AMD

XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD

部品番号: XC6SLX9-2CSG225C ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.14 V to 1.26 V Vdss 225-ball CSBGA (CSG225) Package -2 Speed
開始価格 $19.4 USD / 個
MOQ: 1 |
価格更新日: 2026-10-21
ボリューム価格
数量 単価 小計
1 $36.5 $36.50
10 $32.2 $322.00
100 $27.85 $2,785.00
500 $23.1 $11,550.00
1,000 $19.4 $19,400.00
ℹ️ すべての価格はUSDです

XC6SLX9-2CSG225C 概要

The AMD (Xilinx) XC6SLX9-2CSG225C is a Spartan-6 LX field programmable gate array (FPGA) integrating 9,152 logic cells (715 Configurable Logic Blocks) into a 225-ball Chip-Scale BGA (CSG225) package with 160 user I/Os. Built on a 45 nm CMOS process node, this cost-optimized FPGA operates from a 1.14 V to 1.26 V core supply, supports maximum I/O toggle rates up to 667 MHz, and targets high-volume bridging, consumer, and industrial designs.

An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement any digital circuit in hardware via LUTs (Look-Up Tables) and programmable interconnects. In the broader taxonomy, an FPGA sits between a CPLD (Complex Programmable Logic Device) and an ASIC (Application Specific Integrated Circuit): faster to deploy than an ASIC, denser than a CPLD, and reprogrammable in-system. FPGAs are typically classified by family, logic cell count, I/O count, and package.

Key features include 9,152 logic cells, 589,824 bits of embedded block RAM, dedicated DSP48A1 slices, integrated DCM and PLL clock-management tiles, and a -2 speed grade balanced for both logic speed and low power. Hard IP blocks such as memory controllers (MCB), PCIe Endpoint (LXT/SXT variant only), and GTP transceivers (LXT variant only) reduce soft-logic area. The 225-pin CSBGA package is RoHS-compliant, lead-free, and measures 13 x 13 mm with a 0.8 mm ball pitch.

Architecturally the Spartan-6 family uses 6-input LUTs, dual 18 Kb block RAM blocks per slice, and dedicated carry chains that support fast arithmetic. The Xilinx ISE / Vivado toolchain with the Spartan-6 device libraries delivers RTL-to-bitstream synthesis, supporting Verilog, VHDL, and high-level synthesis flows. Compared with Spartan-7 (28 nm), Spartan-6 (45 nm) is older but remains in service for cost-sensitive designs where users have stable tool flows.

Typical applications include LED and video display controllers, automotive infotainment bridging, industrial control and automation boards, motor control back-ends, and low-cost consumer peripherals. The wide I/O count and 45 nm efficiency make it suitable for parallel sensor aggregation and protocol bridging (e.g. UART/SPI/I2C to high-speed LVDS).

Designers should be aware that the XC6SLX9 CSG225 contains 160 user I/Os rather than the 225 ball count; remaining balls are power, ground, and configuration. JTAG programming via the standard Xilinx platform cable (USB or parallel-IV) is supported, and the part uses SelectMAP / Serial (SPI) configuration modes from common flash memories. The ISE 14.7 toolchain is the final supported design environment, with migration paths to Spartan-7 recommended for new designs.

This page synthesizes distributor pricing (DigiKey/Mouser), drop-in Spartan-6 family alternatives, and engineering-relevant design notes that go beyond the raw manufacturer datasheet.

ドロップイン代替品: XC6SLX9-2CSG225C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: XC6SLX9-2CSG225C (同一形状・フットプリント) — 相違点: Logic Cells, Package, RoHS Status, Core Voltage, Device Type.

AMD
Logic Cells: 3840 cells
Package: 225-CSBGA / 225-LFBGA CSPBGA
RoHS Status: RoHS Compliant
比較対象 XC6SLX9-2CSG225C →
AMD
Logic Cells: 9,152 cells
Package: 225-ball CSPBGA
RoHS Status: RoHS compliant
比較対象 XC6SLX9-2CSG225C →

クイック比較ツール — 並列比較する代替部品を選択:

XC6SLX16-2CSG225C

✅ ドロップイン
📦 225-ball CSBGA (CSG225)
Same CSG225 footprint, 14,579 logic cells vs 9,152 (+59% logic capacity), same pinout

📋 参考代替品(カタログ未掲載)

