XCKU3P-1SFVB784I - 256-I/O Kintex UltraScale+ FPGA | AMD
部品番号: XCKU3P-1SFVB784I ✓ 生産中XCKU3P-1SFVB784I 概要
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interfaces, and processing blocks are configured after manufacture. An FPGA sits above basic programmable logic and fixed-function microcontrollers in the hardware hierarchy: configuration software creates a dedicated digital circuit from the FPGA’s configurable logic blocks, block RAM, DSP resources, high-speed I/O, and clocking resources. This makes an FPGA suitable when deterministic parallel processing, flexible interfaces, or field-updatable logic are more important than the simplicity of a microcontroller.
The XCKU3P family is positioned for high-end signal-processing and connectivity designs. AMD describes Kintex UltraScale+ devices around a balance of performance, power, memory-interface capability, high-speed connectivity, and cost efficiency. The catalog listing for XCKU3P-1SFVB784I identifies 256 I/O and the 784-BFBGA FCBGA package. Exact logic-cell, memory, transceiver, speed-grade, and electrical details must be confirmed against the device-specific AMD documentation before final design release.
The “1” ordering suffix identifies the performance class used for this ordering code, while “SFVB784” identifies the package configuration. The final “I” denotes the industrial-temperature ordering option. Package construction is important for this device because a 784-ball FCBGA requires controlled board assembly, a multilayer PCB, appropriate via and escape routing, and careful power-delivery design to support the FPGA’s high pin count and performance requirements.
Typical uses include industrial control and automation, high-speed data acquisition, communications infrastructure, instrumentation, embedded processing, and prototyping systems requiring programmable logic. The 256-I/O interface supports external memory, transceivers, clocks, and application-specific peripherals when the selected device resources and speed grades support those interfaces.
Designers should preserve the exact SFVB784 footprint, verify every power rail and decoupling requirement in the AMD pinout and package documentation, and confirm that the selected configuration scheme matches the board’s boot architecture. Device migration also requires checking logical-cell usage, RAM, DSP, transceiver resources, pin constraints, timing closure, and the exact I/O standard rather than relying only on package similarity.
This product record combines the exact XCKU3P-1SFVB784I catalog identity, package and I/O information, available manufacturer resources, same-family drop-in candidates, and practical implementation guidance. It is intended to accelerate engineering evaluation while keeping footprint, configuration, thermal, and signal-integrity verification tied to the official AMD documentation.
ドロップイン代替品: XCKU3P-1SFVB784I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XCKU3P-1SFVB784I （同一形状・フットプリント） — 相違点: Package, Package Type, Temperature Grade, Speed Grade, Device Family.
XCKU3P-L1SFVB784I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCKU3P-L2SFVB784E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCKU3P-1SFVB784E
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →XCKU3P-2SFVB784I
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →XCKU3P-2SFVB784E
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →XCKU3P-1SFVB784I 最大定格＆電気的特性
| Product Type | Kintex UltraScale+ FPGA |
| Device Family | XCKU3P |
| Product Type | Field-programmable gate array (FPGA) |
| I/O Count | 256 I/O |
| Package Type | 784-ball FCBGA |
| Package Designation | 784-BFBGA |
| 実装タイプ | Surface mount |
| Ordering Suffix | 1SFVB784I |
| Performance Grade | 1 |
| Temperature Grade | Industrial (I) |
XCKU3P-1SFVB784I 784-bfbga ピン配置ガイド
XCKU3P-1SFVB784I (784-bfbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XCKU3P-1SFVB784I.
詳細は データシート をご参照ください。
主な用途
XCKU3P-1SFVB784I の用途: 6 件s: Industrial Automation and Control, High-Speed Data Acquisition, Communications Infrastructure, Embedded Test and Measurement, Video and Imaging Systems, Aerospace and Defense Prototyping.
Industrial Automation and Control
The XCKU3P-1SFVB784I fits high-end industrial automation controllers that combine deterministic parallel logic with numerous field-bus, sensor, actuator, and communication interfaces. Its 256 I/O provide a substantial external connectivity footprint, while the Kintex UltraScale+ architecture supports the programmable logic, memory, DSP, and high-speed I/O resources needed for complex control functions. The industrial ordering suffix makes the part a logical starting point for factory equipment, but the design must verify the exact operating-temperature limits, supported I/O standards, power rails, and reliability requirements. Configuration should use the AMD device, package, and reference-design guidance for the SFVB784 footprint.
おすすめ
High-Speed Data Acquisition
XCKU3P-1SFVB784I is appropriate for parallel data-acquisition systems that must ingest multiple channels, perform real-time filtering, and transfer processed results through high-speed interfaces. The 256-I/O count supports dense connections to converters, memory devices, clocks, and custom peripherals, while the Kintex UltraScale+ device family provides configurable logic, block memory, and DSP resources for acquisition pipelines. Engineers should map every signal to the SFVB784 package file and confirm that the selected I/O standards, timing classes, voltage levels, and board channel lengths are supported. Power integrity and return-path planning are especially important because wide parallel buses can amplify skew, crosstalk, and simultaneous-switching noise.
