XC5VLX30-3FF324C - Virtex-5 LX 30K Logic Cell FPGA, 324-BBGA
部品番号: XC5VLX30-3FF324C ✗ 生産終了XC5VLX30-3FF324C 概要
An FPGA (field-programmable gate array) is a programmable logic device: a matrix of configurable logic blocks (CLBs) and programmable interconnect that can be reconfigured at the field to implement any digital design from a single HDL source. In the Xilinx hierarchy, Virtex-5 LX is a general-purpose platform family that sits above the smaller Spartan-3 family and below the larger Virtex-5 LXT/SXT and Virtex-6 device families. The Virtex-5 LX family targets networking, telecommunications, industrial control, and embedded systems requiring medium logic density with high-speed serial and memory resources.
Key features of the XC5VLX30-3FF324C include 30,720 logic cells organized in 4,800 4-input LUTs, 1,179,648 bits (1.125 Mbit) of 18 Kb block RAM, and 220 I/O distributed across the 324-BBGA package. The -3 speed suffix denotes the faster of the standard Virtex-5 LX performance grades. The device is offered in a monolithic 324-ball FCBGA package with a square body and ball terminals.
Architecturally, the XC5VLX30 uses the ASMBL column-based fabric, with configurable logic blocks, dedicated 18 Kb block RAM tiles, 18x18 multiplier accumulators, and dedicated distributed RAM per LUT. Because the fabric is column-based, routing between columns is highly regular and repeatable, which simplifies timing closure compared with row-based fabrics of the previous generation.
Typical applications include network interface and line-card designs, industrial control and test equipment, telecom baseband and cross-connect equipment, mid-range embedded video processing, and any design needing a mid-density programmable logic engine in a single 324-ball package.
A key design consideration is that the Virtex-5 LX family is a mature generation: new designs should be reviewed against current-generation AMD devices where board area, power, and toolchain support allow, while existing Virtex-5 platforms can reuse the same pinout and bitstream tool flow.
This page consolidates parametric details, drop-in replacement candidates for the 324-BBGA footprint, and practical design guidance that is not assembled in one place in the manufacturer documentation.
ドロップイン代替品: XC5VLX30-3FF324C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC5VLX30-3FF324C （同一形状・フットプリント） — 相違点: Package, Device Type, RoHS Status, Speed Grade, Architecture.
XC5VLX30-3FFG324C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX30-3FF324I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC5VLX30-3FFG324I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC5VLX30-2FF324C
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →XC5VLX30-2FFG324C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC5VLX30-1FFG324C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX30-1FF324C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX30-3FF324C 最大定格＆電気的特性
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | Virtex-5 LX |
| Manufacturer | AMD / Xilinx |
| Number of Logic Cells | 30,720 |
| Number of I/O | 220 |
| Block RAM | 1,179,648 bits (1.125 Mbit) |
| パッケージ | 324-BBGA, FCBGA |
| Number of Terminals | 324 |
| Terminal Form | Ball |
| Package Shape | Square |
| Speed Grade | -3 |
| Architecture | ASMBL column-based, second generation |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | RoHS Non-Compliant |
| Lead Free Status | Contains Lead |
XC5VLX30-3FF324C square ピン配置ガイド
XC5VLX30-3FF324C (square パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC5VLX30-3FF324C.
詳細は データシート をご参照ください。
主な用途
XC5VLX30-3FF324C の用途: 6 件s: Telecom Line-Card and Cross-Connect Equipment, Industrial Control and Test Equipment, Video and Image Processing Pipelines, Networking and Packet Processing, Aerospace and Defense Avionics Support, Embedded Platform Consolidation.
Telecom Line-Card and Cross-Connect Equipment
The XC5VLX30-3FF324C fits line-card and digital cross-connect designs where a single device must host both control logic and parallel packet handling. Its 30,720 logic cells cover clock generation, framing, and queueing logic, while 1,179,648 bits of block RAM absorb line buffers and statistics counters without external SRAM. The -3 speed grade gives margin on 100 MHz-plus datapaths, and the 220 I/O in the 324-BBGA package support parallel backplane or line-card bus interfaces. Because the column-based ASMBL routing is regular and repeatable, timing closure across a large fabric is more predictable than on older row-based devices.
