XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD
部品番号: XC6SLX75-2FG484C ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $42.1703 | $42.17 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC6SLX75-2FG484C 概要
A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. The XC6SLX75 belongs to the Spartan-6 LX family and is positioned as a general-purpose FPGA for industrial, communications, control, signal-processing, and embedded systems. Its architecture allows designers to implement parallel logic, state machines, interfaces, and control functions in one programmable device while retaining the flexibility of hardware reconfiguration.
The verified specifications identify 5,831 CLBs and 74,637 logic cells, providing substantially more programmable logic than small control FPGAs while remaining within a single high-density package. The 667 MHz figure is an internal frequency specification, not a guarantee that every design will achieve that frequency; external memory interfaces, timing constraints, I/O standards, routing congestion, and clocking requirements still determine achievable performance. The -2 suffix identifies the device speed grade, while the 484 package determines the board-level ball pattern and PCB land pattern.
Typical designs can use the FPGA for industrial automation, machine vision, real-time networking, communications infrastructure, embedded control, and digital signal processing. The high pin count supports broad parallel interfaces and multiple I/O banks, while the large logic capacity allows complex datapaths and protocol state machines. The 23 x 23 mm FBGA-484 package requires careful escape-routing, via-in-pad or through-via fanout planning, and controlled assembly thermal conditions.
The XC6SLX75-2FG484C should be selected when a design needs more parallelism and logic density than a small programmable device, while retaining the cost profile associated with the Spartan-6 family. Verify the exact AMD datasheet, package pinout file, voltage requirements, memory interfaces, configuration scheme, and speed-grade limits before layout or production release.
ドロップイン代替品: XC6SLX75-2FG484C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX75-2FG484C （同一形状・フットプリント） — 相違点: Mounting Type, Speed Grade, Logic Cells, Process Technology, Device Type.
クイック比較ツール — 並列比較する代替部品を選択:
XC6SLX75-2FGG484I
✅ ドロップイン✓ 在庫あり
$82.1 / 個
データシートを見る →XC6SLX75-3FG484I
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →XC6SLX75T-2FG484C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX75-2FG484C 最大定格＆電気的特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Internal Frequency | 667 MHz |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| Package Type | 484-BBGA, MS-034 FBGA |
| Package Dimensions | 23 x 23 mm |
| Package Pitch | 1 mm |
| Number of Balls | 484 balls |
| 動作温度 | 0 to 85 C |
| Speed Grade | -2 |
| Temperature Grade | Commercial |
| Process Technology | CMOS |
| 実装タイプ | Surface mount ball grid array |
XC6SLX75-2FG484C 1 mm ピン配置ガイド
XC6SLX75-2FG484C (1 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX75-2FG484C.
詳細は データシート をご参照ください。
主な用途
XC6SLX75-2FG484C の用途: 6 件s: Industrial Automation and PLC Control, Machine Vision and Image Processing, Real-Time Communications and Protocol Handling, Motor Control and Power Systems, Test and Measurement Instrumentation, Embedded Signal Processing.
Industrial Automation and PLC Control
The XC6SLX75-2FG484C fits industrial automation systems that require parallel control logic, machine interfaces, and deterministic sequencing in one programmable device. Its 74,637 logic cells and 5,831 CLBs provide room for state machines, interlocks, counters, protocol engines, and diagnostic logic without splitting a control design across several smaller devices. The 484-ball package supports a high pin count, while the 0 to 85 C commercial range suits many factory environments when enclosure temperature is controlled. A production design should still validate power rails, clocking, I/O standards, EMC, long-term sourcing, and environmental requirements.
おすすめ
Machine Vision and Image Processing
The XC6SLX75-2FG484C is suitable for machine-vision front ends where sensor timing, pixel-stream formatting, thresholding, and control logic require high parallelism. The device’s 5,831 CLBs and 74,637 logic cells can accommodate multiple pipeline stages and real-time decision paths, while the 484-ball package offers extensive I/O connectivity for cameras, transceivers, and memory interfaces. The 667 MHz internal-frequency specification is a device identifier, not a guaranteed end-to-end image throughput. Designers must constrain external memory timing, I/O standards, clock jitter, sensor latency, and thermal performance in the FPGA timing analysis.
おすすめ
Real-Time Communications and Protocol Handling
The XC6SLX75-2FG484C can implement parallel protocol engines, packet classifiers, Ethernet or serial-interface bridging, and test-and-measurement logic in a programmable FPGA. Its large CLB count supports simultaneous transmit, receive, buffering, and error-handling paths, while the 484-ball package provides room for external transceivers and memory. Designers should use the exact Spartan-6 LX device documentation to confirm supported interfaces, I/O standards, block RAM, and clock resources. System performance depends on transceiver selection, reference clocks, protocol timing, signal integrity, and timing closure rather than the internal-frequency label alone.
