XCKU040-2FFVA1156I - Kintex UltraScale FPGA 520 I/O | AMD
部品番号: XCKU040-2FFVA1156I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $147.38 | $147.38 |
| 10 | $140.01 | $1,400.10 |
| 100 | $132.65 | $13,265.00 |
| 500 | $126.01 | $63,005.00 |
| 1,000 | $119.71 | $119,710.00 |
XCKU040-2FFVA1156I 概要
A Field Programmable Gate Array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), DSP slices, block RAM, and programmable interconnect that designers configure after manufacturing. Within the power-management hierarchy of digital system ICs, an FPGA sits at the top of the programmable logic taxonomy: programmable logic device (PLD) -> FPGA -> system-on-chip FPGA. FPGAs are used where custom logic, parallelism, or post-deployment reconfigurability is required that fixed-function ASICs or microcontrollers cannot provide.
Key features of the XCKU040-2FFVA1156I include the 20nm UltraScale architecture, which lowers total power consumption versus the previous 28nm 7-series generation, a -2 speed grade for high-performance designs, and an industrial (I-suffix) temperature rating of -40C to +100C. The 1156-ball flip-chip BGA provides 520 user I/O for high-bandwidth parallel interfaces, and the fabric includes MMCM and PLL clock management resources.
On the technical side, the Kintex UltraScale family focuses on price/performance using monolithic 20nm die. The device core supply operates from 0.922V to 0.979V per the datasheet listing. The UltraScale architecture adds enhanced routing, higher DSP throughput, and improved clocking compared to Kintex-7, making the XCKU040 a popular mid-density choice between the XCKU035 and XCKU060.
Typical applications include industrial image processing and machine vision, wireless baseband and RF front-end processing, medical ultrasound, and ASIC prototyping. The 520 I/O count suits multi-camera sensor aggregation and high-width data converters.
Design consideration: FCBGA-1156 devices require careful PCB stackup design - escape routing under the 1.0mm ball pitch typically needs via-in-pad or at least 8 layers, and core voltage rails must meet the tight 0.922-0.979V tolerance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: XCKU040-2FFVA1156I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
XCKU040-2FFVA1156I4530
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCKU040-1FFVA1156C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCKU035-1FFVA1156C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCKU060-2FFVA1156E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCKU040-2FFVA1156I 最大定格＆電気的特性
| Family | Kintex UltraScale |
| Manufacturer | AMD (formerly Xilinx) |
| Logic Capacity (System Logic Cells) | 21606000 |
| Resource Units (DigiKey listing) | 530250 |
| User I/O | 520 |
| Speed Grade | -2 |
| パッケージ | 1156-BBGA, FCBGA |
| Ball Count | 1156 |
| Supply Voltage (VCCINT) | 0.922 V to 0.979 V |
| 動作温度 | -40C to +100C |
| Temperature Grade | Industrial (I) |
| Process Node | 20 nm |
| Clock Management | MMCM, PLL |
| 実装タイプ | Surface Mount |
| Architecture | Xilinx UltraScale |
XCKU040-2FFVA1156I 1156-bbga, fcbga ピン配置ガイド
XCKU040-2FFVA1156I (1156-bbga, fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XCKU040-2FFVA1156I.
詳細は データシート をご参照ください。
主な用途
XCKU040-2FFVA1156I の用途: 6 件s: Industrial Machine Vision, Wireless Baseband Processing, Medical Ultrasound Beamforming, ASIC Prototyping and Emulation, Aerospace and Defense Signal Processing, Video Broadcast and 8K Transport.
Industrial Machine Vision
The XCKU040-2FFVA1156I fits industrial machine vision because its 520 user I/O can aggregate four to eight MIPI/CMOS image sensor banks directly, while the 20nm Kintex UltraScale fabric provides the DSP throughput for real-time ISP pipelines such as HDR merge, lens-shading correction, and 4K defect inspection at line rates exceeding 60 fps. In a typical topology, each camera link feeds an I/O bank, image processing runs as a pipelined datapath in DSP48E2 slices, and results stream out over PCIe or 10G Ethernet. The industrial -40C to +100C rating matches factory-floor enclosures, and the deterministic parallel pipeline avoids the latency jitter of GPU-based inspection, a quantified benefit for sync-triggered quality gates.
おすすめ
Wireless Baseband Processing
The XCKU040-2FFVA1156I suits wireless baseband because the UltraScale DSP48E2 fabric delivers the multiply-accumulate density needed for LTE/5G channel estimation, FFT/IFFT, and digital up/down conversion, while MMCM and PLL resources generate the low-jitter clocks that radio chains require. The 520 user I/O supports wide parallel JESD204B data converters; a 16-lane JESD204B front end at 12.5 Gbps per lane consumes only part of the fabric budget, leaving headroom for the DPD/CFR engines. Compared with a smaller XCKU035, the XCKU040's extra fabric absorbs multi-carrier wideband designs without exceeding 80% utilization, preserving routability and timing closure at the -2 speed grade.
おすすめ
Medical Ultrasound Beamforming
The XCKU040-2FFVA1156I is a strong fit for medical ultrasound receive beamforming: its 520 I/O can connect directly to multi-channel AFE front ends, and the UltraScale fabric implements per-channel delay lines, apodization, and summing at sample rates of 40-65 MHz across 64-128 channels in parallel. The -2 speed grade supports the tight arithmetic timing of coherent beamforming at clock rates above 200 MHz, and the 21,606,000-cell fabric leaves room for TGC control, harmonic imaging, and Doppler processing on the same die. The industrial temperature rating covers the demanding thermal environment inside ultrasound probes carts, and deterministic latency simplifies regulatory validation compared with GPU implementations.
