XC5VLX30-1FF676I - 30,720-Cell 400-I/O FPGA | AMD | Industrial
部品番号: XC5VLX30-1FF676I ✗ 生産終了XC5VLX30-1FF676I 概要
An FPGA is a programmable semiconductor in which the logic fabric, interconnect, and input/output resources can be configured after manufacture. The Virtex-5 LX family belongs to the broader FPGA and CPLD hierarchy, combining configurable logic blocks, programmable interconnect, block RAM, dedicated input/output resources, and embedded processor options. This makes the XC5VLX30-1FF676I useful when a design needs flexible hardware behavior, rapid design revisions, or parallel hardware acceleration without committing the function to a custom ASIC.
The device provides 30,720 logic cells organized into 2,400 configurable logic blocks and offers 400 I/O in a 676-ball, 27 mm by 27 mm FCBGA package. Its industrial temperature grade differentiates it from commercial-grade XC5VLX30 variants. The 1 V operating supply supports low-voltage system integration, while the large ball-count package exposes the substantial I/O and power-distribution resources associated with a high-performance programmable logic platform.
The XC5VLX30-1FF676I is identified by the XC5VLX30 base device, the -1 speed grade, the FF676 package and finish designation, and the I industrial-temperature suffix. Similar suffix combinations can change speed grade, temperature grade, package finish, or lead-free status without changing the underlying Virtex-5 LX device family. Consequently, replacement decisions must compare all ordering suffixes rather than treating every XC5VLX30 part as interchangeable.
Typical applications include industrial control systems, test and measurement equipment, communications infrastructure, embedded video processing, network-interface equipment, and high-throughput data acquisition. The 400 available I/O positions are particularly useful for parallel buses, clock distribution, control signals, and interfaces to external converters or memories. The 30,720-cell fabric can implement parallel datapaths, protocol engines, state machines, and fixed-function blocks concurrently rather than forcing them into a sequential microcontroller architecture.
When assigning this FPGA to a board, verify power sequencing, decoupling, clocking, configuration memory, bank-voltage constraints, and the complete 676-ball footprint before layout. The large FCBGA package also requires careful via-in-pad or via-under-bump construction, differential-pair routing, and thermal design. Use the manufacturer pinout and design-support documentation to assign every power, ground, configuration, clock, and user I/O ball correctly.
This product page combines the exact ordering information, package details, search-query coverage, practical design guidance, and a parameter-by-parameter comparison of verified drop-in alternatives. It also distinguishes same-footprint candidates from changes that affect speed grade or temperature range, helping engineers shortlist replacements without overlooking qualification and lifecycle constraints.
ドロップイン代替品: XC5VLX30-1FF676I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC5VLX30-1FF676I （同一形状・フットプリント） — 相違点: Device Type, Logic Cells, Speed Grade, Lead-Free Status, Number of Terminals.
XC5VLX30-1FFG676I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC5VLX30-1FF676C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC5VLX30-1FFG676C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC5VLX30-2FF676C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC5VLX30-2FFG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX30-1FF676I 最大定格＆電気的特性
| Device Type | Virtex-5 LX field-programmable gate array (FPGA) |
| Logic Cells | 30,720 cells |
| Configurable Logic Blocks | 2,400 CLBs |
| Input/Output Count | 400 I/O |
| Listed Maximum Frequency | 1098 MHz |
| 電源電圧 | 1 V |
| Speed Grade | -1 |
| Temperature Grade | Industrial |
| Package Type | 676-ball FCBGA |
| Package Code | FF676 |
| Package Shape | Square |
| Terminal Form | Ball |
| Package Dimensions | 27 mm x 27 mm |
| Device Technology | CMOS |
| 実装タイプ | Surface mount |
| Lead-Free Status | Lead free |
| REACH Status | REACH 211 certified |
XC5VLX30-1FF676I 27 mm x 27 mm ピン配置ガイド
XC5VLX30-1FF676I (27 mm x 27 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC5VLX30-1FF676I.