おすすめ
Communications Infrastructure
The XCKU3P-1SFVB784I can serve as the programmable fabric in communications equipment requiring high-throughput logic, flexible interfaces, and scalable digital processing. AMD positions Kintex UltraScale+ devices for high-end connectivity and memory-interface workloads, making the family relevant to protocol conversion, packet processing, clocking, and interface aggregation systems. The 784-BFBGA package provides many physical balls for high-speed routing and power delivery, but it also requires a sophisticated multilayer PCB and disciplined signal-integrity design. The final implementation should confirm transceiver or I/O availability, supported line rates, reference-clock requirements, configuration mode, and thermal performance against the exact device data.
おすすめ
Embedded Test and Measurement
XCKU3P-1SFVB784I fits modular instrumentation and automated test equipment that combine acquisition, pattern generation, timing control, analysis, and communications in one programmable platform. Its 256 I/O allow dense connections to converters, counters, relays, memories, and external clock sources, while the XCKU3P architecture allows the digital measurement path to be adapted after manufacture. Using the manufacturer’s package and reference-design guidance reduces risk in a 784-ball FCBGA design with many simultaneous switching nets. Before hardware release, validate timing margins, I/O voltage standards, pin constraints, configuration storage, synchronization architecture, and resource utilization for the intended test sequence.
おすすめ
Video and Imaging Systems
The XCKU3P-1SFVB784I is suitable for image-processing and video systems requiring parallel pixel data handling, configurable logic, DSP capability, and high-speed external connectivity. The 256-I/O device can support camera or sensor interfaces, line buffers, memory interfaces, and downstream processing when the selected UltraScale+ resources meet the throughput target. A 784-ball FCBGA also enables dense routing among memory, logic, and I/O, although careful via planning and return-path continuity are essential. Engineers should determine whether dedicated hardware blocks or general I/O are appropriate, confirm supported video-interface IP through AMD tools, and complete timing, power, thermal, and PCB signal-integrity analysis before production.
おすすめ
Aerospace and Defense Prototyping
XCKU3P-1SFVB784I can support advanced programmable-logic prototypes in aerospace, defense, and space systems that need configurable digital processing, extensive I/O, and long-lived program flexibility. The Kintex UltraScale+ architecture is suitable for signal generation, telemetry processing, control logic, and data-routing functions when its exact resources and environmental ratings satisfy the mission profile. The SFVB784 package places the design on a high-density board platform, requiring approved assembly processes, controlled materials, and detailed thermal verification. Before adoption, check the precise temperature range, screening options, radiation-related requirements, export controls, documentation, configuration security, and lifecycle expectations directly with AMD.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XCKU3P-1SFVB784I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XCKU3P-L1SFVB784I | XCKU3P-L2SFVB784E | XCKU3P-1SFVB784E | XCKU3P-2SFVB784I | XCKU3P-2SFVB784E |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 784-BFBGA FCBGA | 784-BFBGA FCBGA - same package | 784-BFBGA FCBGA - same package | 784-BFBGA FCBGA - same package | 784-BFBGA FCBGA - same package | 784-BFBGA FCBGA - same package |
| Device Family | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P |
| Performance Ordering Grade | 1 | L1 | L2 | 1 | 2 | 2 |
| Temperature Suffix | I | I | E | E | I | E |
主な差別化要因
- Exact target ordering configuration （vs XCKU3P-L1SFVB784I)
- Industrial temperature suffix retained （vs XCKU3P-1SFVB784E)
- Performance-grade ordering continuity （vs XCKU3P-2SFVB784I)
- Same-package XCKU3P migration path （vs XCKU3P-L2SFVB784E)
設計ノート
Design the SFVB784 footprint directly from AMD’s official package files and reference schematics. A 784-ball FCBGA demands a multilayer PCB, short power-plane connections, dense via escaping, and carefully controlled solder-mask and land geometry. Do not infer pad locations from another BGA package: even when the ball count is similar, package families can use different ball maps and keep-out regions.
Use the device-specific power-decoupling and plane-connection instructions rather than generic BGA practice. Separate noisy, sensitive, and general-purpose supply distributions where the AMD design calls for it, provide local bulk and high-frequency decoupling at each supply ball group, and verify voltage sequencing against the configuration method. Power-plane resistance and simultaneous switching current must be checked with the actual board stack-up and device activity profile.
Route the 256 external I/O connections with continuous reference planes and avoid crossing plane splits. Match length where the selected interface requires it, control impedance according to the PCB fabricator, and keep high-speed clocks and data away from noisy power-regulator switching nodes. Because the exact supported I/O standards and timing grades are device-specific, validate every pin and interface through AMD pin constraints and timing analysis.
Thermal design should include the board copper available to the FCBGA, internal plane dissipation, adjacent heat sources, airflow, and the selected SFVB784 package’s specified thermal metrics. The 784-ball package can distribute power across many connections, but actual junction temperature still depends on placement, stack-up, and enclosure conditions. Perform thermal analysis at the highest expected utilization rather than an idle operating condition.
A matching package does not make every ordering code an automatic substitute. Review the complete AMD ordering guide for the 1, 2, L1, I, and E segments, then verify device resources, speed, temperature, power, configuration, and lifecycle status. Also check whether a design utilizes package balls differently in different XCKU3P options; this can alter routing requirements even when the mechanical footprint is shared.
コンプライアンス情報
The device is associated with the AMD Kintex UltraScale+ product family. No component-level RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement was identified in the catalog records, so each status remains unknown.
