XCKU040-2FFVA1156I - Kintex UltraScale FPGA 520 I/O | AMD
부품 번호: XCKU040-2FFVA1156I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $147.38 | $147.38 |
| 10 | $140.01 | $1,400.10 |
| 100 | $132.65 | $13,265.00 |
| 500 | $126.01 | $63,005.00 |
| 1,000 | $119.71 | $119,710.00 |
XCKU040-2FFVA1156I 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), DSP slices, block RAM, and programmable interconnect that designers configure after manufacturing. Within the power-management hierarchy of digital system ICs, an FPGA sits at the top of the programmable logic taxonomy: programmable logic device (PLD) -> FPGA -> system-on-chip FPGA. FPGAs are used where custom logic, parallelism, or post-deployment reconfigurability is required that fixed-function ASICs or microcontrollers cannot provide.
Key features of the XCKU040-2FFVA1156I include the 20nm UltraScale architecture, which lowers total power consumption versus the previous 28nm 7-series generation, a -2 speed grade for high-performance designs, and an industrial (I-suffix) temperature rating of -40C to +100C. The 1156-ball flip-chip BGA provides 520 user I/O for high-bandwidth parallel interfaces, and the fabric includes MMCM and PLL clock management resources.
On the technical side, the Kintex UltraScale family focuses on price/performance using monolithic 20nm die. The device core supply operates from 0.922V to 0.979V per the datasheet listing. The UltraScale architecture adds enhanced routing, higher DSP throughput, and improved clocking compared to Kintex-7, making the XCKU040 a popular mid-density choice between the XCKU035 and XCKU060.
Typical applications include industrial image processing and machine vision, wireless baseband and RF front-end processing, medical ultrasound, and ASIC prototyping. The 520 I/O count suits multi-camera sensor aggregation and high-width data converters.
Design consideration: FCBGA-1156 devices require careful PCB stackup design - escape routing under the 1.0mm ball pitch typically needs via-in-pad or at least 8 layers, and core voltage rails must meet the tight 0.922-0.979V tolerance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: XCKU040-2FFVA1156I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XCKU040-2FFVA1156I4530
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU040-1FFVA1156C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU035-1FFVA1156C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU060-2FFVA1156E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU040-2FFVA1156I 최대 정격 & 전기적 특성
| Family | Kintex UltraScale |
| Manufacturer | AMD (formerly Xilinx) |
| Logic Capacity (System Logic Cells) | 21606000 |
| Resource Units (DigiKey listing) | 530250 |
| User I/O | 520 |
| Speed Grade | -2 |
| 패키지 | 1156-BBGA, FCBGA |
| Ball Count | 1156 |
| Supply Voltage (VCCINT) | 0.922 V to 0.979 V |
| 동작 온도 | -40C to +100C |
| Temperature Grade | Industrial (I) |
| Process Node | 20 nm |
| Clock Management | MMCM, PLL |
| 실장 유형 | Surface Mount |
| Architecture | Xilinx UltraScale |
XCKU040-2FFVA1156I 1156-bbga, fcbga 핀 구성 가이드
XCKU040-2FFVA1156I(1156-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XCKU040-2FFVA1156I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XCKU040-2FFVA1156I 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Wireless Baseband Processing, Medical Ultrasound Beamforming, ASIC Prototyping and Emulation, Aerospace and Defense Signal Processing, Video Broadcast and 8K Transport.
Industrial Machine Vision
The XCKU040-2FFVA1156I fits industrial machine vision because its 520 user I/O can aggregate four to eight MIPI/CMOS image sensor banks directly, while the 20nm Kintex UltraScale fabric provides the DSP throughput for real-time ISP pipelines such as HDR merge, lens-shading correction, and 4K defect inspection at line rates exceeding 60 fps. In a typical topology, each camera link feeds an I/O bank, image processing runs as a pipelined datapath in DSP48E2 slices, and results stream out over PCIe or 10G Ethernet. The industrial -40C to +100C rating matches factory-floor enclosures, and the deterministic parallel pipeline avoids the latency jitter of GPU-based inspection, a quantified benefit for sync-triggered quality gates.
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Wireless Baseband Processing
The XCKU040-2FFVA1156I suits wireless baseband because the UltraScale DSP48E2 fabric delivers the multiply-accumulate density needed for LTE/5G channel estimation, FFT/IFFT, and digital up/down conversion, while MMCM and PLL resources generate the low-jitter clocks that radio chains require. The 520 user I/O supports wide parallel JESD204B data converters; a 16-lane JESD204B front end at 12.5 Gbps per lane consumes only part of the fabric budget, leaving headroom for the DPD/CFR engines. Compared with a smaller XCKU035, the XCKU040's extra fabric absorbs multi-carrier wideband designs without exceeding 80% utilization, preserving routability and timing closure at the -2 speed grade.
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Medical Ultrasound Beamforming
The XCKU040-2FFVA1156I is a strong fit for medical ultrasound receive beamforming: its 520 I/O can connect directly to multi-channel AFE front ends, and the UltraScale fabric implements per-channel delay lines, apodization, and summing at sample rates of 40-65 MHz across 64-128 channels in parallel. The -2 speed grade supports the tight arithmetic timing of coherent beamforming at clock rates above 200 MHz, and the 21,606,000-cell fabric leaves room for TGC control, harmonic imaging, and Doppler processing on the same die. The industrial temperature rating covers the demanding thermal environment inside ultrasound probes carts, and deterministic latency simplifies regulatory validation compared with GPU implementations.