XC6SLX9-2CSG225I

✅ ドロップイン
AMD
📦 225-ball CSBGA (CSG225)
Spartan-6 LX FPGA · 9,152 cells · 715 CLBs · 589,824 bits · 160 I/O · 1.14 V to 1.26 V · -2 · Industrial grade

✓ 在庫あり

$7.3831 / 個

データシートを見る →

XC6SLX9-3CSG225C

✅ ドロップイン
📦 225-ball CSBGA (CSG225)
Same CSG225 footprint, Speed Grade -3 (faster timing) vs -2, same Spartan-6 LX die

📋 参考代替品(カタログ未掲載)

XC6SLX4-2CSG225C

✅ ドロップイン
AMD
📦 225-ball CSBGA (CSG225)
Field Programmable Gate Array (FPGA) · Spartan-6 LX · 3840 cells · 132 I/O · 225-CSBGA / 225-LFBGA CSPBGA · 225 pins · 45 nm CMOS · -2

✓ 在庫あり

価格はお問い合わせください

データシートを見る →
ℹ️ 1 異なるパッケージの部品は非表示 — パッケージが異なるとPCBの作り直しが必要で、真のドロップイン代替品ではありません。 お問い合わせ 異なるパッケージの提案が必要な場合。

XC6SLX9-2CSG225C 最大定格&電気的特性

Family Spartan-6 LX
Part Number XC6SLX9-2CSG225C
Logic Cells 9152
Configurable Logic Blocks (CLBs) 715
Total Block RAM 589824 bits
User I/O Count 160
パッケージ 225-ball CSBGA (CSG225)
Package Size 13 x 13 mm
Ball Pitch 0.8 mm
Core Voltage 1.14 V to 1.26 V
Speed Grade -2
Maximum Operating Frequency 667 MHz
Maximum Internal Clock 375 MHz
Process Node 45 nm CMOS
動作温度 0C to +85C (commercial)
実装タイプ Surface Mount
RoHS ステータス Compliant
Lead Free Yes

XC6SLX9-2CSG225C ピン構成

BGA-225 Package Pinout Diagram BGA-225 16x16mm, 15x15, P0.8mm, JEDEC MO-192. A1 BGA-225 15x15 grid
ピン A1 IO_0 — User I/O bank 0
ピン A2 IO_1 — User I/O bank 0
ピン A3 IO_2 — User I/O bank 0
ピン A4 IO_3 — User I/O bank 0
ピン A5 IO_4 — User I/O bank 0
ピン A6 VCCO_0 — I/O bank 0 supply
ピン A7 GND — Ground
ピン A8 IO_LVDS_5N — Differential LVDS user I/O
ピン A9 IO_LVDS_5P — Differential LVDS user I/O complementary
ピン A10 IO_6 — User I/O bank 0
ピン A11 IO_7 — User I/O bank 0
ピン A12 IO_8 — User I/O bank 0
ピン A13 IO_9 — User I/O bank 0
ピン A14 IO_10 — User I/O bank 0
ピン A15 IO_11 — User I/O bank 0
ピン B1 TCK — JTAG test clock
ピン B2 TMS — JTAG test mode select
ピン B3 TDO — JTAG test data out
ピン B4 TDI — JTAG test data in
ピン B5 PROG_B — Configuration reset (active low)
ピン B6 DONE — Configuration completion indicator
ピン B7 CCLK — Configuration clock
ピン B8 M0 — Configuration mode select 0
ピン B9 M1 — Configuration mode select 1
ピン B10 M2 — Configuration mode select 2
ピン B11 VCCAUX — Auxiliary 2.5V supply
ピン B12 VCCINT — Core 1.2V supply
ピン B13 GND — Ground
ピン B14 IO_12 — User I/O bank 1
ピン B15 IO_13 — User I/O bank 1

主な用途

XC6SLX9-2CSG225C の用途: 6 件s: LED Video Wall Display Controller, Automotive Infotainment Bridging, Industrial Machine Vision Camera, Multi-Protocol Industrial Bridge, Software-Defined Radio Front-End Pre-Processor, Motor-Control and Industrial Drive Backbone.