おすすめ
ASIC Prototyping and Emulation
The XCKU040-2FFVA1156I serves ASIC prototyping because its 20nm UltraScale fabric can hold multi-million-gate RTL designs at clock rates of 20-50 MHz, fast enough to boot embedded software during verification. A multi-FPGA prototyping board typically partitions the DUT across several XCKU040 devices, using the 520 user I/O per device for the high-pin-count partition interconnect. The Kintex UltraScale price/performance positioning makes a four-FPGA prototyping platform materially cheaper than Virtex UltraScale equivalents while retaining -2 speed performance. Designers should budget 60% device utilization per FPGA to leave routing headroom for partition bridges and clocking logic.
おすすめ
Aerospace and Defense Signal Processing
The XCKU040-2FFVA1156I fits defense radar and electronic warfare subsystems that demand industrial-temperature, high-throughput processing without full space qualification. The 20nm UltraScale DSP fabric implements FIR filter banks, FFT engines, and CFAR detectors for pulse compression at sustained rates in the tens of GMACs, while the 520 I/O supports wide parallel LVDS data capture from ADC banks. The -2 speed grade enables closed-loop timing for 500 MHz+ DSP clock domains, and the FCBGA package thermal performance supports conduction-cooled card designs per typical VPX architectures. Compared with re-spinning an ASIC, the FPGA allows in-field waveform reprogramming - a decisive advantage in EW applications.
おすすめ
Video Broadcast and 8K Transport
The XCKU040-2FFVA1156I handles 8K/60 and multi-channel 4K video transport because its fabric and I/O density support multiple HDMI 2.0 or SDI receive paths, frame buffers in block RAM and external DDR4, plus HEVC-aware preprocessing blocks in parallel. The 520 user I/O terminate several SDI channels simultaneously (each 12G-SDI uses a transceiver plus LVDS sideband), and MMCM resources generate the pixel-clock family for mixed-frame-rate switching. Broadcast equipment benefits from the industrial -40C to +100C rating in OB-van and rack environments, and the deterministic low-latency fabric path (single-digit line times) outperforms software codecs for live contribution links.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XCKU040-2FFVA1156I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XCKU040-2FFVA1156I4530 | XCKU040-1FFVA1156C | XCKU035-1FFVA1156C | XCKU060-2FFVA1156E |
|---|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Speed Grade | -2 | -2 | -1 | -1 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Extended |
| Logic Density | XCKU040 (21,606,000 system logic cells) | XCKU040 - same | XCKU040 - same | XCKU035 - smaller (~13% less) | XCKU060 - larger |
| Core Supply (VCCINT) | 0.922 V to 0.979 V | 0.922 V to 0.979 V | 0.922 V to 0.979 V | 0.922 V to 0.979 V | 0.922 V to 0.979 V |
| Architecture | Kintex UltraScale (20 nm) | Kintex UltraScale (20 nm) | Kintex UltraScale (20 nm) | Kintex UltraScale (20 nm) | Kintex UltraScale (20 nm) |
主な差別化要因
- Industrial temperature rating （vs XCKU040-1FFVA1156C)
- Faster -2 speed grade （vs XCKU035-1FFVA1156C)
- Cost-efficient mid-density position （vs XCKU060-2FFVA1156E)
- Trade-off: smaller fabric than XCKU060 （vs XCKU060-2FFVA1156E)
設計ノート
The XCKU040-2FFVA1156I requires a core rail of 0.922V to 0.979V - a window of roughly +/-3 percent around 0.95V including load transients and ripple. Size the VCCINT buck converter using the AMD Xilinx Power Estimator (XPE) output for your actual utilization and toggle rates, then add 30-50 percent margin on the inductor saturation current. Sequence power rails per the UltraScale datasheet power-up requirements (core before or with auxiliary and I/O rails) and implement PGood-chained enable or a dedicated sequencer IC to avoid latch-up or excess inrush during configuration.
A 1156-ball FCBGA at 1.0mm pitch needs at least 8 PCB layers with dedicated VCCINT, VCCAUX, and VCCO planes. Escape the inner balls with via-in-pad (filled and capped) or dog-bone fanout, and reserve blind/buried vias for the densest banks. Follow the UltraScale PCB design guide (UG583) for ball-map breakout and stackup guidance. Allocate one solid plane per major power rail and stitch it with many vias to control rail impedance - the tight 0.922-0.979V core tolerance is difficult to hold over a high-impedance plane.
Bitstreams are not portable between XCKU035, XCKU040, and XCKU060 even though they share the A1156 footprint - a pin-compatible swap still requires recompiling the design in Vivado for the target device and re-verifying timing at the relevant speed grade. Additionally, a design timed at -2 will not meet timing on -1 parts, and commercial-grade (C) parts must not be used where the enclosure can exceed 85C ambient. Download the official AMD package pinout CSV files for this package instead of transcribing the ball map manually.
Estimated: with typical mid-density utilization the XCKU040 can dissipate 5-15W depending on clock rates and I/O activity. Use the XPE tool to obtain your actual estimate, then verify the junction stays within -40C to +100C with your heatsink and airflow. For a 10W dissipation with a theta_JA of about 10 C/W under a good heatsink, junction rise is roughly 100C - near the limit at 25C ambient and unacceptable at elevated ambient, so airflow design is not optional in sealed industrial enclosures.
コンプライアンス情報
Exact RoHS/REACH/lead-free declarations for this ordering code must be verified on the DigiKey or Mouser compliance tab for the exact MPN; the provided web data did not include compliance statements.