おすすめ
Motor Control and Power Systems
The XC6SLX75-2FG484C is useful for digital motor-control, inverter-control, and embedded power-system logic where PWM generation, current sampling, fault handling, and supervisory sequencing must run concurrently. Its programmable architecture allows control loops and protection logic to be combined with communication interfaces, while the large package can expose multiple control and measurement signals. The device is not a power semiconductor, so external gate drivers, isolation, current sensors, and protection hardware remain necessary. Validate timing margins, ADC synchronization, fault response, thermal conditions, and safety requirements in the complete system.
おすすめ
Test and Measurement Instrumentation
The XC6SLX75-2FG484C supports programmable timing, data capture, trigger logic, and parallel interface handling for test and measurement equipment. The 74,637-cell Spartan-6 LX device can implement acquisition pipelines, pattern generation, calibration logic, and control functions in parallel, while its 484-ball package supports substantial external connectivity. The 667 MHz figure should be treated as a device specification rather than a guaranteed acquisition rate. Designers must account for converter latency, clock jitter, memory bandwidth, I/O voltage, calibration, thermal drift, and the need for repeatable timing across operating conditions.
おすすめ
Embedded Signal Processing
The XC6SLX75-2FG484C can implement fixed-function signal-processing pipelines, filters, correlation, modulation, and digital control blocks when a programmable FPGA is preferred over dedicated hardware. Its 5,831 CLBs and 74,637 logic cells allow parallel datapaths and buffering, while the 484-ball package supports external converters and memory. The available verified data does not quantify block RAM, DSP slices, or user I/O, so resource-fit analysis must be performed in the selected AMD design environment. System engineers should also budget logic for interfaces, clocking, diagnostics, and timing constraints.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX75-2FG484C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX75-2FGG484I | XC6SLX75-3FG484I | XC6SLX75T-2FG484C |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 484-BBGA, 23 x 23 mm, 1 mm pitch | 484-BBGA | 484-BBGA | 484-BBGA |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX T variant |
| Speed Grade | -2 | -2 | -3 | -2 |
| Number of Balls | 484 | 484 | 484 | 484 |
主な差別化要因
- Identified 667 MHz -2 device specification （vs XC6SLX75-3FG484I)
- Commercial-temperature target is explicitly identified （vs XC6SLX75-2FGG484I)
- Large logic capacity in a single 484-ball package （vs XC6SLX75-3FG484I)
- Commercial sourcing visibility （vs XC6SLX75-3FG484I)
設計ノート
Treat the XC6SLX75-2FG484C as a 484-ball, 1 mm-pitch BGA and design the PCB escape network before placing the FPGA. Use the AMD Spartan-6 package pinout files to assign power, ground, configuration, clock, and user I/O balls. Confirm the stack-up and assembly process, then provide controlled fanout vias, low-impedance power distribution, local decoupling, and a ground strategy that supports both signal return paths and thermal dissipation. Validate escape-routing manufacturability with the board fabricator before release.
The FPGA’s 23 x 23 mm FBGA package can concentrate heat around the device, especially when the design uses high I/O activity, external memory, or sustained parallel processing. Place thermal vias and copper planes under and around the BGA where the package and assembly process permit, while preserving electrical isolation from sensitive signals. Calculate worst-case junction temperature from actual FPGA activity, ambient temperature, airflow, copper area, and package thermal data; do not assume that the commercial 0 to 85 C ambient rating alone guarantees safe internal operation.
The 667 MHz internal-frequency figure is not a substitute for interface timing analysis. Constrain clock, memory, serial, and parallel I/O paths using the actual board topology, transceiver characteristics, reference planes, and termination strategy. For high-speed external interfaces, verify package escape loss, via transitions, return-path continuity, skew, crosstalk, and connector or transceiver limits. Use the AMD timing constraints and signal-integrity workflow appropriate to the Spartan-6 LX device before release.
A same-package alternative is not automatically a drop-in replacement. Compare the exact MPN suffix, speed grade, temperature grade, configuration pins, electrical limits, package ballout, software device support, and lifecycle or sourcing status. In particular, XC6SLX75-2FGG484I and XC6SLX75-3FG484I may differ in suffix-related operating or timing requirements. Perform schematic, pinout, timing, and system-level regression review even when the package name appears identical.
コンプライアンス情報
The supplied verified data does not explicitly state RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification status for XC6SLX75-2FG484C. These fields remain unknown rather than being inferred from the FPGA category or manufacturer.