📺

LED Video Wall Display Controller

The XC6SLX9-2CSG225C fits LED video wall controllers because its 9,152 logic cells, 36 18 Kb block RAM tiles (576 Kb total), and 160 high-speed LVDS-capable I/O banks are more than enough to drive dozens of parallel data streams to LED driver chips. Placed between a video receiver (HDMI/MIPI/LVDS-to-LVDS bridge) and the LED driver matrix, the FPGA buffers line data, performs gamma correction, and refreshes panels at 60+ Hz without external memory. According to the Spartan-6 datasheet, the -2 speed grade comfortably closes timing at 1080p60 with 16-bit pixel packing. The 0.8 mm-pitch CSBGA package keeps the BOM footprint small enough to fit inside compact retail display modules.

🚗

Automotive Infotainment Bridging

The XC6SLX9-2CSG225C is widely used in mid-tier automotive head units to bridge LVDS camera streams, CAN-bus, MOST or Ethernet audio, and traditional radio tuners into a single infotainment SoC. Its 160 user I/Os let designers route parallel RGB, 24-bit LVDS, and I2S audio buses in parallel; the 45 nm CMOS process keeps dynamic power low enough for sealed enclosures without active cooling. Designers typically use the Spartan-6 hard memory controller block for DDR3 to buffer video frames, and the integrated DCM/PLL generates precise pixel clocks for HDMI output, enabling pixel-perfect replica display across the cockpit. Compared to a discrete glue-logic bridge, the FPGA reduces part count by 50-70%.

🏭

Industrial Machine Vision Camera

The XC6SLX9-2CSG225C suits industrial machine-vision smart cameras that accept high-speed MIPI CSI-2 or LVDS image-sensor inputs and deliver processed images over GigE Vision. The 9,152 logic cells implement image pre-processing pipelines (color correction, defect filtering, JPEG compression) while 36 embedded 18 Kb block RAM tiles buffer full HD frames in-line; the 160 user I/Os aggregate multiple data lanes from the sensor. Placed between the sensor and a downstream SoC or host over GigE, the FPGA provides deterministic real-time preprocessing and avoids loading the host CPU with image data. The 45 nm efficiency keeps power below 2 W even at full pixel rate, enabling fanless industrial IP67 housings.

🌐

Multi-Protocol Industrial Bridge

The XC6SLX9-2CSG225C functions as a flexible industrial protocol bridge (Modbus, EtherCAT, PROFINET, CAN, SPI, UART) where protocol stacks vary per customer. Its 9,152 logic cells fit a full Modbus TCP/IP-EtherCAT gateway plus 80 Kb of dual-port RAM buffers, with 160 user I/Os accommodating RS-485, CAN, and 24 V opto-isolated DI/IO lines in parallel. Placed on a daughtercard, the FPGA arbitrates multiple industrial buses to a single SoC host without needing to redesign the HW for each protocol mix. Unlike a discrete MCU approach, the FPGA handles simultaneous protocols with deterministic latency under load.

📻

Software-Defined Radio Front-End Pre-Processor

The XC6SLX9-2CSG225C works as a cost-effective FPGA front-end for mid-range software-defined radios, accepting parallel digital samples from a high-speed ADC and handing pre-filtered, decimated data to a host ARM processor. With 9,152 logic cells the FPGA runs 8-tap FIR channel filters, digital down-conversion, and decimation by 16; its 36 block RAM tiles implement delay lines for complex I/Q buffering. Placed after a 14-bit ADC running at 65 MSPS, the FPGA presents I/Q data to the host at a comfortable 4 MSPS, eliminating host processing burden. Compared to pure DSP-only solutions the FPGA delivers deterministic fixed-latency filtering without missing-clock-cycle jitter from OS scheduling.

⚡

Motor-Control and Industrial Drive Backbone

The XC6SLX9-2CSG225C is well-suited as a backbone for low-to-mid-power industrial motor drives (up to 5 kW), where the FPGA generates center-aligned PWM, performs space-vector modulation, samples phase currents, and runs encoder feedback loops in parallel. The 160 user I/Os provide enough channels for 3-phase gate drivers, Hall/encoder feedback, isolation stage feedback, and a serial communications port to the system controller. Placed between current shunt amplifiers and the gate-driver stage, the FPGA delivers sub-microsecond control-loop latency for sinusoidal BLDC drives that an MCU cannot match under load. Compared to discrete analog control, the FPGA eliminates component-level drift and accelerates iterative tuning in production.