おすすめ
Industrial Control and Test Equipment
Machine vision controllers, data acquisition front ends, and automated test equipment rely on many parallel sensor and actuator lines plus deterministic timing. The XC5VLX30-3FF324C provides 220 I/O in a single 324-ball FCBGA, allowing several interface standards to be consolidated on one board without level-shifter sprawl. Its block RAM can hold capture buffers and calibration tables while the CLB fabric runs sequencing state machines, and the -3 grade tightens setup and hold margin on clocked interfaces such as parallel ADC data buses and motor-control PWM generation. The single-package footprint also reduces board area compared with splitting logic and memory across multiple devices.
おすすめ
Video and Image Processing Pipelines
Mid-resolution video processing, scaling, and pixel-format conversion tasks map well onto the XC5VLX30-3FF324C, where parallel pixel pipelines and line buffers dominate the resource mix. The 30,720 logic cells absorb horizontal and vertical resampling filters plus color-space conversion, while the 1.125 Mbit of block RAM is sufficient for multiple line buffers and frame-schedule descriptors. The -3 speed grade helps sustain full-rate pixel clocks in an unmodified fabric. The device fits when the design needs more parallelism than a microcontroller offers but does not justify the power and cost of a larger device, and the 220 I/O allow parallel RGB, BT.601/112, or serialized link interfaces to be wired directly.
おすすめ
Networking and Packet Processing
Ethernet bridges, protocol converters, and traffic managers benefit from having full-rate packet buffers on-chip. In the XC5VLX30-3FF324C, the 1,179,648 bits of block RAM serve as descriptor FIFOs and line buffers while the logic fabric implements MAC, CRC, and header parsing engines, avoiding off-chip memory traffic on hot paths. The 220 available I/O accommodate parallel RGMII/GMII-style data buses plus PHY control signals without multiplexing. The -3 speed grade supports 125 MHz-class internal clocks with timing margin, and the column-based fabric gives consistent routing delays that simplify pipelining across the device.
おすすめ
Aerospace and Defense Avionics Support
Avionics subsystems such as radar signal conditioning, display drivers, and sensor fusion front ends benefit from reprogrammable logic that can be re-qualified for mission variants without respinning hardware. The XC5VLX30-3FF324C offers 30,720 logic cells for parallel datapath stages and 1.125 Mbit of block RAM for trace and echo buffers, with the -3 grade preserving timing margin on wide synchronous interfaces. The 324-BBGA package keeps the design compact for ruggedized boards. Where the design requires extended-temperature operation, the same footprint is available in the I temperature grade, and where lead-free assembly is mandated the FFG324C ordering code provides the equivalent device.
おすすめ
Embedded Platform Consolidation
Many embedded platforms need to consolidate a microcontroller, glue logic, and peripheral bridges onto one device. The XC5VLX30-3FF324C can host bus bridges, DMA engines, watchdog and reset logic, plus custom accelerators, while the 220 I/O accommodate several peripheral buses. Pairing the FPGA with an external microcontroller such as an STM32F103 or LPC1830 keeps the supervisory workload in a familiar environment while offloading deterministic datapath work to the programmable fabric. The -3 grade preserves margin for pipelined accelerators, and the single 324-BBGA device reduces component count and interconnect routing on space-constrained control boards.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC5VLX30-3FF324C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC5VLX30-3FFG324C | XC5VLX30-3FF324I | XC5VLX30-3FFG324I | XC5VLX30-2FF324C | XC5VLX30-1FFG324C |
|---|---|---|---|---|---|---|
| Package | 324-BBGA (FCBGA) | 324-BBGA (FCBGA) - same | 324-BBGA (FCBGA) - same | 324-BBGA (FCBGA) - same | 324-BBGA (FCBGA) - same | 324-BBGA (FCBGA) - same |
| Brand | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx |
| Speed Grade | -3 | -3 | -3 | -3 | -2 | -1 |
| Logic Cells | 30,720 | 30,720 | 30,720 | 30,720 | 30,720 | 30,720 |
| Number of I/O | 220 | 220 | 220 | 220 | 220 | 220 |
