulus generation, pattern execution, and response capture. Parallel logic can implement counters, timing generators, sequencers, and digital analysis functions without relying entirely on a sequential processor. The 456-BBGA package also provides enough pin count for external memory, converters, trigger interfaces, and synchronization signals, provided the board uses a qualified assembly process for the fine-pitch package.
おすすめ
Network Appliance and Interface Consolidation
The XC3S400-4FG456C can consolidate packet framing, header inspection, buffering, and peripheral interfaces in network appliances. Its 400,000 system gates and 8,064 dedicated block RAM bits offer enough resources for parallel packet handling, although external RAM is required for designs exceeding the on-chip buffer capacity. The large 264-site I/O complement supports multiple Ethernet, serial, and storage-side connections when pin assignments and voltage standards are carefully partitioned.
おすすめ
Digital Storage and Bus Conversion
The XC3S400-4FG456C can bridge older processor buses to SDRAM, flash, or custom storage interfaces using dedicated block RAM and parallel state machines. The 264 I/O sites offer substantial bus fanout, but a complete design must account for voltage standards, timing constraints, address decoding, and refresh behavior. For an established board, maintaining the original FPGA configuration and pinout reduces risk during a like-for-like replacement.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC3S400-4FG456C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC3S400A-4FGG456C | XC3S400-4FGG456I | XC3S400-5FGG456C | XC3S400-2FGG456C | XC3S400-1FGG456C |
|---|---|---|---|---|---|---|
| Brand | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx |
| Package | 456-BBGA | 456-BBGA - same package class | 456-BBGA - same package class | 456-BBGA - same package class | 456-BBGA - same package class | 456-BBGA - same package class |
| FPGA Family | Spartan-3 | Spartan-3A | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Performance Grade | -4 | -4 | -4 | -5 | -2 | -1 |
| Temperature Designation | C, commercial | C, commercial | I, industrial | C, commercial | C, commercial | C, commercial |
主な差別化要因
- Commercial -4 grade with the highest original performance level among the listed commercial replacements （vs XC3S400-2FGG456C)
- Original Spartan-3 device architecture and ordering code （vs XC3S400A-4FGG456C)
- Commercial temperature designation for indoor or controlled commercial environments （vs XC3S400-4FGG456I)
- Higher -5 performance grade available without changing the package class （vs XC3S400-4FG456C)
設計ノート
Treat the 456-BBGA land pattern as immutable during like-for-like replacement. Verify the ball map, power and ground assignments, configuration pins, and I/O standards against the exact device ordering code. Fine-pitch assembly also requires qualified board stack-ups, solder-paste control, X-ray inspection, and an assembly process capable of handling the package pitch without bridging.
Implement separate, low-impedance distribution for the 1.2 V core and applicable auxiliary rails. Place local bulk and high-frequency decoupling at the supply and ground balls using the manufacturer's power-distribution guidance. Estimate total core, configuration, and I/O current before assigning regulators, and verify sequencing so that the configuration and I/O rails cannot back-power an unpowered device.
Do not assume that a shared 456-BBGA package makes every FPGA suffix interchangeable. Compare architecture revision, performance grade, temperature grade, supply voltages, configuration mode, startup behavior, pin multiplexing, timing constraints, and supported I/O standards. The XC3S400A candidate may require a revised bitstream and timing constraints even though its package matches.
Assign clocks and high-speed interfaces using the device's supported I/O standards and package-aware timing rules. Keep clock paths short, provide continuous return paths, and follow the recommended bypass topology for each supply domain. Use controlled-impedance routing for external interfaces and isolate noisy outputs from sensitive acquisition or clock inputs.
コンプライアンス情報
The device is an FPGA rather than an automotive-qualified AEC-Q100 component. RoHS, REACH, lead-free, halogen-free, and conflict-minerals status require confirmation from the applicable AMD product documentation or the supplier.