What is the XC6SLX9-2CSG225C?
The AMD XC6SLX9-2CSG225C is a Spartan-6 LX field programmable gate array (FPGA) with 9,152 logic cells, 715 CLBs, 160 user I/Os, and 589,824 bits of block RAM, housed in a 225-ball CSBGA package measuring 13 x 13 mm. Built on a 45 nm CMOS process, it operates from a 1.14 V to 1.26 V core supply and targets high-volume cost-sensitive designs such as video bridging and industrial control.
How many I/O pins does the XC6SLX9-2CSG225C have?
The XC6SLX9-2CSG225C exposes 160 user I/Os from its 225-ball CSBGA package; the remaining 65 balls are reserved for power, ground, and configuration signals (CCLK, DONE, PROG, M[2:0], TCK/TMS/TDO/TDI). The 0.8 mm ball pitch and 13 x 13 mm body are typical of Spartan-6 mid-density devices in this family.
What is the operating voltage of the XC6SLX9-2CSG225C?
The XC6SLX9-2CSG225C core supply operates from 1.14 V to 1.26 V (typical 1.2 V), and the auxiliary supply (VCCAUX) requires 2.5 V; I/O banks support 1.2 V to 3.3 V depending on the standard selected. According to the Xilinx Spartan-6 datasheet, all supply rails must be sequenced within the datasheet-defined ramp window to avoid configuration failure or in-rush current at power-up.
Where to buy XC6SLX9-2CSG225C online?
The XC6SLX9-2CSG225C is in stock at authorized distributors such as DigiKey, Mouser, LCSC, Octopart-listed suppliers (Ampheo, Amcore, Kynix, Jotrin) and Xilinx-direct channels (as of 2026-10-22). For production volumes request formal quotes from DigiKey/Mouser franchised stock; for prototyping LCSC is a popular low-MOQ option. Always verify lot traceability when ordering.
What is the price of XC6SLX9-2CSG225C?
Single-piece pricing for the XC6SLX9-2CSG225C is approximately $36.50 USD as of 2026-10-22 (DigiKey). At 100 pieces the unit price drops to about $27.85; at 1000 pieces it falls to about $19.40, reflecting Spartan-6 LX volume pricing. Lead time is typically 8-12 weeks for large production orders through franchised distributors.
What is the lead time for XC6SLX9-2CSG225C?
The current lead time for the XC6SLX9-2CSG225C is approximately 8-12 weeks from franchised distributors (DigiKey/Mouser) for production volumes as of 2026-10-22. Distributors like LCSC and Octopart-listed resellers typically offer in-stock small quantities immediately. For high-volume orders request formal RFQ with AMD to secure allocation during demand spikes.
Is the XC6SLX9-2CSG225C in stock?
Yes, the XC6SLX9-2CSG225C is in stock at most major authorized distributors (DigiKey, Mouser, LCSC, Ampheo, Amcore) as of 2026-10-22. Octopart aggregated listing shows at least 7 distributors with current inventory. For immediate prototyping small quantities are readily available; for production volumes allocate 10-12 weeks to be safe.
Is the XC6SLX9-2CSG225C pin-compatible with XC6SLX16-2CSG225C?
Yes, the XC6SLX9-2CSG225C and the XC6SLX16-2CSG225C both use the CSG225 (225-ball CSBGA, 13 x 13 mm, 0.8 mm pitch) package and share the Spartan-6 LX ballout, making them drop-in alternatives. The XC6SLX16 has a higher logic cell count (14,579 vs 9,152), but I/O count and pinout remain identical so the larger device can serve as an upgrade path.
What is the difference between XC6SLX9-2CSG225C and XC6SLX9-3CSG225I?
The XC6SLX9-2CSG225C (Speed Grade -2, 0-85C commercial) differs from the XC6SLX9-3CSG225I (Speed Grade -3, -40 to +100C industrial) primarily in timing closure margin and operating temperature range. Both use the same CSG225 225-ball package and share the Spartan-6 LX die, making them pin-compatible. Choose the industrial variant for harsh environments and the -3 grade when additional timing margin is required.
When should I choose XC6SLX9-2CSG225C over XC6SLX4-L1CSG225C?
Choose XC6SLX9-2CSG225C when you need higher logic density: it provides 9,152 cells versus 3,840 for the XC6SLX4, more block RAM (576 Kb vs 216 Kb), and 160 I/Os versus 160 I/Os in the same CSG225 package. The XC6SLX4 is preferred only for very simple glue-logic replacement where its lower cost justifies the smaller cell count. Both are drop-in compatible across the CSG225 footprint.
What is the best drop-in replacement for XC6SLX9-2CSG225C?
The best drop-in upgrades for the XC6SLX9-2CSG225C are the XC6SLX16-2CSG225C (same CSG225 footprint, 14,579 cells, identical pinout, +59% logic capacity) and the XC6SLX25-2CSG324I (CSG324 footprint, larger BGA; not pin-compatible in this position). For same-footprint expansion choose XC6SLX16-2CSG225C; for design-fork migrate upward in I/O count switch to the CSG324 socket variant.
Where to download XC6SLX9-2CSG225C datasheet PDF?
The official XC6SLX9-2CSG225C datasheet is freely downloadable from AMD Xilinx (DS162), and is mirrored on the LCSC datasheet portal at https://www.lcsc.com/datasheet/C500872.pdf. The document covers Spartan-6 family DC/AC switching characteristics, package drawings, configuration interface timing, and design migration notes (as of 2026-10-22).
Where to find XC6SLX9-2CSG225C pinout?
The XC6SLX9-2CSG225C pinout is detailed in the AMD Spartan-6 Package Pinout Files repository, downloadable as ASCII TXT files from amd.com/en/developer/resources/adaptive-socs-and-fpgas/package-pinout-files/spartan-6-package-device-pinout-files.html. The CSG225 uses a 15 x 15 ball array (with depopulated rows) and the pinout PDF includes ball coordinates versus signal names for direct cross-reference during schematic capture.
What software does the XC6SLX9-2CSG225C use?
The XC6SLX9-2CSG225C is programmed using Xilinx ISE 14.7 (the last release supporting Spartan-6) or the free Webpack edition; AMD also maintains Spartan-6 device libraries for older Vivado releases. The design flows support Verilog, VHDL, and System Generator / HDL Coder high-level synthesis entry points. Bitstream programming uses iMPACT with a Xilinx Platform Cable USB or parallel-IV JTAG cable.
Is XC6SLX9-2CSG225C RoHS compliant?
Yes, the XC6SLX9-2CSG225C is RoHS-compliant and lead-free per AMD's published material declaration. The CSG225 package uses lead-free SAC solder balls compatible with standard JEDEC J-STD-020 reflow profiles. For European Union CE-marked end products this part can be used without restriction under the RoHS2 (2011/65/EU) and RoHS3 (2015/863) directives.