| Block RAM | 1,179,648 bits (1.125 Mbit) | 1,179,648 bits (1.125 Mbit) | 1,179,648 bits (1.125 Mbit) | 1,179,648 bits (1.125 Mbit) | 1,179,648 bits (1.125 Mbit) | 1,179,648 bits (1.125 Mbit) |
| RoHS Status | RoHS Non-Compliant (contains lead) | Lead-free ordering code | RoHS Non-Compliant | Lead-free ordering code | RoHS Non-Compliant | Lead-free ordering code |
| Temperature Grade | Commercial (C suffix) | Commercial (C suffix) | Industrial (I suffix) | Industrial (I suffix) | Commercial (C suffix) | Commercial (C suffix) |
| Architecture / Family | Virtex-5 LX, ASMBL column-based | Virtex-5 LX, ASMBL column-based | Virtex-5 LX, ASMBL column-based | Virtex-5 LX, ASMBL column-based | Virtex-5 LX, ASMBL column-based | Virtex-5 LX, ASMBL column-based |
| Configuration Interface Support | JTAG and configuration via Virtex-5 tools | JTAG and configuration via Virtex-5 tools | JTAG and configuration via Virtex-5 tools | JTAG and configuration via Virtex-5 tools | JTAG and configuration via Virtex-5 tools | JTAG and configuration via Virtex-5 tools |
主な差別化要因
- Direct lead-free drop-in on the identical 324-BBGA footprint （vs XC5VLX30-3FFG324C)
- Industrial-temperature option on the same board without redesign （vs XC5VLX30-3FF324I)
- Full -3 speed grade performance versus slower drop-ins （vs XC5VLX30-1FFG324C)
- Same-package -2 grade option for cost-sensitive builds （vs XC5VLX30-2FF324C)
- Mid-density integration reduces component count （vs EP3C25F324C7)
設計ノート
The 324-BBGA land pattern demands a via-in-pad or buried-via structure under the device to survive board bending and improve thermal performance. Define the pad stack and solder-mask opening per the Virtex-5 324-BBGA package specification, control the solder paste volume per ball to avoid voiding under the array, and plan X-ray inspection after reflow because hidden joints cannot be visually verified. Keep the perimeter escape traces short and matched, since 220 active I/O leave little room for long fan-out routing.
Estimate the XC5VLX30-3FF324C core and I/O supply budget before layout, since Virtex-5 LX current draw scales with speed grade, configured logic, and I/O toggle rate. Build the power tree so the core rail is supplied from a low-noise regulator and the I/O rails are separated from sensitive analog domains with ferrite filtering and local decoupling. Place the supply caps directly under the associated BGA power balls rather than at the board edge to keep the supply loop area small.
Plan configuration and JTAG access early, because the dedicated configuration pins on the 324-BBGA are fixed by the ball map and cannot be reassigned. Provide a reachable header or pogo fixture for the JTAG chain, and if the platform supports field reconfiguration, reserve space for a configuration flash device and its bus on the board rather than assuming the same pin assignment will be free later. Also confirm the pinout rows for the exact ordering code before release, since the FF, FFG, and I variants share the same package.
Estimated: with a -3 grade Virtex-5 LX device at roughly 1 W to 1.5 W total dissipation and the exposed land behaviour of the 324-BBGA, junction temperature rise stays modest provided the PCB provides a continuous thermal plane under the device. Because the exact theta_JA depends on the stack-up and copper area, confirm the number with the package thermal model for your board rather than assuming, and keep the area under the device free of thermal relief slots.
Two classic mistakes occur with this device. First, the lead-containing FF324C finish is catalogued as RoHS non-compliant, so a lead-free assembly flow should use the FFG324C ordering code on the same footprint. Second, mixing -1, -2, and -3 grades on one board is mechanically fine but changes timing; regenerate timing constraints and rerun static timing analysis for each speed grade you plan to populate, and avoid assuming -1 timing closure carries over to -3 or the reverse.
コンプライアンス情報
The FF324C ordering code is catalogued as RoHS non-compliant with a lead-containing finish; the lead-free FFG324C ordering code is the drop-in path for RoHS-compliant assemblies. AEC-Q100 does not apply to this industrial/commercial FPGA family.