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ASIC Prototyping and Emulation
The XCKU040-2FFVA1156I serves ASIC prototyping because its 20nm UltraScale fabric can hold multi-million-gate RTL designs at clock rates of 20-50 MHz, fast enough to boot embedded software during verification. A multi-FPGA prototyping board typically partitions the DUT across several XCKU040 devices, using the 520 user I/O per device for the high-pin-count partition interconnect. The Kintex UltraScale price/performance positioning makes a four-FPGA prototyping platform materially cheaper than Virtex UltraScale equivalents while retaining -2 speed performance. Designers should budget 60% device utilization per FPGA to leave routing headroom for partition bridges and clocking logic.
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Aerospace and Defense Signal Processing
The XCKU040-2FFVA1156I fits defense radar and electronic warfare subsystems that demand industrial-temperature, high-throughput processing without full space qualification. The 20nm UltraScale DSP fabric implements FIR filter banks, FFT engines, and CFAR detectors for pulse compression at sustained rates in the tens of GMACs, while the 520 I/O supports wide parallel LVDS data capture from ADC banks. The -2 speed grade enables closed-loop timing for 500 MHz+ DSP clock domains, and the FCBGA package thermal performance supports conduction-cooled card designs per typical VPX architectures. Compared with re-spinning an ASIC, the FPGA allows in-field waveform reprogramming - a decisive advantage in EW applications.
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Video Broadcast and 8K Transport
The XCKU040-2FFVA1156I handles 8K/60 and multi-channel 4K video transport because its fabric and I/O density support multiple HDMI 2.0 or SDI receive paths, frame buffers in block RAM and external DDR4, plus HEVC-aware preprocessing blocks in parallel. The 520 user I/O terminate several SDI channels simultaneously (each 12G-SDI uses a transceiver plus LVDS sideband), and MMCM resources generate the pixel-clock family for mixed-frame-rate switching. Broadcast equipment benefits from the industrial -40C to +100C rating in OB-van and rack environments, and the deterministic low-latency fabric path (single-digit line times) outperforms software codecs for live contribution links.
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추천 제품 요약
엔지니어링 참조 데이터: XCKU040-2FFVA1156I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCKU040-2FFVA1156I4530 | XCKU040-1FFVA1156C | XCKU035-1FFVA1156C | XCKU060-2FFVA1156E |
|---|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Speed Grade | -2 | -2 | -1 | -1 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Extended |
| Logic Density | XCKU040 (21,606,000 system logic cells) | XCKU040 - same | XCKU040 - same | XCKU035 - smaller (~13% less) | XCKU060 - larger |
| Core Supply (VCCINT) | 0.922 V to 0.979 V | 0.922 V to 0.979 V | 0.922 V to 0.979 V | 0.922 V to 0.979 V | 0.922 V to 0.979 V |
| Architecture | Kintex UltraScale (20 nm) | Kintex UltraScale (20 nm) | Kintex UltraScale (20 nm) | Kintex UltraScale (20 nm) | Kintex UltraScale (20 nm) |
주요 차별점
- Industrial temperature rating (vs XCKU040-1FFVA1156C)
- Faster -2 speed grade (vs XCKU035-1FFVA1156C)
- Cost-efficient mid-density position (vs XCKU060-2FFVA1156E)
- Trade-off: smaller fabric than XCKU060 (vs XCKU060-2FFVA1156E)
설계 노트
The XCKU040-2FFVA1156I requires a core rail of 0.922V to 0.979V - a window of roughly +/-3 percent around 0.95V including load transients and ripple. Size the VCCINT buck converter using the AMD Xilinx Power Estimator (XPE) output for your actual utilization and toggle rates, then add 30-50 percent margin on the inductor saturation current. Sequence power rails per the UltraScale datasheet power-up requirements (core before or with auxiliary and I/O rails) and implement PGood-chained enable or a dedicated sequencer IC to avoid latch-up or excess inrush during configuration.
A 1156-ball FCBGA at 1.0mm pitch needs at least 8 PCB layers with dedicated VCCINT, VCCAUX, and VCCO planes. Escape the inner balls with via-in-pad (filled and capped) or dog-bone fanout, and reserve blind/buried vias for the densest banks. Follow the UltraScale PCB design guide (UG583) for ball-map breakout and stackup guidance. Allocate one solid plane per major power rail and stitch it with many vias to control rail impedance - the tight 0.922-0.979V core tolerance is difficult to hold over a high-impedance plane.
Bitstreams are not portable between XCKU035, XCKU040, and XCKU060 even though they share the A1156 footprint - a pin-compatible swap still requires recompiling the design in Vivado for the target device and re-verifying timing at the relevant speed grade. Additionally, a design timed at -2 will not meet timing on -1 parts, and commercial-grade (C) parts must not be used where the enclosure can exceed 85C ambient. Download the official AMD package pinout CSV files for this package instead of transcribing the ball map manually.
Estimated: with typical mid-density utilization the XCKU040 can dissipate 5-15W depending on clock rates and I/O activity. Use the XPE tool to obtain your actual estimate, then verify the junction stays within -40C to +100C with your heatsink and airflow. For a 10W dissipation with a theta_JA of about 10 C/W under a good heatsink, junction rise is roughly 100C - near the limit at 25C ambient and unacceptable at elevated ambient, so airflow design is not optional in sealed industrial enclosures.
규정 준수 정보
Exact RoHS/REACH/lead-free declarations for this ordering code must be verified on the DigiKey or Mouser compliance tab for the exact MPN; the provided web data did not include compliance statements.