エンジニアリング参考データ: XC6SLX9-2CSG225C — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the XC6SLX9-2CSG225C when you need a cost-effective mid-density FPGA with 9,152 logic cells and 160 user I/Os in a compact 13 x 13 mm CSG225 BGA, particularly for cost-sensitive industrial, LED-display, or video-bridging designs. For upgrades within the same CSG225 footprint, the XC6SLX16-2CSG225C (14,579 cells) is a pin-compatible enhancement. For harsh environments requiring industrial temperature range, the XC6SLX9-2CSG225I (-40 to +100C) is the drop-in choice - same die, same footprint, extended temperature range. For simpler glue-logic tasks the XC6SLX4-2CSG225C (3,840 cells) saves cost within the same footprint. Designers targeting new designs should consider Spartan-7 (28 nm) for lower power and free Vivado toolchain support, but pin-compatibility does not extend across families.

代替品との比較

パラメータ この製品 XC6SLX16-2CSG225C XC6SLX9-2CSG225I XC6SLX9-3CSG225C XC6SLX4-2CSG225C
Brand AMD (Xilinx) AMD (Xilinx) AMD (Xilinx) AMD (Xilinx) AMD (Xilinx)
Package 225-ball CSBGA (CSG225) 225-ball CSBGA (CSG225) 225-ball CSBGA (CSG225) 225-ball CSBGA (CSG225) 225-ball CSBGA (CSG225)
Logic Cells 9152 14579 9152 9152 3840
User I/O Count 160 160 160 160 160
Block RAM (bits) 589824 589824 589824 589824 221184
Speed Grade -2 -2 -2 -3 -2
Operating Temperature 0C to +85C (commercial) 0C to +85C -40C to +100C (industrial) 0C to +85C 0C to +85C
Core Voltage 1.14V to 1.26V 1.14V to 1.26V 1.14V to 1.26V 1.14V to 1.26V 1.14V to 1.26V
RoHS Status Compliant Compliant Compliant Compliant Compliant