詳細は データシート をご参照ください。
主な用途
XC5VLX30-1FF676I の用途: 6 件s: Industrial Control and Automation, Test and Measurement Instrumentation, Communications and Network Interface Equipment, Embedded Video and Image Processing, High-Throughput Data Acquisition, Aerospace and Defense Prototyping.
Industrial Control and Automation
The AMD XC5VLX30-1FF676I fits industrial controllers that combine parallel I/O, sequencing logic, communication interfaces, and real-time datapath processing. Its 30,720 logic cells and 2,400 configurable logic blocks provide substantial parallel capacity, while 400 I/O support machine inputs, actuator outputs, encoders, counters, and isolated interface links. The industrial-grade I suffix also aligns it with equipment expected to operate beyond consumer-temperature environments. Designers should use the manufacturer power, banking, and pinout tables to establish safe voltage domains, then reserve configuration resources and validate timing against the -1 speed grade before releasing the control system to production.
おすすめ
Test and Measurement Instrumentation
XC5VLX30-1FF676I can implement parallel acquisition logic, pattern generation, timing control, and instrument communication in a single programmable device. The 30,720-cell fabric is useful for implementing multiple test channels and protocol engines concurrently, while 400 I/O leaves substantial connectivity for fixture boards, high-speed converters, clock signals, and control buses. The 676-ball FCBGA supports high-density routing but demands careful power delivery and matched-length design for sensitive channels. For instrumentation, use the AMD/Xilinx pinout to identify clock-capable and differential I/O resources, validate AC timing at the selected -1 speed grade, and isolate analog and high-energy switching circuitry from sensitive FPGA banks.
おすすめ
Communications and Network Interface Equipment
The AMD XC5VLX30-1FF676I is suitable for protocol engines, packet-processing blocks, data movers, and interface bridges in communication equipment. Its 30,720 logic cells allow multiple packet-level functions and control state machines to operate in parallel, while 400 I/O provides connectivity for parallel buses, source-synchronous interfaces, clocks, and status signals. A practical design should partition transmit and receive datapaths, constrain clocking relationships, and keep high-speed nets away from power-distribution discontinuities. Before implementation, confirm every selected I/O standard against the bank-voltage requirements in the manufacturer datasheet, because an unsupported voltage combination can prevent operation even when the logic fits.
おすすめ
Embedded Video and Image Processing
XC5VLX30-1FF676I can support parallel pixel pipelines, color processing, frame timing, exposure control, and interface adaptation in embedded imaging systems. The Virtex-5 LX fabric provides 30,720 logic cells for parallel datapaths, and 400 I/O can accommodate camera interfaces, memory buses, and control signals. Using the device requires disciplined clock-domain planning because image processing often combines external pixel clocks, internal logic clocks, and asynchronous control events. Use dedicated clock-capable pins where supported, constrain the complete timing path, and confirm that video standards, voltage levels, and bus widths are available on the selected I/O banks. Thermal design should also account for sustained switching activity in wide pixel datapaths.
おすすめ
High-Throughput Data Acquisition
The XC5VLX30-1FF676I can act as the central programmable element in a parallel data-acquisition system, combining converter control, capture buffering, digital filtering, and data formatting. Thirty thousand logic cells support wide fixed-function datapaths without forcing sequential execution in an external processor, while 400 I/O provide connections to converters, memories, clocks, and host interfaces. The -1 speed grade must be used when validating the established timing constraints because substituting a -2 grade can alter the required timing margin. Place decoupling capacitors at the relevant supply balls, maintain continuous return paths beneath high-speed nets, and review package thermal performance under sustained full-width switching rather than relying only on nominal activity estimates.
おすすめ
Aerospace and Defense Prototyping
The XC5VLX30-1FF676I can support programmable datapath, interface, and control logic in legacy aerospace and defense prototypes where an established Virtex-5 LX design already targets the 676-ball FF676 footprint. The device provides 30,720 logic cells and 400 I/O for parallel signal processing, while its industrial-temperature designation is distinct from any aerospace qualification claim. According to the manufacturer listings, no AEC-Q100 automotive qualification applies, and aerospace suitability must be established through the applicable program-specific qualification and procurement process. Reuse should include a complete pin, power, timing, radiation, reliability, and configuration review rather than relying on package similarity alone.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC5VLX30-1FF676I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC5VLX30-1FFG676I | XC5VLX30-1FF676C | XC5VLX30-1FFG676C | XC5VLX30-2FF676C | XC5VLX30-2FFG676I |
|---|---|---|---|---|---|---|
| Package | 676-ball FCBGA, 27 mm x 27 mm | 676-ball FCBGA | 676-ball FCBGA | 676-ball FCBGA | 676-ball FCBGA | 676-ball FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX |
| Speed Grade | -1 | -1 | -1 | -1 | -2 | -2 |
| Temperature Grade | Industrial | Industrial | Commercial | Commercial | Commercial | Industrial |
主な差別化要因
- Original industrial-grade ordering configuration （vs XC5VLX30-1FF676C)
- Closest same-speed same-temperature candidate （vs XC5VLX30-1FFG676I)
- Consistent -1 speed-grade family options （vs XC5VLX30-1FFG676C)
- Conservative speed-grade preservation （vs XC5VLX30-2FFG676I)
設計ノート
Treat the 676-ball FCBGA as a high-pin-count fine-pitch package. Follow the manufacturer PCB and bonding guidelines for pad geometry, solder-mask definition, via construction, and component placement. Keep power and ground distribution planes continuous, place decoupling close to the associated supply balls, and preserve unobstructed thermal paths beneath the device. Validate the escape-routing strategy on the actual stackup because the 27 mm by 27 mm package leaves limited routing room around its perimeter.
Assign clocks and high-speed interfaces to the appropriate dedicated or clock-capable balls in the manufacturer pin-description table. Use the recommended clock topology, constrain all related paths, and maintain matched routing for differential signals. Separate noisy or high-current switching paths from sensitive clock and measurement networks. Do not assign I/O standards solely by ball availability; first confirm the allowed voltage and drive characteristics for each bank because an incorrect bank voltage can prevent the device from operating reliably.
Design the 1 V core supply and auxiliary I/O rails around the exact datasheet limits, sequencing requirements, tolerance, and current behavior. Include local high-frequency decoupling plus bulk energy storage selected through the manufacturer power-guidance method. Estimated: core dissipation equals 1 V multiplied by the actual core current, while total board power additionally includes I/O and auxiliary-rail consumption; do not substitute a nominal FPGA utilization factor for measured or tool-estimated activity in a production thermal calculation.
Calculate junction temperature from total device power and the package-plus-board thermal path, then check it against the selected ordering grade. The 676-ball FCBGA can conduct heat through its solder balls and PCB, but board construction, copper area, airflow, and neighboring heat sources materially affect the result. Estimated: junction temperature equals ambient temperature plus total device dissipation multiplied by the effective thermal resistance. Confirm the effective value for the actual PCB and enclosure rather than treating a package-only thermal specification as a finished-board result.
Do not treat every XC5VLX30-676 part as an automatic substitution. The -1 and -2 portions identify different speed grades, I and C identify different environmental grades, and G changes the package or finish designation. Changing one code can affect timing closure, operating-temperature qualification, marking, or procurement traceability. Before substitution, compare the full ordering code, pinout, speed-grade limits, temperature grade, supply requirements, lifecycle status, and any legacy programmed-device or configuration constraints.
コンプライアンス情報
The target listing identifies the component as lead free and includes a REACH 211 certification reference. RoHS, halogen-free, and conflict-minerals status were not explicitly established. AEC-Q100 is not applicable to this FPGA.