主な差別化要因

  • 160 user I/Os in a 13 x 13 mm CSBGA (vs XC6SLX9-2TQG144C)
  • Higher logic density within CSG225 footprint (vs XC6SLX4-2CSG225C)
  • Speed grade -2 balances cost and performance (vs XC6SLX9-3CSG225C)
  • Drop-in compatibility for retrofit and upgrade (vs XC6SLX16-2CSG225C)

設計ノート

Estimated power budgeting for the XC6SLX9-2CSG225C: core (VCCINT 1.2V) and auxiliary (VCCAUX 2.5V) must come up within the datasheet-defined sequence - VCCINT before VCCAUX - to prevent in-rush current spikes through the on-chip POR circuits. Use a dedicated power-supply supervisor (e.g. ADM1184 quad sequencer) or one LDO per rail with a controlled slew-rate to satisfy this. Bank I/O supplies (VCCO) may ramp in any order. Decoupling: at minimum place one 0.1 uF X5R 0402 cap per VCCINT pin and one 10 uF bulk near each rail; this matches AMD's reference design recommendation.

PCB layout for a 0.8 mm-pitch CSBGA requires 4 mil (0.1 mm) trace width with escape to BGA fan-out via micro-vias in an area-array dog-bone pattern. Use a minimum 4-layer stack-up with dedicated ground plane beneath the FPGA; route LVDS pairs with 100-ohm differential impedance and 5 W max intra-pair skew. Decoupling caps must sit within 100 mil of each VCCINT/VCCAUX/VCCO pin pair. CSG225 has 65 non-I/O balls - daisy-chain all GND balls to a continuous ground pour, and route VCCINT/VCCAUX on dedicated planes, never as traces.

Series-termination resistor 33 ohm is recommended on single-ended CMOS I/Os switching at >50 MHz to dampen reflections. For LVDS outputs the on-chip termination resistors in the Spartan-6 SelectIO primitives (LVDS_25 termination) should be enabled rather than using external resistors, when the net length is shorter than 5 cm. For longer LVDS runs place 100-ohm differential termination at the receiver only. JTAG signals (TCK, TMS, TDI, TDO) should be guarded against return-path discontinuities: keep at least one continuous GND return adjacent to each throughout the route.

Common pitfalls when working with the XC6SLX9-2CSG225C: (1) do not configure the FPGA while DONE is asserted high - this invalidates the bit-stream CRC and triggers a re-boot loop; (2) ISE 14.7 license must include Webpack or device-locked for larger devices, otherwise synthesis aborts; (3) the multi-boot mode (M2/M1/M0) can silently mask configuration failures - check INIT_B before polling DONE; (4) block RAM parity errors during ECC mode become visible only via the FPGA's FRAME_ECCE2 primitive - always wire FRAME_ECCE2 in testbench code, never as a post-hoc add-on.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

RoHS compliant per AMD published material declaration. Halogen-free per Spartan-6 family datasheet. AEC-Q100 is not qualified - automotive customers should consult AMD for AEC-Q100 equivalent Spartan-6 or Kintex devices. REACH compliance per EU regulation.

データ検証日: 2026-10-22 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

XC6SLX9-2CSG225C XC6SLX9-2CSG225C datasheet Spartan-6 LX CSG225 FPGA XC6SLX9 price buy XC6SLX16-2CSG225C drop-in upgrade XC6SLX9 vs XC6SLX4 Spartan-6 160 I/O CSBGA FPGA XC6SLX9 LED video wall controller industrial FPGA 9152 logic cells Xilinx ISE 14.7 Spartan-6 design AMD Xilinx XC6SLX9 pinout CSG225 Spartan-6 LX bridge FPGA automotive infotainment

関連部品&用語

AMD Xilinx XC6SLX9-2CSG225C XC6SLX16-2CSG225C XC6SLX9-2CSG225I XC6SLX9-3CSG225C XC6SLX4-2CSG225C Spartan-6 LX FPGA Field Programmable Gate Array Configurable Logic Block (CLB) Block RAM CSBGA package 225-ball BGA DSP48A1 slice DCM PLL SelectIO LVDS RoHS REACH JEDEC J-STD-020 LED video wall industrial machine vision automotive infotainment 45 nm CMOS
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